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BF8H-N Module Datasheet

Last Updated on : 2022-05-16 03:44:32download

BF8H-N is a low-power embedded Bluetooth audio module that Tuya has developed. It mainly consists of a highly integrated Bluetooth chip (FR8018HA) and a few peripheral circuits with the Bluetooth communication protocol stack and rich library functions inside.

Product overview

BF8H-N includes an ARM Cortex M3 32-bit processor, a Bluetooth LE 5.0/2.4G radio, a 512-KB flash memory, a 48-KB SRAM, 30 reusable I/O ports, charging management for a lithium battery, and a 16-bit single-channel audio CODEC.

Features

  • 32-bit processor with the ARM Cortex M3 inside
  • Operating voltage: 1.8 to 4.3V. If the voltage is between 1.8 and 2.4V, the module can start, but the optimal RF performance cannot be ensured. If the voltage is between 2.5 and 3.6V, the overall performance will be normal.
  • Peripherals: 6 PWMs, 4 ADCs, 30 GPIOs, 2 UARTs, 1 SPI, 1 MIC, and 1 speaker
  • Support Li-Ion/Li-Polymer battery, programmable charging current, current up to 200mA for fast charging
  • Bluetooth RF features:
    • Bluetooth LE 5.0
    • The RF data rate can be up to 2 Mbps.
    • Transmit power: +4 dBm
    • Receiving sensitivity: -93 dBm@ 1 Mbps
    • Support hardware encryption (AES/CCM)
    • PCB antenna with a gain of 1.4 dBi
    • Operating temperature: -20℃ to +85℃

Applications

  • Outdoor
  • Smart home

Change history

Update date Updated content Version after update
Feb. 14, 2022 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

The dimensions of BF8H-N are 25±0.35 mm (L)×18±0.35 mm (W) ×2.8±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm, which are shown below:
BF8H-N Module Datasheet

BF8H-N Module Datasheet

Pin definition

The definitions of pins are shown in the following table:

Pin number Symbol Pin type Function
1 PA5 I/O Common I/O interface, which corresponds to Pin 8 of the IC
2 PA4 I/O Common I/O interface, which corresponds to Pin 7 of the IC
3 PA6 I/O Common I/O interface, which corresponds to Pin 6 of the IC
4 PA7 I/O Common I/O interface, which corresponds to Pin 5 of the IC
5 PB4 I/O Common I/O interface, which corresponds to Pin 42 of the IC
6 PB6 I/O Common I/O interface, which corresponds to Pin 43 of the IC
7 PB7 I/O Common I/O interface, which corresponds to Pin 44 of the IC
8 PD0 I/O Common I/O interface, which corresponds to Pin 41 of the IC
9 PD1 I/O Common I/O interface, which corresponds to Pin 40 of the IC
10 PD2 I/O Common I/O interface, which corresponds to Pin 39 of the IC
11 PD3 I/O Common I/O interface, which corresponds to Pin 38of the IC
12 RX0 I/O Serial port UART0_RX, which can also be used a common I/O interface and corresponds to Pin 4 of the IC chip
13 TX0 I/O Serial port UART0_TX, which can also be used a common I/O interface and corresponds to Pin 3 of the IC chip. It can used to output logs.
14 BIAS AO MIC_BIAS, power supply for microphone, correspond to Pin 13 of the IC.
15 MIC AI MIC_IN, microphone input, correspond to Pin 14 of the IC. You should reserve an earth filter capacitor for the external microphone.
16 AO-P AO AOUT_P, audio differential output (positive), correspond to Pin 16 of the IC
17 AO-N AO AOUT_N, audio differential output (negative), correspond to Pin 17 of the IC
18 RST AI Hardware reset pin (high active), correspond to Pin 18 of the IC
19 VCHG P Charger, pin for charging, which corresponds to Pin 19 of the IC. It can be used to charge the external batteries
20 ADC0 I/O Common I/O interface PD4, which can be configured to be 10 bit/s and corresponds to Pin 29 of the IC
21 PD5 I/O Common I/O interface, which corresponds to Pin 28 of the IC
22 PD6 I/O Common I/O interface, which corresponds to Pin 27 of the IC
23 PD7 I/O Common I/O interface, which corresponds to Pin 26 of the IC
24 GND P Power supply reference ground
25 VCC P Power supply pin VCC (Typical value: 3.3V)
26 TX1 I/O Default burning serial port, transmitting pin UART1_TX, which can also be used as a common I/O interface and corresponds to pin 1 of the IC
27 RX1 I/O Default burning serial port, receiving pin UART1_RX, which can also be used as a common I/O interface and corresponds to Pin 2 of the IC
28 PC7 I/O Common I/O interface, which corresponds to Pin 30 of the IC
29 PC6 I/O Common I/O interface, which corresponds to Pin 31 of the IC
30 PC5 I/O Common I/O interface, which corresponds to P32 of the IC
31 PC3 I/O Common I/O interface, which corresponds to Pin 34 of the IC
32 PC2 I/O Common I/O interface, which corresponds to Pin 35 of the IC
33 PC1 I/O Common I/O interface, which corresponds to Pin 36 of the IC
34 PC0 I/O Common I/O interface, which corresponds to Pin 37 of the IC
35 PB5 I/O Common I/O interface, which corresponds to Pin 45 of the IC
36 PB1 I/O Common I/O interface, which corresponds to Pin 46 of the IC
37 PB2 I/O Common I/O interface, which corresponds to Pin 47 of the IC
38 PB3 I/O Common I/O interface, which corresponds to Pin 48 of the IC
  • The recommended voltage is 3.3V. The RF performance will be instable if the operating voltage is under 2.5V.
  • P indicates a power supply pin, I/O indicates an input/output pin, and AI/AO indicates an analog input/output pin.
  • Module RTC can be calibrated by timer, it does not contain external 32.768K crystal, and is not suitable for local long time accurate timing applications .
  • If you have any special requirements on the light color controlled by the PWM output, please contact Tuya business personnel.
  • The peripheral circuit of Audio and Charger is shown below for reference, Pins can be suspended if not used:
    BF8H-N Module Datasheet

