WR6-H Module Datasheet

Last Updated on : 2022-08-02 09:53:50download

WR6-H is a low power-consuming built-in Wi-Fi module developed by Hangzhou Tuya Inc. It consists of a highly integrated RF microchip (RTL8710BN) and an external flash chip, with a built-in Wi-Fi network protocol stack and robust library functions.

Overview

WR6 also contains a low power-consuming ARM CM4F, a WLAN MAC, a 1T1R WLAN, and the maximum basic frequency of 125 MHz, and is embedded with a 256 KB SRAM, a 2 MB flash, and rich peripheral resources.

WR6-H is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop built-in Wi-Fi products as required.

Features

  • Built-in low power-consuming 32-bit CPU functioning as an application processor
  • Basic frequency: 125 MHz
  • Operating voltage: 4.5 V to 5.5 V
  • Peripherals: 9 GPIOs, 1 UART, and 1 ADC
  • Wi-Fi connectivity
    • 802.11b/g/n20/n40
    • Channels 1 to 14 at 2.4 GHz
    • WEP/WPA/WPA2/WPA2 PSK (AES) security mode
    • +20 dBm output power in 802.11b mode
    • Smart network configuration function (for Android and iOS devices)
    • Onboard PCB antenna and external antenna connected through the IPEX connector
    • Operating temperature: -20°C to +85°C

Applications

  • Intelligent building
  • Smart home and household appliances
  • Healthcare
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

WR6-H has two rows of pins (2 x 7) with a 2 mm pin pitch.

Dimensions (H x W x D) of WR6-H are as follows: 37.8±0.35 mm (W)×21.7±0.35 mm (L) ×4.8±0.2 mm (H). See the following figure:

WR6-H Module Datasheet

Interface pin definition

Pin No. Symbol I/O type Function
1 A_14 I/O GPIOA_14
2 A_15 I/O GPIOA_15
3 EN I/O External enabled reset pin (active at a low level)
4 A_0 I/O GPIOA_0, which cannot be pulled up during power-on and can be configured after power-on
5 A_12 I/O GPIOA_12
6 ADC AI ADC port, with the maximum output power of 5 V
7 A_5 I/O GPIOA_5
8 3.3V P Module power supply pin (3.3 V)
9 GND P Power supply reference ground pin
10 A_19 I/O GPIOA_19
11 A_22 I/O GPIOA_22
12 Log_Tx I/O UART_Log_TXD (used for printing the module internal information)
13 Log_Rx I/O UART_Log_RXD (used for printing the module internal information)
14 GND P Power supply reference ground pin
15 VIN P External power input (5 V)
16 GND P Power supply reference ground pin
17 RXD1 I/O UART0_RXD (user serial port)
18 TXD1 I/O UART0_TXD (user serial port)

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input
pins.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 125 °C
VCC Power supply voltage -0.3 5 V
Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV
Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV

Electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 N/A 85 °C
VCC Power supply voltage 4.5 5.0 5.5 V
VIL I/O low-level input -0.3 N/A VCC x 0.25 V
VIH I/Ohigh-level input VCC x 0.75 N/A VCC V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VoH I/O high-level output VCC x 0.8 N/A VCC V
Imax I/O drive current N/A - 16 mA
Cpad Input pin capacitance - 2 - pF

Continuous TX power dissipation

Working status Mode Rate TX power Typical value Unit
TX 11b 11Mbps +18dBm 343 -
TX 11b 11Mbps +17dBm 295 -
TX 11g 54Mbps +15dBm 255 -
TX 11g 54Mbps +17.5dBm 267 -
TX 11n BW20 MCS7 +13dBm 244 -
TX 11n BW20 MCS7 +16.5dBm 257 -
TX 11n BW40 MCS7 +13dBm 220 -
TX 11n BW40 MCS7 +16.5dBm 230 -

Continuous RX power dissipation

Working status Mode Rate Receiving Typical value Unit
RX CPU Sleep 11Mbps Continuous RX 90 - mA
RX CPU Active MCS7 BW20 Continuous RX 120 -

Operating current

Working mode Working status (Ta = 25°C) Average value Peak value*(Typical value) Unit
Quick configuration Module in the quick net-pairing state, Wi-Fi indicator blinking 115 310 mA
Network connection idle Module connected to the network, Wi-Fi indicator constantly on 60 295 mA
Network connection active Module connected to the network, Wi-Fi indicator constantly on 118 328 mA
Disconnected Module not connected to the network, Wi-Fi indicator always off 120 320 mA

Note: The preceding parameter values vary depending on the firmware functions.

RF features

Basic RF features

Parameter Description
Frequency band 2.412 GHz to 2.483.5 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps);
11n: HT20 MCS0-7;
Antenna type PCB On Board antenna (default)

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 17.5 N/A dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14.5 N/A dBm
Average RF output power, 802.11n OFDM mode MCS7 N/A 13.5 N/A dBm
Frequency error -20 N/A +20 ppm

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s N/A -91 N/A dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A -76 N/A dBm
PER < 10%, 802.11n OFDM mode MCS7 N/A -73 N/A dBm

Antenna

Antenna type

WR6 supports the onboard PCB antenna and external antenna. By default, the module uses an onboard PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

WR6-H Module Datasheet

WR6-H Module Datasheet

U.FL RF connector

U.FL RF connector parameter as below:

WR6-H Module Datasheet

Packaging information and production instructions

Mechanical dimensions

PCB Size: 21.7±0.35mm (W)×37.8±0.35mm (L) ×1.0±0.15mm (H).
WR6-H Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      WR6-H Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

WR6-H Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WR6-H Module Datasheet

Connection terminal specifications

The connector on the PCB board is JC20-4P, the following figure illustrates the specification:

WR6-H Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method Modules per reel Packaging reels per box
WR6-H 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WR6-H. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WR6-H”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WR6-H Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WR6-H Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.