Last Updated on : 2024-11-05 01:59:28download
T1-U module is a Wi-Fi and Bluetooth Low Energy (LE) combo module developed by Tuya Smart. It is composed of a highly integrated radio-frequency identification (RFID) chip T1 and a few peripheral components. It can run in the station (STA) mode and access point (AP) mode as well as support connection over Bluetooth LE.
T1-U has a built-in 32-bit MCU with a maximum running speed of 160 MHz, built-in 1 MB flash memory, and 288 KB RAM. The module supports cloud connectivity, and the MCU’s extended instructions for signal processing enable it to efficiently implement audio encoding and decoding. Various peripherals are available, such as PWM, UART, and SPI. Up to five channels of 32-bit PWM output make the chip ideal for high-quality LED control.
The T1-U dimensions are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 2.7±0.15 mm (H). The following figure shows the dimensions and packaging design of the T1-U module.
Pin No. | Symbol | I/O type | Description |
---|---|---|---|
1 | P14 | I/O | A normal GPIO pin, corresponding to Pin 19 on the IC. It can be reused as SPI_SCK . |
2 | P16 | I/O | A normal GPIO pin, corresponding to Pin 20 on the IC. It can be reused as SPI_MOSI . |
3 | P23 | I/O | A normal GPIO pin, corresponding to Pin 16 on the IC. |
4 | P22 | I/O | A normal GPIO pin, corresponding to Pin 15 on the IC. |
5 | ADC | I/O | An ADC pin, corresponding to P20 (Pin 13) on the IC. |
6 | RX2 | I/O | UART_RX2 , corresponding to P1 (Pin 30) on the IC. |
7 | TX2 | I/O | UART_TX2 to print logs, corresponding to P0 (Pin 31) on the IC. |
8 | P24 | I/O | Support hardware PWM4, corresponding to Pin 17 on the IC. |
9 | P9 | I/O | Support hardware PWM3, corresponding to Pin 27 on the IC. |
10 | P26 | I/O | Support hardware PWM5, corresponding to Pin 23 on the IC. |
11 | P6 | I/O | Support hardware PWM0, corresponding to Pin 24 on the IC. |
12 | P8 | I/O | Support hardware PWM2, corresponding to Pin 26 on the IC. |
13 | GND | P | Ground pin. |
14 | 3V3 | P | 3.3V power pin. |
15 | TX1 | I/O | UART_TX1 to send user data, corresponding to Pin 29 on the IC. For more information about MCU general integration, see Hardware Design of CBx Module. |
16 | RX1 | I/O | UART_RX1 to receive user data, corresponding to Pin 28 on the IC. For more information about MCU general integration, see Hardware Design of CBx Module. |
17 | P28 | I/O | A normal GPIO pin, corresponding to Pin 12 on the IC. |
18 | CEN | I/O | The reset pin, active low, and pulled up internally. It is compatible with the designs of other modules. Corresponding to Pin 11 on the IC. |
19 | P21 | I/O | A normal GPIO pin, corresponding to Pin 14 on the IC. |
20 | P17 | I/O | A normal GPIO pin, corresponding to Pin 22 on the IC. It can be reused as SPI_MISO . |
21 | P15 | I/O | A normal GPIO pin, corresponding to Pin 21 on the IC. It can be reused as SPI_CS . It is not recommended to use this pin for non-SPI applications. |
P
indicates the power pin, and I/O indicates the input and output pin.Parameter | Description | Min value | Max value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -55 | 125 | °C |
VBAT | Supply voltage | -0.3 | 3.9 | V |
Electrostatic discharge voltage (human body model) | TAMB -25°C | -4 | 4 | kV |
Electrostatic discharge voltage (machine model) | TAMB -25°C | -200 | 200 | V |
Parameter | Description | Min value | Typical value | Max value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -40 | N/A | 105 | °C |
VBAT | Supply voltage | 3 | 3.3 | 3.6 | V |
VOL | I/O low-level input | VSS | N/A | VSS + 0.3 | V |
VOH | I/O high-level output | VBAT − 0.3 | - | VBAT | V |
Imax | I/O drive current | - | 6 | 20 | mA |
Working status | Mode | Rate | Transmit/Receive power | Average value | Peak (Typical) value | Unit |
---|---|---|---|---|---|---|
Transmit | 11b | 11 Mbit/s | +17 dBm | 390 | 445 | mA |
Transmit | 11g | 54 Mbit/s | +15 dBm | 370 | 420 | mA |
Transmit | 11n | MCS7 | +14 dBm | 360 | 405 | mA |
Receive | 11b | 11 Mbit/s | Continuous reception | 37 | 45 | mA |
Receive | 11g | 54 Mbit/s | Continuous reception | 37 | 45 | mA |
Receive | 11n | MCS7 | Continuous reception | 37 | 45 | mA |
Working mode | Status (Ta = 25°C) | Average value | Peak (Typical) value | Unit |
---|---|---|---|---|
Quick pairing (Bluetooth) | The module is in EZ mode. The Wi-Fi network status indicator blinks quickly. | 80 | 430 | mA |
Quick pairing (AP) | The module is in AP mode. The Wi-Fi network status indicator blinks slowly. | 85 | 450 | mA |
Quick pairing (EZ) | The module is in EZ mode. The Wi-Fi network status indicator blinks quickly. | 87 | 450 | mA |
Connected | The module is connected to the cloud. The Wi-Fi network status indicator is steady on. | 90 | 430 | mA |
