T3-V-PRO Module Datasheet

T3-V-PRO is a voice module developed by Tuya Smart. It consists of a highly integrated radio frequency chip, T3, and a voice chip, supporting combo Wi-Fi and Bluetooth Low Energy (LE) protocols.

Overview

T3-V-PRO is a Wi-Fi AI module that supports voice control. It integrates the Tuya AI platform, enables interaction through voice, and connects to major AI platforms via the Tuya AI Agent. It supports large language models such as Doubao, DeepSeek, Qwen, OpenAI, and Gemini. It features button wake-up, wake-word activation, and free talk capabilities, providing users with a vivid and engaging AI voice interaction experience. It is suitable for smart products in voice interaction scenarios.

Features

• Built-in low-power 32-bit CPU that also acts as an application processor.
• Clock rate of 320 MHz.
• Operating voltage range: 3.6V to 5.5V.
• Peripherals: 5×PWM, 1×SDIO, 1×UART, and 1×SPI.
• Wi-Fi connectivity
  • IEEE 802.11b/g/n/ax.
  • Channels 1 to 14 at 2.4 GHz.
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), and WPA3 security modes.
  • The maximum output power is +17 dBm for IEEE 802.11b transmission.
  • Two pairing modes are supported, namely Bluetooth and AP mode. Both modes are suitable for pairing with Android and iOS mobile phones.
  • The onboard PCB antenna has a peak gain of 1 dBi.
  • Operating temperature range: -40°C to +85°C.
• Bluetooth connectivity
  • Bluetooth Core Specification v5.4.
  • The transmitter power in Bluetooth mode is 6 dBm.
  • The onboard PCB antenna has a peak gain of 1 dBi.

Scope of applications

• AI-powered digital entertainment products
• Smart home and electrical appliance
• Smart socket and light

Module interfaces

Dimensions and footprint

The T3-V-PRO dimensions are 18±0.35 mm (W) × 30.2±0.35 mm (L) × 3.0±0.15 mm (H). The figure below shows the dimensions of the T3-V-PRO module.

Pinout

Pin No.	Symbol	I/O type	Description
1	GND	P	Ground pin.
2	P25	I/O	Standard GPIO pin, which can be reused as an ADC pin.
3	RST	I	Reset pin.
4	TX1	I/O	Logging port, corresponding to P0 on T3.
5	RX1	I/O	Logging port, corresponding to P1 on T3.
6	P28	I/O	Standard GPIO pin, which can be reused as an ADC pin.
7	TX0	I/O	T3 firmware flashing port, corresponding to P11 on T3.
8	RX0	I/O	T3 firmware flashing port, corresponding to P10 on T3.
9	P48	I/O	Standard GPIO pin.
10	CI_TX0	I/O	Firmware flashing port TX0 of the audio chip.
11	CI_RX0	I/O	Firmware flashing port RX0 of the audio chip.
12	P32	I/O	Standard GPIO pin, which can be reused as a PWM pin.
13	CI_PWR	P	The power control enable pin of the voice chip, active high, corresponding to P12 on T3.
14	NC	-	NC.
15	VBAT	P	Power pin.
16	NC	-	NC.
17	NC	-	NC.
18	NC	-	NC.
19	AGND	P	Analog ground pin.
20	MIC-	AI	Negative input of microphone.
21	MIC+	AI	Positive input of microphone.
22	NC	-	NC.
23	NC	-	NC.
24	SPK+	AO	Positive output of audio.
25	SPK-	AO	Negative output of audio.
26	GND	P	Ground pin.
27	NC	-	NC.
28	NC	-	NC.
29	NC	-	NC.
30	P19	I/O	Standard GPIO pin.
31	PA4	I/O	For debugging purposes only. Not for customer use.
32	NC	-	NC.
33	P15	I/O	Standard GPIO pin, which can be reused as SPI_CS.
34	P17	I/O	Standard GPIO pin, which can be reused as SPI_MISO.
35	P14	I/O	Standard GPIO pin, which can be reused as SPI_SCK.
36	P16	I/O	Standard GPIO pin, which can be reused as SPI_MOSI.
37	P34	I/O	Standard GPIO pin, which can be reused as a PWM pin.
38	MUTE	O	The enable pin for the built-in audio power amplifier. Not for customer use.
39	P36	I/O	Standard GPIO pin, which can be reused as a PWM pin.
40	P24	I/O	Standard GPIO pin, which can be reused as a PWM pin.
41	P18	I/O	Standard GPIO pin, which can be reused as a PWM pin.
42	GND	P	Ground pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-55	125	°C
VBAT	Supply voltage	-	-	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-4	4	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-200	200	V

