RLC2VE Module Datasheet

RLC2VE is a low power-consuming built-in Wi-Fi module developed by Hangzhou Tuya Inc.

Product overview

RLC2VE consists of a highly integrated RF microchip (RTL8710BX) and an external flash chip, with a built-in Wi-Fi network protocol stack and robust library functions. RLC2VE also contains a low power-consuming ARM CM4F, a WLAN MAC, a 1T1R WLAN, and the maximum basic frequency of 62.5 MHz, and is embedded with a 256 KB SRAM, a 2 MB flash, and rich peripheral resources.

RLC2VE is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop built-in Wi-Fi products as required.

Features

• Built-in low power-consuming 32-bit CPU functioning as an application processor
• Basic frequency: 62.5 MHz
• Working voltage: 5 V to 38 V
• Peripherals: Five GPIOs
• Wi-Fi connectivity
  • 802.11b/g/n20/n40
  • Channels 1 to 14 at 2.4 GHz
  • WPA/WPA2 security mode
  • +20 dBm output power in 802.11b mode
  • Smart network configuration function (for Android and iOS devices)
  • Onboard PCB antenna and the antenna gain is 2.5dBi
  • Working temperature: -20°C to +105°C

Applications

• Intelligent building
• Smart home and household appliances
• Healthcare
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change history

Date	Change Description	Version After Change
2019-01-07	This is the first release.	V2.0.0

Module Interfaces

Dimensions and Footprint

RLC2VE has two rows of pins (2 x 4) with a 2 mm pin pitch.
Dimensions (H x W x D) of RLC2VE are as follows: 26±0.35 mm (W) × 20±0.35 mm (L) × 2.4±0.15 mm PCB thickness is 0.8mm±0.1 mm,Figure as below :
the dimensions of RLC2VE.

Interface pin definition

Pin No.	Symbol	I/O Type	Function
1	GPIOA_22	I/O	GPIOA_22, Hardware PWM (IC Pin31)
2	GND	P	Power supply reference ground pin
3	VIN	P	Module power supply pin
4	3.3V	P	Module power output is 3.3V
5	GPIOA_12	I/O	GPIOA_12, Hardware PWM (IC Pin17)
6	GPIOA_5	I/O	GPIOA_5, Hardware PWM (IC Pin28)
7	GPIOA_14	I/O	GPIOA_14, Hardware PWM (IC Pin13)
8	GPIOA_15	I/O	GPIOA_15, Hardware PWM (IC Pin14)

Note: P indicates power-supply pins, I/O indicates input/output pins

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum Value	Maximum Value	Unit
Ts	Storage temperature	-40	125	°C
VCC	Power supply voltage	-0.3	40	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Electrical conditions

Parameter	Description	Minimum Value	Typical Value	Maximum Value	Unit
Ta	Working temperature	-20	N/A	105	°C
VCC	Power supply voltage	5	N/A	38	V
VIL	I/O low-level input	-0.3	N/A	0.8	V
VIH	I/Ohigh-level input	2.47	N/A	3.6	V
VOL	I/O low-level output	N/A	N/A	0.34	V
VoH	I/O high-level output	2.64	N/A	3.4	V
Imax	I/O drive current	N/A	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

Note: The minimum operating voltage is set to 16V by default. If you need to change it, please specify it in the order

Continuous TX power dissipation

Working Status	Mode	Rate	TX Power	Typical Value	Unit
TX	11b	11Mbps	+17dBm	287	mA
TX	11b	11Mbps	+18dBm	295	mA
TX	11g	54Mbps	+15dBm	255	mA
TX	11g	54Mbps	+17.5dBm	267	mA
TX	11n BW20	MCS7	+13dBm	244	mA
TX	11n BW20	MCS7	+16.5dBm	257	mA
TX	11n BW40	MCS7	+13dBm	220	mA
TX	11n BW40	MCS7	+16.5dBm	230	mA

Continuous RX power dissipation

Working Status	Mode	Rate	Receiving	Typical Value	Unit
RX	CPU Sleep	11Mbps	Continuous RX	90	mA
RX	CPU Active	MCS7 BW20	Continuous RX	120	mA

Working current

Working Mode	Working Status (Ta = 25°C)	Average Value	Peak Value*(Typical Value)	Unit
Quick configuration	Module in quick net-pairing state	115	125	mA
Network connection idle	Module connected to network	60	209	mA
Network connection active	Module connected to network	118	198	mA
Disconnected	Module not connected to network	34	192	mA

Note: The preceding parameter values vary depending on the firmware functions.

RF features

Basic RF features

Parameter	Description
Frequency band	2.412 GHz to 2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate	11b:1,2,5.5, 11 (Mbps); 11g:6,9,12,18,24,36,48,54(Mbps); 11n: HT20 MCS0~7; 11n: HT40 MCS0~7
Antenna type	PCB On Board antenna

TX performance

Parameter	Minimum Value	Typical Value	Maximum Value	Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s	N/A	17.5	N/A	dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s	N/A	14.5	N/A	dBm
Average RF output power, 802.11n OFDM mode MCS7	N/A	13.5	N/A	dBm
Frequency error	-20	N/A	+20	ppm

RX performance

Parameter	Minimum Value	Typical Value	Maximum Value	Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s	N/A	-91	N/A	dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s	N/A	-75	N/A	dBm
PER < 10%, 802.11n OFDM mode MCS7	N/A	-72	N/A	dBm

Antenna

Antenna type

RLC2VE only supports onboard PCB antenna

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

PCB Size: 26±0.35 mm (L) × 20±0.35 mm (W) × 1.0±0.1 mm (H).

Needle arrangement specification

Production instructions

1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.

   • SMT placement equipment
     • Reflow soldering machine
     • Automated optical inspection (AOI) equipment
     • Nozzle with a 6 mm to 8 mm diameter
   • Baking equipment
     • Cabinet oven
     • Anti-static heat-resistant trays
     • Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

   • The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%.
   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
   • The package contains a humidity indicator card (HIC).
     

3. Bake a module based on HIC status as follows when you unpack the module package:

   • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
   • If the 30% circle is pink, bake the module for 4 consecutive hours.
   • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
   • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings:

   • Baking temperature: 125±5°C
   • Alarm temperature: 130°C
   • SMT placement ready temperature after natural cooling: < 36°C
   • Number of drying times: 1
   • Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended oven temperature curve

Please refer to the recommended furnace temperature setting for the wave peak welding furnace. The peak temperature is 260℃±5℃. The curve of wave peak welding temperature is shown in the figure below:

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	Modules per reel	Packaging reels per box
RLC2VE	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-RDLC5. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-RDLC5”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.