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 120
I/O voltage ALDO_OUT 1.6 3.3 V
VCC Power supply voltage 1.8 4.3 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 2 KV

Operating conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 - 85
VCC Operating voltage 1.8 3.3 4.3 V
VCHG Voltage for charger 4.75 5 5.25 V
VIL Voltage low input -0.3 - 0.3* VDDIO V
V~IH Voltage high input 0.7*VDDIO - VDDIO+0.3 V
VOL Voltage low output - - 0.33 V
VOH Voltage high output 1.8 - - V

The test condition for the above high/low voltage input/output is: VDDI/O = 3.3V.

Power consumption in operating mode

Symbol Conditions Maximum value (Typical value) Unit
Itx Constantly transmit with the output power of 40 dBm 14.3 mA
Irx Constantly receive 15.7 mA
IDC Average value in mesh networking state 5 mA
IDC Peak value in mesh networking state 21.2 mA
Ideepsleep Average value in deep sleep state (reserve RAM) 6.2 uA

RF parameters

Basic RF features

Parameter Description
Operating frequency 2.4 GHz ISM band
Wireless standard Bluetooth LE 5.0
Data transmission rate 1 Mbps, 2 Mbps
Antenna type PCB antenna

RF output power

Parameter Minimum value Typical value Maximum value Unit
Average RF output power -20 4 5 dBm
Bandwidth of 20-dB modulation signal (1M) - 2500 - KHz

RF receiving sensitivity

Parameter Minimum value Typical value Maximum value Unit
Receiving sensitivity 1 Mbps - -96 - dBm
Frequency offset error 1 Mbps -250 - +300 KHz

Audio CODEC parameters

Digital to analog converter (single channel)

Parameter Condition Minimum value Typical value Maximum value Unit
Conversion precision - - - 16 Bits
Sampling rate (Fs)* Synchronous clock signal 8 - 48 V
SNR - 92 dB
Digital gain 1/48dB -48 - 32 dB
Analog gain 3dB 0 - 30 dB
Full-scale output voltage VDDA=2.9V - 1500 - mV
Stopband attenuation 65 - - V

The test condition for sampling rate (Fs):

  • Fin=1kHz
  • B/W=20Hz—20KHz
  • A-Weighted THD_N<0.01%
  • Fs (8K, 16K, 32K, 44.1K, 48K)

Analog to digital converter (single channel)

Parameter Condition Minimum value Typical value Maximum value Unit
Conversion precision - - - 16 Bits
Sampling rate (Fs)* Synchronous clock signal 8 - 48 V
SNR Weighted/non-weighted - 79 - dB
Digital gain 1/48dB -48 - 32 dB
Analog gain 3dB 0 - 30 dB

Antenna information

Antenna type

BF8H-N uses the PCB antenna with a gain of 1.4 dBi.

Interference reduction

To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.
BF8H-N Module Datasheet

Packaging information and production instructions

Mechanical dimensions

BF8H-N Module Datasheet

BF8H-N Module Datasheet

BF8H-N Module Datasheet

The following is a schematic diagram of BF8H-N which shows how pins correspond to each other:
BF8H-N Module Datasheet

Recommended PCB footprint
BF8H-N Module Datasheet

The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication.

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      BF8H-N Module Datasheet
  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months has passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

BF8H-N Module Datasheet

  • A: Temperature axis
  • B: Time axis
  • C: Liquidus temperature: 217 to 220°C
  • D: Ramp-up slope: 1 to 3°C/s
  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
  • F: Duration above the liquidus: 50 to 70s
  • G: Peak temperature: 235 to 245°C
  • H: Ramp-down slope: 1 to 4°C/s

The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

BF8H-N Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packaging method The number of modules per reel The number of reels per carton
BF8H-N 4000 Tape reel 1000 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-BF8H-N. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BF8H-N”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

BF8H-N Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

BF8H-N Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.