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WB3S-IPEX Module Datasheet

Last Updated on : 2020-09-09 09:17:11download

Product overview

WB3S-IPEX is an embedded low-power Wi-Fi+BLE module that Tuya has developed. It consists of a highly integrated wireless RF chip (BK7231T), a few peripherals, an embedded Wi-Fi network protocol stack and varied library functions. With the maximum CPU clock rate of 120 MHz, WB3S-IPEX further contains a low-power 32-bit MCU, a 1T1R WLAN module, 256-KB static random-access memory (SRAM), 2-MB flash memory, and rich extensive peripherals.

WB3S-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • Main clock rate: 120 MHz
  • Peripherals: 9 general-purpose input/output (GPIO), 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC)
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 Ghz
    • Support WEP,WPA/WPA2,WPA/WPA2 PSK (AES) security modes
    • Up to +16 dBm output power in 802.11b mode
    • Support SmartConfig functions for Android and iOS devices
    • External antenna IPEX connector
    • Working temperature: -20℃ to 85℃
  • BLE:
    • Support the lower-power bluetooth (V4.2)
    • Maximum output power: +6 dBm
    • External antenna IPEX connector

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Date Description Version after update
11/22/2019 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

WB3S-IPEX has two rows of pins with a 2 mm pin spacing.
The dimensions of WB3S-IPEX are 16 mm (W)×24 mm (L) ×2.8 mm (H).
Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

WB3S-IPEX Module Datasheet

Pin definition

Pin number Symbol I/O type Function
1 CEN I Low level reset, high level active (the pin has been pulled high internally), correspond to CEN of IC
2 ADC3 AI ADC port, which corresponds to P 23 of IC
3 EN I Enabling pin, which is pulled high internally to be compatible with other modules
4 P14 I/O A universal GPIO interface, which corresponds to P 14 of IC
5 P26 I/O GPIOP_26, which corresponds to P 26 of IC
6 P24 I/O GPIOP_24, a universal GPIO interface, which corresponds to P 24 of IC
7 P6 I/O GPIOP_6, which corresponds to P 6 of IC
8 VCC P Power supply pin (3.3 V)
9 GND P Power supply reference ground
10 P7 I/O GPIOP_7, which corresponds to P 7 of IC
11 P0 I/O UART2_TXD (used to display the module internal information), which corresponds to P 0 of IC
12 P1 I/O UART0_RXD (used to display the module internal information), which corresponds to P 1 of IC
13 P9 I/O GPIOP_9, a universal GPIO interface, which corresponds to P 9 of IC
14 P8 I/O GPIOP_8, which corresponds to P8 of IC
15 RXD1 I/O UART1_RXD (user-side serial interface), which corresponds to P 10 of IC
16 TXD1 I/O UART1_TXD (user-side serial interface), which corresponds to P 11 of IC

Note: P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

CEN is only a hardware reset pin and cannot be used for clearing information about Wi-Fi network configuration.

UART1 is a user-side serial interface. When the module is powered on and enabled, there is information output from the user-side serial interface, which can be neglected.

Definitions on test points

Pin Number Symbol I/O Type Function
1 SO IO Data output during flash download, which is used for production and programming of the module. The pin corresponds to P 23/ADC 3 of IC
2 SI IO Data input during flash download, which is used for production and programming of the module. The pin corresponds to P 22 of IC.
3 CS IO Chip selection during flash download, which is used for production and programming of the module. The pin corresponds to P 21 of IC.
4 SCK IO Clock during flash download, which is used for production and programming of the module. The pin corresponds to P 20 of IC.