Normal operating conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	85	°C
VBAT	Supply voltage	3.6	5	5.5	V
VOL	I/O low-level output	0	-	0.3	V
VOH	I/O high-level output	3.0	-	3.3	V
Imax	I/O drive current	-	6	20	mA

Radio frequency (RF) power

Operating status	Mode	Rate	Transmit/Receive power	Average value	Peak (Typical) value	Unit
Transmit	11 b	11 Mbit/s	+18 dBm	320	385	mA
Transmit	11 g	54 Mbit/s	+15 dBm	280	344	mA
Transmit	11 n	MCS7	+14 dBm	268	332	mA
Receive	11 b	11 Mbit/s	Continuous reception	17	25	mA
Receive	11 g	54 Mbit/s	Continuous reception	17	25	mA
Receive	11 n	MCS7	Continuous reception	17	25	mA

Operating current

Operating mode	Status (Ta = 25°C)	Average value	Max (Typical) value	Unit
Pairing over Bluetooth	The module is pairing over Bluetooth. The network status indicator blinks slowly.	80	475	mA
Pairing over AP	The module is pairing in AP mode. The network status indicator blinks slowly.	85	470	mA
Connected	The module is connected to the cloud. The network status indicator is steady on.	80	430	mA
Weakly connected	The connection between the module and the access point is intermittent. The network status indicator is steady on.	190	485	mA
Disconnected	The module is disconnected from the cloud. The network status indicator is steady off.	106	480	mA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.412 to 2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n/ax (channels 1–14)
Data transmission rate	IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7, HT40 MCS0-7 IEEE 802.11ax: HE20 MCS0-7, HE40 MCS0-7
Antenna type	PCB antenna

Wi-Fi transmitter (TX) performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power, 802.11b CCK mode, 11 Mbit/s	-	18	-	dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s	-	15	-	dBm
RF average output power, 802.11n OFDM mode, MCS7 (HT20)	-	14	-	dBm
Frequency error	-20	-	20	ppm

Wi-Fi receiver (RX) performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s	-	-88	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s	-	-75	-	dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, MCS7 (HT20)	-	-73	-	dBm
PER < 10%, RX sensitivity, Bluetooth LE, 1 Mbit/s	-	-96	-	dBm

Bluetooth TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Operating frequency	2402	-	2480	MHz
Transmission rate over the air	-	1	-	Mbit/s
Transmission power	-20	6	20	dBm
Frequency error	-150	-	150	kHz

Bluetooth RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity	-	-96	-	dBm
Max RF signal input	-10	-	-	dBm
Intermodulation	-	-	-23	dBm
Co-channel rejection ratio	-	10	-	dB

Antenna information

Antenna type

The T3-V-PRO module uses an onboard PCB antenna.

Antenna interference reduction

When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.

Footprint and production instructions

Mechanical dimensions

Dimensions of the T3-V-PRO PCB are 18±0.35 mm (W) × 30.2±0.35 mm (L) × 0.8±0.1 mm (H).

The figure below shows the recommended footprint of the T3-V-PRO module.

Production instructions

• Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or packaged in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

  • Instruments or devices required for the SMT process:
    • Surface mount system
    • SPI
    • Reflow soldering machine
    • Thermal profiler
    • Automated optical inspection (AOI) equipment
  • Instruments or devices required for the baking process:
    • Cabinet oven
    • Electrostatic discharge (ESD) protection and heat-resistant trays
    • ESD protection and heat-resistant gloves

• A delivered module must meet the following storage requirements:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • A humidity indication card (HIC) is put in the sealed package.

    

• The module needs to be baked in the following cases:

  • The vacuum packaging bag is damaged before unpacking.
  • After unpacking, no HIC is found in the packaging bag.
  • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the first sealing of the bag.

• The baking parameter settings are described below:

  • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
  • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
  • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
  • Production can begin after a module has cooled down to below 36°C under natural conditions.
  • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s
• F: keep a temperature above liquidus temperature for 50s to 70s
• G: peak temperature from 235°C to 245°C
• H: ramp-down slope from 1°C/s to 4°C/s

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
T3-V-PRO	4,400	Tape and reel	1,100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.

This device has got an FCC ID: 2ANDL-T3-V-PRO. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T3-V-PRO”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.