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HPWSMS1 模组规格书

更新时间:2021-07-02 07:01:20下载pdf

HPWSMS1 是由杭州涂鸦信息技术有限公司开发的一款低功耗嵌入式 Wi-Fi+蓝牙 LE 模组。它由一颗高集成度的无线射频处理器芯片 RS9116和少量外围器件构成,单波段 QMS 和 WMS SoCs 提供了全面的多协议无线连接。 Redpine 为 Linux 和 Android 系统提供驱动程序。

产品特性

  • Wi-Fi
    • 支持IEEE802.11 b/g/n模式
    • 支持20MHz带宽
    • 最大发射功率可达到16dB
    • 接收功率-95dB@1M
    • 频端范围:2412 MHz – 2484 MHz
  • 蓝牙
    • 蓝牙 LE 4.2& 蓝牙 LE 5.0
    • 最大发射功率-1.5dB(蓝牙功能只用来搜索设备SSID)

操作条件

  • 电压范围:1.76V-3.65V
  • 操作温度:-20°C-70°C

安全特性

  • 硬件设备标识和密钥存储与PUF
  • Accelerators: AES128/256, SHA256/384/512,HMAC, RSA, ECC, ECDH, RNG, CRC
  • WPA/WPA2-Personal, WPA/WPA2 Enterprise for Client, EAP-TLS, EAP-FAST, EAP-TTLS, EAP-LEAP, PEAP-MSCHAP-v2
  • 真正的随机数发生器
  • 安全启动
  • 安全与备份固件升级
  • FIPS140-2 兼容

应用领域

  • 多媒体
  • 消费类电子产品
  • 家电
  • 工业和家庭自动化
  • 智能网关和计量

更新说明

更新日期 更新内容 更新后版本
2020-12-1 新建文档 V1.0.0

模组接口

尺寸封装

HPWSMS1 共有 100 个引脚,引脚间距为 0.7±0.1mm。

HPWSMS1尺寸大小:20±0.35mm (W) × 14±0.35mm (L) × 3±0.15mm (H)。

HPWSMS1 模组如下图所示:

HPWSMS1 模组规格书

HPWSMS1 模组规格书

引脚定义

HPWSMS1 模组规格书

引脚序号 芯片 IC 管脚 I/O 功能
1 GND GND
2 NC /
3 NC /
4 NC /
5 NC /
6 NC /
7 A35 GPIO
8 NC /
9 GND GND
10 GND GND
11 A37 USB_ID
12 A40 USB_DM
13 B36 USB_DP
14 A39 USB_AVDD_3P3,USB 3V3 供电 pin
15 B35 USB_AVDD_1P1,USB 1V1 供电 pin
16 A38 USB_VBUS,USB 5V 供电
17 VOUTLDOSOC Output of SoC LDO 芯片自转电源pin
18 NC /
19 NC /
20 GND GND
21 NC /
22 A42 SDIO_DATA3,SDIO数据pin
23 A43 SDIO_DATA2,SDIO数据pin
24 B40 SDIO_CLK
25 A1 SDIO_CMD
26 NC /
27 NC /
28 NC /
29 PA_AVDD 3V3供电
30 GND GND
31 GND GND
32 RF OUT RF输出pin,连接底板上的天线链路
33 GND GND
34 GND GND
35 GND GND
36 GND GND
37 NC /
38 GND GND
39 B10 HOST_BB_EN,睡眠控制pin,这个信号用于向主机处理器发送指示。当芯片进入(逻辑)时发出指示和退出(逻辑高)ULP 休眠模式。
40 NC /
41 NC /
42 GND GND
43 GND GND
44 GND GND
45 GND GND
46 NC /
47 GND GND
48 GND GND
49 VIN_MOD 3V3供电
50 A16 TMS,JTAG软件 debug pin
51 B15 TD0,JTAG软件 debug pin
52 A17 TCK,JTAG软件 debug pin
53 B16 TDI,JTAG软件debug pin
54 A19 GPIO
55 NC /
56 NC /
57 GND GND
58 A20 UART1_RX
59 A21 UART1_TX
60 B18 GPIO
61 A22 GPIO
62 B21 GPIO
63 A24 GPIO
64 B22 GPIO
65 A27 POC_IN,Power On Control Input
66 B24 ULP 低功耗睡眠模式控制 pin
67 GND GND
68 GND GND
69 A29 32.768K 晶振输入 pin,默认 NC
70 GND GND
71 NC /
72 A31 RESET_N,复位pin。可通过主 MCU 做上拉或者外接 3.3V 上拉。
73 NC /
74 NC /
75 A41 GPIO
76 B39 SDIO_DATA0,SDIO数据pin
77 A44 SDIO_DATA1,SDIO数据pin
78 SDIO_IO_VDD 3V3供电
79 NC /
80 NC /
81 A4 GPIO
82 PA_AVDD 3V3供电
83 GND GND
84 GND GND
85 GND GND
86 GND GND
87 GND GND
88 GND GND
89 NC /
90 GND GND
91 A25 GPIO
92 B25 POC_OUT, Power On Control Output.
93 GND GND
94 UULP_VBAT 3V3供电
95 GND GND
96 B26 32.768K晶振输出pin,默认NC
97 GND GND
98 VINBCKDC 3V3供电
99 NC /
100 NC /

电气参数

绝对电气参数

参数 描述 最小值 最大值 单位
Ta 工作温度 -40 85
VBAT 供电电压 -0.3 3.9 V
静电释放电压(人体模型) TAMB-25℃ - 2 KV
静电释放电压(机器模型) TAMB-25℃ - 0.5 KV

