Last Updated on : 2022-08-02 07:05:40download
WRD2L is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (RDA5981BM), a few peripherals, an embedded Wi-Fi network protocol stack, and varied library functions.
WRD2L has an embedded low-power ARM-CM4 MCU, 2-MB flash memory, 384-KB static random-access memory (SRAM), and rich peripherals.
WRD2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
WRD2L has a row of pins with a 2± 0.1 mm pin spacing.
The WRD2L dimensions are 17.3±0.35 mm (L)×15±0.35 mm (W) ×2.8±0.15 mm (H).
Diagram of dimensions of WRD2L.png
Pin number | Symbol | I/O type | Function |
---|---|---|---|
1 | GPIO25 | I/O | Support hardware PWM and correspond to GPIO 25 (Pin 31) of IC |
2 | GPIO24 | I/O | Support hardware PWM and correspond to GPIO 24 (Pin 32) of IC |
3 | GPIO3 | I/O | Support hardware PWM and correspond to GPIO 03 (Pin 23) of IC |
4 | GPIO23 | I/O | Support hardware PWM and correspond to GPIO 23 (Pin 33) of IC |
5 | GPIO22 | I/O | Support hardware PWM and correspond to GPIO 22 (Pin 34) of IC |
6 | GND | P | Power supply reference ground |
7 | 3V3 | P | Power supply pin (3.3V) |
Note: P indicates power supply pins and I/O indicates input/output pins.
Pin number | Symbol | I/O type | Function |
---|---|---|---|
- | GND | P | Power supply reference ground |
- | RST | I | Hardware reset pin; by default, high level; active low |
- | U_TX | I/O | UART_TX, user-side serial interface |
- | U_RX | I/O | UART_RX, user-side serial interface |
- | L_TX | I/O | LOG TX interface |
- | L_RX | I/O | LOG RX interface |
Note: Test pins are not recommended.
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -40 | 105 | ℃ |
VBAT | Power supply voltage | 3.0 | 3.6 | V |
Static electricity discharge voltage (human body model) | TAMB-25℃ | - | 2 | KV |
Static electricity discharge voltage (machine model) | TAMB-25℃ | - | 0.5 | KV |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Working temperature | -20 | - | 105 | ℃ |
VBAT | Power supply voltage | 3.0 | 3.3 | 3.6 | V |
VIL | IO low-level input | -0.3 | - | VCC*0.25 | V |
VIH | IO high-level input | VCC*0.75 | - | VCC | V |
VOL | IO low-level output | - | - | VCC*0.1 | V |
VOH | IO high-level output | VCC*0.8 | - | VCC | V |
Imax | IO drive current | - | - | 12 | mA |
Working Status | Mode | Rate | Transmit Power/Receive | Average value | Peak value (Typical value)) | Unit |
---|---|---|---|---|---|---|
Transmit | 11 b | 11Mbps | +17 dBm | 200 | 260 | mA |
Transmit | 11 g | 54Mbps | +13.5 dBm | 170 | 215 | mA |
Transmit | 11 n | MCS 7 | +12 dBm | 166 | 200 | mA |
Receive | 11b | 11Mbps | Constantly receive | 65 | 80 | mA |
Receive | 11g | 54Mbps | Constantly receive | 65 | 80 | mA |
Receive | 11n | MCS 7 | Constantly receive | 65 | 80 | mA |
Working Mode | Working Status, Ta = 25°C | Average value | Maximum value (Typical value) | Unit |
---|---|---|---|---|
Quick connection network state | The module is in the fast network connection state and the Wi-Fi indicator always flashes | 80 | 325 | mA |
Hotspot network configuration state | The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly | 80 | 358 | mA |
Network connection idle state | The module is connected to the network and the Wi-Fi indicator is always on | 75 | 245 | mA |
Parameter | Description |
---|---|
Working frequency | 2.412 to 2.484 GHz |
Wi-Fi standard | IEEE 802.11 b/g/n (channels 1 to 14) |
Data transmission rate | 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; HT40 MCS 0 to 7 |
Antenna type | PCB antenna with a gain of 1.0 dBi |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
Average RF output power, 802.11b CCK Mode 11 M | - | 17 | - | dBm |
Average RF output power, 802.11g OFDM Mode 54 M | - | 13.5 | - | dBm |
Average RF output power, 802.11n OFDM Mode MCS 7 | - | 12 | - | dBm |
EVM@802.11b CCK 11 Mbps Mode 16 dBm | - | -23 | - | dB |
EVM@802.11g OFDM 54 Mbps Mode 13.5 dBm | - | -27 | - | dB |
EVM@802.11n OFDM MCS7 Mode 12 dBm | - | -28 | - | dB |
Frequency error | -10 | - | 10 | ppm |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M | - | -83 | - | dBm |
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M | - | -72 | - | dBm |
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 | - | -70 | - | dBm |
WRD2L uses only an onboard PCB antenna.
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area.
The main points of the layout:
Make sure that there is no substrate medium directly below or above the printed antenna.
Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.
The PCB dimensions are 17.3±0.35mm (W)×15±0.35 mm (L) ×2.8±0.15mm (H).
WRD2L can choose SMT or pin header plug-in. The dimensions of the plug-in are as follows:
For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
Baking settings:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Suggestions on oven temperature curve of wave soldering | Suggestions on manual soldering temperature | ||
---|---|---|---|
Preheat temperature | 80 to 130 °C | Soldering temperature | 360±20°C |
Preheat time | 75 to 100s | Soldering time | <3s/point |
Peak contact time | 3 to 5s | NA | NA |
Temperature of tin cylinder | 260±5°C | NA | NA |
Ramp-up slope | ≤2°C/s | NA | NA |
Ramp-down slope | ≤6°C/s | NA | NA |
Product number | MOQ (pcs | Shipping packaging method | The number of modules per reel | The number of reels per carton |
---|---|---|---|---|
WRD2L | 4000 | Tape reel | 1000 | 4 |
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-WRD2L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WRD2L”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
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