WRD8P Module Datasheet

Last Updated on : 2021-06-09 04:13:30download

WRD8P is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RDA5981BM) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.

Product overview

WRD8P is embedded with a low-power Arm Cortex-M4 CPU, 2 MB flash memory, and 448 KB static
random-access memory (SRAM), and has extensive peripherals.

WRD8P is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power CPU, which can also function as an application processor
  • Dominant frequency: up to 160 MHz
  • Working voltage: 3.3 V to 4.2 V
  • Peripherals: 5×GPIOs, 1×UART, 1×ADC
  • Wi-Fi connectivity
    • 802.11b/g/n HT20
    • Channels 1 to 14 at 2.4 GHz
    • WPA, WPA2, WEP, and TKIP security modes
    • Up to +18 dBm output power in 802.11b mode
    • STA, AP, and STA+AP working modes
    • Smart and AP network configuration modes for Android and iOS devices
    • Onboard PCB antenna, gain 1.0dBi
    • Working temperature: -40°C to +105°C

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

No. Date Change Description Version After Change
1 2019-8-20 This is the first release. 1.0.0
2 2019-09-16 Update datasheet format 2.0.1

Module interfaces

Dimensions and footprint

​ WRD8P has one row of pins with the pin pitch being 1.27mm.
The WRD8P dimensions (W x L x H) are 16mm±0.35mmx24.8±0.35mm×3.5±0.15mm,the PCB thickness is 1.2±0.1 mm and pad spacing is 1.27mm.

WRD8P Module Datasheet

Interface Pin Definition

Pin No. Symbol I/O Type Function
1 3V3 P Power supply pin
2 GND P Power supply reference ground pin
3 GPIO23 I/O GPIO_23, a standard PWM pin, which is connected to GPIO23 (pin 33) on the internal IC
4 GPIO22 I/O GPIO_22, a standard PWM pin, which is connected to GPIO22 (pin 34) on the internal IC
5 GPIO24 I/O GPIO_24, a standard PWM pin, which is connected to GPIO24 (pin 32) on the internal IC
6 GPIO3 I/O GPIO_3, a standard PWM pin, which is connected to GPIO3 (pin 23) on the internal IC
7 GPIO25 I/O GPIO_25, a standard PWM pin, which is connected to GPIO25 (pin 31) on the internal IC
8 ADC AI ADC pin(1), which is connected to GPADC0 on the internal IC
9 TX O UART_TX, which is connected to GPIO26 (pin 24) on the internal IC
10 RX I UART_RX, which is connected to GPIO27 (pin 16) on the internal IC

Note:

  • “P” represents the power pin,
  • “I/O” represents the input and output pin.

Test point definition

Pin No. Symbol I/O Type Function
- TEST I/O Used for the module production test

Note: Test pins cannot be used.

Electrical parameters

Absolute electrical parameters

Parameter Description Min Max Unit
Ts Storage temperature -40 125
VBAT Supply voltage 3.3 4.2 V
Electrostatic discharge voltage (Human body model) TAMB-25℃ - 2 KV
Electrostatic discharge voltage (Machine model) TAMB-25℃ - 0.5 KV

Operating Conditions

Parameter Description Min Typical Max Unit
Ta Operating temperature -40 - 105
VBAT Operating voltage 3.0 3.3 3.6 V
VIL IO low-level input 0 - VCC*0.3 V
VIH IO high-level input VCC*0.75 - VCC V
VOL IO low-level input - - VCC*0.1 V
VoH IO high-level input VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

RF Current Consumption

Symbol Mode Rate Transmit power / Receiving Average Typical Unit
Tx 11b 11Mbps +16dBm 280 354 mA
Tx 11g 54Mbps +13.5dBm 250 300 mA
Tx 11n MCS7 +12dBm 190 290 mA
RX 802.11b 11 Mbit/s Constant receiving 80 100 mA
RX 802.11g 54 Mbit/s Constant receiving 80 100 mA
RX 802.11n MCS7 Constant receiving 80 100 mA

Working Current

Working Mode Working State,Ta=25℃ Average Max Unit
Easy mode Wi-Fi indicator flashes quickly. 70 100 mA
Hotspot mode Wi-Fi indicator flashes slowly. 80 125 mA
Network connection Wi-Fi indicator is always on. 70 120 mA
Network disconnection Wi-Fi indicator is always off. 40 88 mA

RF Features

Basic RF Features

Parameter Description
Working frequency 2.412~2.484GHz
Wi-Fi standard IEEE 802.11b/g/n(Channel 1-14)
Rate of data transmission 11b:1,2,5.5, 11 (Mbps)
11g:6,9,12,18,24,36,48,54(Mbps)
11n:HT20 MCS0~7
Type of antenna PCB onboard antenna, gain 1 dBi

TX Performance

Parameter Min Typical Max Unit
Average output power of RF, 802.11b CCK Mode 11M - 16 - dBm
Average output power of RF,802.11g OFDM Mode 54M - 13.5 - dBm
Average output power of RF,802.11n OFDM Mode MCS7 - 12 - dBm
Frequency error - -20 - 20 ppm

RX Performance

Parameter Min Typical Max Unit
PER<8%, RX Sensitivity, 802.11b CCK Mode 11M - -84 - dBm
PER<10%, RX Sensitivity, 802.11g OFDM Mode 54M - -72 - dBm
PER<10%, RX Sensitivity, 802.11n OFDM Mode MCS7 - -69 - dBm

Information of Antennas

Type of Antennas

WRD8P uses an onboard PCB antenna(default way).

Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance.

Mechanical Dimensions

WRD8P Module Datasheet

Recommended PCB Layout

WRD8P Module Datasheet

WRD8P Module Datasheet

Production instructions

  • The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT equipment:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Oven temperature tester
      • Automated optical inspection (AOI) equipment
    • Baking equipment:
      • Cabinet oven
      • Anti-static heat-resistant pallets
      • Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      WRD8P Module Datasheet
  • The module needs to be baked in the following cases:

    • Vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
    • Time: 48 hours for reelizing and 12 hours for palletizing
    • Alarm temperature: 65°C for reelizing and 135°C for palletizing
    • Production ready temperature after natural cooling: < 36°C
    • The number of drying times: 1
    • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

      Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

WRD8P Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WRD8P Module Datasheet

Storage conditions

WRD8P Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method Modules per reel (pcs) Packaging reels per box (reels)
WRD8P 3600 Carrier tape and reel packing 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WRD8P. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WRD8P”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WRD8P Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WRD8P Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.