Weakly connected | The connection between the module and the hotspot is intermittent. The Wi-Fi network status indicator is steady on. | 190 | 460 | mA |
Disconnected | The module is disconnected from the cloud. The Wi-Fi network status indicator is steady off. | 67 | 420 | mA |
Module disabled | The module’s clock enable (CEN) pin is pulled down. | 330 | N/A | μA |
Parameter | Description |
---|---|
Operating frequency | 2.412 to 2.484 GHz |
Wi-Fi standard | IEEE 802.11b/g/n (channels 1–14) |
Data transmission rate |
|
Antenna type | PCB antenna |
Parameter | Min value | Typical value | Max value | Unit |
---|---|---|---|---|
RF average output power, 802.11b CCK mode, 11M | - | 17 | - | dBm |
RF average output power, 802.11g OFDM mode, 54M | - | 15 | - | dBm |
RF average output power, 802.11n OFDM mode, MCS7 (HT20) | - | 14 | - | dBm |
Frequency error | -20 | - | 20 | ppm |
Parameter | Min value | Typical value | Max value | Unit |
---|---|---|---|---|
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11M | - | -88 | - | dBm |
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54M | - | -75 | - | dBm |
PER < 10%, RX sensitivity, 802.11n OFDM mode, MCS7 (HT20) | - | -73 | - | dBm |
PER < 10%, RX sensitivity, Bluetooth, 1M | - | -96 | - | dBm |
Parameter | Min value | Typical value | Max value | Unit |
---|---|---|---|---|
Operating frequency | 2402 | - | 2480 | MHz |
Transmission rate over the air | - | 1 | - | Mbit/s |
Transmission power | -20 | 6 | 20 | dBm |
Frequency error | -150 | - | 150 | KHz |
Parameter | Min value | Typical value | Max value | Unit |
---|---|---|---|---|
RX sensitivity | - | -96 | - | dBm |
Max RF signal input | -10 | - | - | dBm |
Intermodulation | - | - | -23 | dBm |
Adjacent-channel rejection ratio | - | 10 | - | dB |
The T1-U module uses an onboard PCB antenna.
When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.
Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.
Dimensions of the T1-U PCB are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 1.0±0.1 mm (H).
The following figure shows the recommended footprint of the T1-U module.
The area indicated as keep-out in the diagram above does not require tinning and should not have any traces routed through it.
For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. If the production is paused for over 24 hours after the module is unpacked, we recommend that you place the module in a moisture-proof box with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.
A delivered module must meet the following storage requirements:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indication card (HIC) in the sealed package.
The module needs to be baked in the following cases:
The baking parameter settings are described below:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering technique according to the process. For the SMT process, refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, refer to the recommended oven temperature curve of wave soldering. The set temperatures might deviate from the actual temperature measurements. All the temperatures shown in this module datasheet are obtained through actual measurements.
Technique 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set the oven temperatures according to the following curve.
A: temperature axis
B: time axis
C: alloy liquidus temperature from 217°C to 220°C
D: ramp-up slope from 1°C/s to 3°C/s
E: constant temperature time from 60s to 120s, constant temperature from 150°C to 200°C
F: temperature above liquidus temperature for 50s to 70s
G: peak temperature from 235°C to 245°C
H: Ramp-down slope from 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.
Technique 2: Wave soldering process (Oven temperature curve of wave soldering)
Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Suggestions on wave soldering | Suggestions on manual soldering | ||
---|---|---|---|
Preheat temperature | 80°C to 130°C | Soldering temperature | 360°C ± 20°C |
Preheat duration | 75s to 100s | Soldering duration | Less than 3s/point |
Contact duration at the peak | 3s to 5s | N/A | N/A |
Solder tank temperature | 260 ± 5°C | N/A | N/A |
Ramp-up slope | ≤ 2°C/s | N/A | N/A |
Ramp-down slope | ≤ 6°C/s | N/A | N/A |
Product model | MOQ (pcs) | Shipping packaging | Modules per reel | Reels per carton |
---|---|---|---|---|
T1-U | 4400 | Tape and reel | 1,100 | 4 |
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.
This device has got an FCC ID: 2ANDL-T1-U. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T1-U”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm from the human body.
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