正常工作条件

参数 描述 最小值 典型值 最大值 单位
Ta 工作温度 -20 - 70
VCC 工作电压 1.76 3.3 3.65 V

连续发射、接收和睡眠时功耗

工作状态 模式 速率 发射功率/接收 平均值 最大值(典型值) 单位
发射 11b 11Mbps +17.5dBm 288 455 mA
发射 11g 54Mbps +15dBm 156 228 mA
发射 11n-HT20 MCS7 +15dBm 130 227 mA
接收 11b 11Mbps 连续接收 125 129.7 mA
接收 11g 54Mbps 连续接收 125 129.7 mA
接收 11n-HT20 MCS7 连续接收 125 129.7 mA
睡眠模式 / / 测试6min平均值 120 / uA

射频参数

基本射频特性

参数项 详细说明
工作频率 Wi-Fi:2.412 GHz to 2.484 GHz(Ch1-11 for US/CA);
蓝牙:2402MHz to 2480MHz
Wi-Fi标准 IEEE 802.11b/g/n
数据传输速率 Wi-Fi:11b:1,2,5.5, 11 (Mbps);
11g:6,9,12,18,24,36,48,54(Mbps);
11n: HT20 MCS0~7;
蓝牙:1M/2M
天线类型 模组上预留天线接口pin,实际应用天线要设计在底板上

发射性能

2.4G-TX连续发送性能

参数项 最小值 典型值 最大值 单位
RF平均输出功率,802.11b CCK Mode 11M - 16 - dBm
RF平均输出功率,802.11g OFDM Mode 54M - 13 - dBm
RF平均输出功率,802.11n HT20 Mode MCS7 - 13 - dBm
频率误差 -10 - 10 ppm
蓝牙1M/2M输出功率 - -1.5 - dBm

说明:为了满足 FCC 认证要求,左右边带(信道1和信道11功率要降低)。

接收性能

RX灵敏度

参数项 最小值 典型值 最大值 单位
PER<8%,RX灵敏度,802.11b DSSS Mode 11M - -86 - dBm
PER<10%,RX灵敏度,802.11g 54 M - -74 - dBm
PER<10%,RX灵敏度,802.11n HT20-MCS7 - -68 - dBm

天线信息

天线类型

模组上预留天线接口pin,实际应用天线要设计在底板上

降低天线干扰

为确保Wi-Fi性能的最优化,建议天线部分和其他金属件距离至少在15mm以上。
用户PCB板在天线区域勿走线甚至覆铜,以免影响天线性能。

封装信息及生产指导

机械尺寸

PCB尺寸大小:20±0.35mm (W) × 14±0.35mm (L) × 0.8±0.1mm (H).

HPWSMS1 模组规格书

生产指南

  1. 涂鸦出厂的贴片封装模组建议使用SMT机器贴片,拆开包装后建议在24小时内完成焊接,如果拆封后未使用完建议放置在湿度不超过10%RH的干燥柜内,或重新进行真空包装并记录暴露时间,总暴露时间不超过168小时。
    • SMT贴片所需仪器或设备:
      • 贴片机
      • SPI
      • 回流焊
      • 炉温测试仪
      • AOI
    • 烘烤所需仪器或设备:
      • 柜式烘烤箱
      • 防静电耐高温托盘
      • 防静电耐高温手套
  2. 涂鸦出厂的模组存储条件如下:
    • 防潮袋必须储存在温度<40℃、湿度<90%RH的环境中

    • 干燥包装的产品,保质期为从包装密封之日起12个月的时间

    • 密封包装内装有湿度指示卡:

      HPWSMS1 模组规格书

  3. 涂鸦出厂的模组当出现可能受潮的情况下需要进行烘烤:
    • 拆封前发现真空包装袋破损
    • 拆封后发现包装袋内没有湿度指示卡
    • 拆封后如果湿度指示卡读取到10%及以上色环变为粉色
    • 拆封后总暴露时间超过168小时
    • 从首次密封包装之日起超过12个月
  4. 烘烤参数如下:
    • 烘烤温度:卷盘包装60℃,湿度小于等于5%RH;托盘包装125℃,湿度小于等于5%RH(耐高温托盘非吸塑盒拖盘)
    • 烘烤时间:卷盘包装48小时;托盘包装12小时
    • 报警温度设定:卷盘包装65℃;托盘包装135℃
    • 自然条件下冷却到36℃以下后,即可进行生产
    • 若烘烤后暴露时间大于168小时没有使用完,请再次进行烘烤
    • 如果暴露时间超过168小时未经过烘烤,不建议使用回流焊接工艺焊接此批次模组,因模组为3级湿敏器件超过允许的暴露时间产品可能受潮,进行高温焊接时可能会导致器件失效或焊接不良
  5. 在整个生产过程中请对模组进行静电放电(ESD)保护。
  6. 为了确保产品合格率,建议使用SPI和AOI测试设备来监控锡膏印刷和贴装品质。

推荐炉温曲线

请根据回流焊曲线图进行SMT贴片,峰值温度245℃,回流焊温度曲线如下图所示:

HPWSMS1 模组规格书

  • A:温度轴

  • B:时间轴

  • C:合金液相线温度:217-220℃

  • D:升温斜率:1-3℃/S

  • E:恒温时间:60-120S;恒温温度:150-200℃

  • F:液相线以上时间:50-70S

  • G:峰值温度:235-245℃

  • H:降温斜率:1-4℃/S

    注意:以上推荐曲线以SAC305合金焊膏为例。其他合金焊膏请按焊膏规格书推荐炉温曲线设置。

储存条件

HPWSMS1 模组规格书

模组MOQ与包装信息

产品型号 MOQ(pcs) 出货包装方式 每个卷盘存放模组数 每箱包装卷盘数
HPWSMS1 4800 载带卷盘 1200 4

附录:声明

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-HPWSMS1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-HPWSMS1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.