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 150
VCC Power supply voltage -0.3 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VCC Power supply voltage 3.0 3.3 3.6 V
VIL IO low-level intput -0.3 - VCC*0.25 V
VIH IO high-level input VCC*0.75 - 3.6 V
VOL IO low-level output - - VCC*0.1 V
VOH IO high-level output VCC*0.8 - VCC V
Imax IO drive current - 6 15 mA

RF power consumption

Working Status Mode Rate Transmit Power/Receive Typical Value Unit
Transmit 11b 11 Mbps +16 dBm 222 mA
11g 54 Mbps +14 dBm 195 mA
11n HT20 MCS 7 +13 dBm 185 mA
Receive 11b 11 Mbps Constantly receive 98 mA
11g 54 Mbps Constantly receive 98 mA
11n HT20 MCS 7 Constantly receive 98 mA

Working power consumption

Working mode Working status, TA=25℃ Average value Peak value (Typical value) Unit
Quick connection network state (network configuration through bluetooth) The module is in the fast network connection state and the Wi-Fi indicator fast flashes 100 330 mA
Quick connection network state (network configuration through AP) The module is in the fast network connection state and the Wi-Fi indicator flashes slowly 70 365 mA
Quick connection network state (network configuration through EZ) The module is in the fast network connection state and the Wi-Fi indicator fast flashes 60 336 mA
Network connection idle state The module is connected to the network and the Wi-Fi indicator is always on 40 270 mA
Network connection operation state The module is connected to the network and the Wi-Fi indicator is always on 50 280 mA
Disconnected state The module is disconnected 100 260 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
BLE standard Low-power Bluetooth 4.2
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
11N: HT20 MCS 0 to 7
Antenna type IPEX Antenna

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 16 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 13 - dBm
Frequency error -2 - +2 ppm
EVM@802.11b CCK 11 Mbps Mode16 dBm - -18 - dB
EVM@802.11g OFDM 54 Mbps Mode14 dBm -30 -29 -25 dB
EVM@802.11n OFDM MCS7 Mode13 dBm -31 -28 -27 dB

RX Performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M - -92 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -75 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -68 - dBm
PER<10%, RX sensitivity, BLE 1M - -95 - dBm

Antenna

Antenna type

WB3S-IPEX uses an external IPEX antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area. Please deploy the antenna in the following manner shown in the picture.

WB3S-IPEX Module Datasheet

WB3S-IPEX Module Datasheet

Antenna connector specifications

WB3S-IPEX Module Datasheet

Packaging information and production instructions

Mechanical dimensions

WB3S-IPEX Module Datasheet

WB3S-IPEX Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Recommended PCB layout

WB3S-IPEX Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Production instructions

  1. Tuya’s stamp hole package module must be mounted by SMT machine within 24 hours after unpacking and programming of firmware. Otherwise, it must be packaged again under vacuum. The module must be baked before mounting.

    • SMT equipment
      • Reflow soldering machine
      • Automated optical inspection (AOI) equipment
      • Nozzle with a 6 mm to 8 mm diameter
    • Baking equipment
      • Cabinet oven
      • Anti-static heat-resistant trays
      • Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.

    • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.

    • The package contains a humidity indicator card (HIC).

      WB3S-IPEX Module Datasheet

  3. Bake a module based on HIC status as follows when you unpack the module package:

    • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    • If the 30% circle is pink, bake the module for 4 consecutive hours.
    • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings:

    • Baking temperature: 125±5°C
    • Alarm temperature: 130°C
    • SMT ready temperature after natural cooling: < 36°C
    • The number of drying times: 1
    • Rebaking condition: The module is not soldered within 12 hours after baking.
  5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized after more than 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences.

  6. Before SMT, take electrostatic discharge (ESD) protective measures.

  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before the first mounting to determine proper methods for controlling the oven temperature and attaching and placing components. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is shown as belows:

WB3S-IPEX Module Datasheet

Storage conditions

WB3S-IPEX Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method Number of modules per reel (pcs) Number of reels per carton (reel)
WB3S-IPEX 4000 Tape reel 1000 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Important Note

This radio module must not installed to co-locate and operate simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module get a FCC ID, the host product manufacturer can not use the FCC ID on the final product directly.In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

WB3S-IPEX Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com.

WB3S-IPEX Module Datasheet

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20 cm to the human body.

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