BT8C Module Datasheet

BT8C is an embedded low-power Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8253) and several peripheral components, with an embedded Bluetooth network protocol stack and rich library functions.

Overview

BT8C also contains a low-power 32-bit multipoint control unit (MCU), a Bluetooth 5.0/2.4-GHz radio component, a 521-KB flash memory, a 48-KB static random-access memory (SRAM), and 3 multiplexing I/O interfaces.

Features

• Embedded low-power 32-bit MCU, which can also function as an application processor
• Clock rate: 48 MHz
• Operating voltage: 2.7 to 3.6 V
• Peripherals: 3 PWMs
• Bluetooth RF features
  • Bluetooth LE V4.2/5.0
  • Up to the RF data rate of 2 Mbit/s
  • TX power: +10 dBm
  • RX sensitivity: -90 dBm at 1 Mbit/s
  • Embedded advanced encryption standard (AES) hardware encryption
  • External antenna
  • Operating temperature: -40°C to +85°C

Applications

• Smart LED lights
• Smart households
• Smart low-power sensors

Module interfaces

Dimensions and footprint

BT8C has six pins, for plug-in assembly.

The BT8C dimensions (W x L x H) are 8.50±0.35mm ×12.7±0.35mm ×3.35±0.15mm. The PCB thickness is 1.0±0.1 mm. The BT8C pins show below.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	ANT	I/O	RF input and output port, which is connected to pin ANT on the IC
2	GND	P	Power supply reference ground
3	TL_C5	I/O	Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_C5 on the IC, inverting output with pin 5
4	TL_B1	I/O	Common I/O, which can be used as a PWM output of the LED drive or serial interface receiving pin (UART RX), which is connected to pin TL_B1 on the IC
5	TL_B0	I/O	Common I/O, which can be used as a PWM output of the LED drive or serial interface transmission pin (UART TX), which is connected to pin TL_B0 on the IC
6	3V3	P	Power supply pin (3.3 V)

Note:

• P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
• If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-65	150	℃
VCC	Power supply voltage	-0.3	3.9	V
ESD voltage (human body model)	TAMB-25℃	-	2	kV
ESD voltage (machine model)	TAMB-25℃	-	0.5	kV

Electrical conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	85	℃
VCC	Operating voltage	2.7	3.3	3.6	V
VIL	I/O low-level input	VSS	-	VCC*0.3	V
VIH	I/O high-level input	VCC*0.7	-	VCC	V
VOL	I/O low-level output	VSS	-	VCC*0.1	V
VOH	I/O high-level output	VCC*0.9	-	VCC	V

Operating current

Symbol	Condition	Minimum value(Typical value)	Unit
Itx	Constant transmission, 10dBm output power	22	mA
Irx	Constant receiving	6.3	mA
IDC	Connected to a mesh network (Average)	6.6	mA
IDC	Connected to a mesh network (Peak)	23	mA
Ideepsleep1	Deep sleep mode 1 (The 16-KB RAM is reserved)	1.2	μA
Ideepsleep2	Deep sleep mode 2 (No RAM is reserved)	0.4	μA

RF features

Basic RF features

Parameter	Description
Frequency band	2.4 GHz ISM band
Wireless standard	Bluetooth LE V4.2/5.0
Data transmission rate	1 Mbps, 2 Mbps
Antenna type	External antenna

RF output power

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power	-22	10	10.5	dBm
20 dB modulation signal bandwidth (1 Mbit/s)	-	2500	-	KHz
20 dB modulation signal bandwidth (2 Mbit/s)	-	1400	-	KHz

RF RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity 1Mbps	-	-90	-	dBm
RX sensitivity 2Mbps	-	-87	-	dBm
Frequency offset 1Mbps	-250	-	+300	KHz
Frequency offset 2Mbps	-300	-	+200	KHz
Co-channel interference suppression	-	-10	-	dB

Antenna

Antenna type

BT8C uses an external antenna.

Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

Packaging information and production instructions

Mechanical dimensions

Recommended PCB footprint: In-line manner

Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for some key dimensions is ±0.1 mm. If you have any other requirements, clearly specify them in the datasheet after communication.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	The number of modules per reel	The number of reels per carton
BT8C	5600	Tape reel	1400	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-BT8C. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BT8C”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.