TYLC8 Module Datasheet

TYLC8 is a low-power embedded Wi-Fi module developed by Tuya. It consists of a highly integrated wireless radio frequency chip, ESP8285, and a few peripheral devices. It also has a built-in Wi-Fi network protocol stack and abundant library functions.

Overview

TYLC8 embeds a low-power 32-bit CPU, 1Mbyte of flash memory, 50KB of SRAM, and a wealth of peripheral resources.

As an RTOS platform, TYLC8 integrates all the function libraries of the Wi-Fi MAC and the TCP/IP protocol. Based on these function libraries, users can develop different embedded Wi-Fi products to meet their own needs.

Features

• The built-in low-power 32-bit CPU doubles as an application processor.
• The basic frequency of the CPU supports 80MHz and 160MHz.
• Working voltage: 3.0V-3.6V
• Peripheral：3×GPIOs
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channel：1-14@2.4GHz
  • Supporting the security mode of WPA/WPA2
  • Under the mode of 802.11b, the maximum output power: +20dBm
  • Supporting the operating mode of STA/AP/STA+AP
  • Supporting both Smart Config and AP network distribution methods (including Android and IOS devices)
  • Soldering internal Ceramic antenna, gain 2.5dBi
  • Operating temperature: -20 ℃ to 105 ℃

Applications

• Intelligent building
• Smart home or home appliances
• Smart socket and smart LED
• Industrial wireless control
• Baby monitor
• Webcam
• Smart bus

Module interfaces

Dimensions and footprint

TYLC8 has 2 lines of pins with a spacing of 2 mm.

The TYLC8 dimensions are 16.5±0.35 mm (W) x 11±0.35 mm (L) x 1.8±0.15 mm (H). The PCB thickness is 1 mm.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	GPIO14	I/O	Use as GPIO, which is connected to MTMS (pin 9) on the internal
2	VCC	P	Power input pin 3.3 V
3	GPIO12	I/O	Use as GPIO, which is connected to MTDI (pin10) on the internal
4	GND	P	Power supply reference ground pin
5	GPIO13	I/O	Use as GPIO, which is connected to MTCK (pin12) on the internal

Note:

• “P” represents the power pin,
• “I/O” represents the input and output pin.

Definition of the test points

Pin No.	Symbol	I/O type	Function
-	TP1	I/O	GPIO2, use to check log
-	TP 2	I/O	GPIO0;Testing the module production.
-	TP3	RST	Hardware reset pin; Cannot clear the distribution network information of Wi-Fi.
-	TP4	U0TXD	User serial port; Information output from the serial port can be used for testing the module production.
-	TP5	U0RXD	User serial port; Information output from the serial port can be used for testing the module production.

Note:

• Test points are not recommended to use.
• RST just for reset，cannot clear the distribution network information of Wi-Fi
• U0TXD as user Serial port will print information when the module power on，users can ignore

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min	Max	Unit
Ts	Storage temperature	-40	125	℃
VCC	Supply voltage	-0.3	3.6	V
ESD voltage（Human body model）	TAMB-25℃	-	2	KV
ESD voltage（Machine model）	TAMB-25℃	-	0.5	KV

Operating conditions

Parameter	Description	Min	Typical	Max	Unit
Ta	Operating temperature	-20	-	105	℃
VCC	Operating voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	VCC	V
VOL	I/O low-level input	-	-	VCC*0.1	V
VOH	I/O high-level input	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

RF power consumption

Working status	Mode	Rate	Transmit power/Receive	Average value (Typical value)	Unit
Tx	11b	11Mbps	+17dBm	220	mA
Tx	11g	54Mbps	+15dBm	110	mA
Tx	11n	MCS0	+14dBm	120	mA
Tx	11n	MCS7	+13dBm	100	mA
RX	802.11b	11 Mbit/s	Constant receiving	76	mA
RX	802.11g	54 Mbit/s	Constant receiving	76	mA
RX	802.11n	MCS7	Constant receiving	76	mA

Working current

Working mode	Working state, Ta=25℃	Average	Max	Unit
Easy mode	Wi-Fi indicator flashes quickly.	80	151	mA
Hotspot mode	Wi-Fi indicator flashes slowly.	90	451	mA
Connected	Wi-Fi indicator is always on.	58.5	411	mA
Disconnected	Wi-Fi indicator is always off.	80	430	mA

RF features

Basic RF features

Parameter	Description
Working frequency	2.412~2.484GHz
Wi-Fi standard	IEEE 802.11b/g/n (Channel 1-14)
Rate of data transmission	11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps) 11n: HT20 MCS0-7
Type of antenna	Internal antenna soldered

TX Performance

Parameter	Min	Typical	Max	Unit
Average RF output power, 802.11b CCK Mode 1M	-	20	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	17	-	dBm
Average RF output power, 802.11n OFDM Mode MCS7	-	14	-	dBm
Frequency error	-10	-	10	ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm	-	-16	-	dB
EVM@802.11g OFDM 54Mbps Mode 15.0dBm	-	-30	-	dB
EVM@802.11n OFDM MCS7 Mode 14.0dBm	-	-31	-	dB

RX performance

Parameter	Min	Typical	Max	Unit
PER<8%，RX Sensitivity，802.11b CCK Mode 1M	-	-91	-	dBm
PER<10%，RX Sensitivity，802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%，RX Sensitivity，802.11n OFDM Mode MCS7	-	-72	-	dBm

Antennas

Type of antennas

They are internal antennas soldered to the ANT pad of the module.

Reducing antenna interference

When an external antenna is soldered to the Wi-Fi module, to optimize the Wi-Fi performance, it is recommended that the distance between the antenna part and the other metal parts be at least 10 mm.

Mechanical dimensions

Note: The default dimensional tolerance is ±0.35 mm. If you have any other requirements on key dimensions, you can make them clear in the module datasheet after communication.

Recommended PCB layout

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product number	MOQ (pcs)	Packing method	The number of modules per reel	The number of reels per carton
TYLC8	8800	Tape reel	2200	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead，it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.