TYWRD2S Module Datasheet

TYWRD2S is a low-power built-in Wi-Fi module that Hangzhou Tuya Inc has developed. It consists of a highly integrated RF chip (RDA5981B) and several peripheral components, with a built-in Wi-Fi network protocol stack and robust library functions.

Overview

TYWRD2S is embedded with a low-power ARM-CM4 MCU, 2 MB flash memory, 448 KB SRAM, and rich peripheral resources.
TYWRD2S is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop built-in Wi-Fi products as required.

Features

• Built-in low power-consuming CPU , which can also be used as an application processor
• Dominant frequency: up to 160 MHz
• Working voltage: 3.0V-3.6V
• Peripherals: Five GPIOs, one UART, and one ADC
• Wi-Fi connectivity
  • 802.11b/g/HT20/
  • Channels 1 to 14 at 2.4 GHz
  • WPA, WPA2, WEP, and TKIP security modes
  • +18 dBm output power in 802.11b mode
  • STA, AP, and STA+AP working modes
  • Smart and AP network configuration modes (for Android and iOS devices)
  • PCB On board antenna
  • Working temperature: -20°C to +85°C

Applications

• Intelligent building
• Smart home and household appliances
• Healthcare
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change history

Date	Change Description	Version After Change
2019-7-26	First Release	V2.0.0
2019-10-26	Delete the Block diagram	V2.0.2

Module interfaces

Dimensions and footprint

TYWRD2S has two rows of pins with a 2 mm pin spacing.
TYWRD2S dimensions (H x W x D) are 3.5±0.15 mm x 15±0.35 mm x 17.97±0.35 mm.,PCB thickness is 0.8mm±0.1 mm,Figure as below :

Interface pin definition

Pin No.	Symbol	I/O Type	Function
1	VCC	P	Power supply pin (3.3V)
2	22	I/O	GPIO_22, a standard PWM interface,which is connected to GPIO22 on the IC
3	GND	P	Power supply reference ground pin
4	23	I/O	GPIO_23, a standard PWM interface,which is connected to GPIO23 on the IC
5	RX	I/O	UART_RX(2), which is connected to GPIO27 on the IC
6	25	I/O	GPIO_25/,a standard PWM interface,which is connected to GPIO25 on the IC
7	TX	I/O	UART_TX(2), which is connected to GPIO26 on the IC
8	ADC(1)	AI	ADC interface(1)
9	IO24	I/O	GPIO_24, a standard PWM interface,which is connected to GPIO24 on the IC
10	RST	I/O	Hardware reset pin (active at a low level)
11	IO3	I/O	GPIO_3, a standard PWM interface,which is connected to GPIO3 on the IC

Note: P indicates power-supply pins, I/O indicates input and output pins, and AI indicates analog input pins. NRST is only a module hardware reset pin and cannot clear the Wi-Fi network configuration.
(1)This pin can only be used as an ADC interface and cannot be used as a common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range is 0 V to 2.0 V.
(2)The UART pins are user-side serial interfaces.

Test Pin Definition

Pin No.	Symbol	I/O Type	Function
-		-	Used for the module production test
-	Output	I/O	UART2_TXD, used to display the module internal information, and corresponding to GPIO2 (pin 22) on the IC
-	IO8	I/O	GPIO_8, corresponding to GPIO8 (pin 13) on the IC
-	IO0	I/O	GPIO_0, corresponding to GPIO0 (pin 36) on the IC

Note: Test pins cannot be used.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum Value	Maximum Value	Unit
Ts	Storage temperature	-20	85	°C
VCC	Power supply voltage	3.0	3.6	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Electrical conditions

Parameter	Description	Minimum Value	Typical Value	Maximum Value	Unit
Ta	Working temperature	-20	N/A	85	°C
VCC	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	VCC*0.3	V
VIH	I/Ohigh-level input	VCC x 0.75	N/A	VCC	V
VOL	I/O low-level output	N/A	N/A	VCC*0.1	V
VoH	I/O high-level output	VCC*0.8	N/A	VCC	V
Imax	I/O drive current	N/A	N/A	10	mA

Continuous TX power dissipation

Working Status	Mode	Rate	TX Power	Typical Value	Peak Value(Typical)	Unit
TX	11b	11Mbps	+17dBm	210	354	mA
TX	11g	54Mbps	+14.5dBm	180	300	mA
TX	11n	MCS7	+12.5dBm	260	170	mA

Continuous RX power dissipation

Working Status	Mode	Rate	Receiving	Typical Value	Peak Value(T
RX	11b	11Mbps	Continuous RX	80	100
RX	11g	54Mbps	Continuous RX	80	100
RX	11n	MCS7	Continuous RX	80	100

Working current

Working Mode	Working Status (Ta = 25°C)	Average Value	Peak Value*(Typical Value)	Unit
Quick configuration	Module in quick net-pairing state	70	335	mA
AP Mode	Module is in Acess Point Mode	80	350	mA
Disconnected	Module not connected to network, Wi-Fi indicator always off	70	240	mA

Note: The preceding parameter values vary depending on the firmware functions.

TX performance

Parameter	Minimum Value	Typical Value	Maximum Value	Unit
Average RF output power, 802.11b CCK mode 11M	-	17	-	dBm
Average RF output power, 802.11g OFDM mode 54M	-	14	-	dBm
Average RF output power, 802.11n OFDM mode MCS7	-	12	-	dBm
Frequency error	-20	N/A	+20	ppm

RX performance

Parameter	Minimum Value	Typical Value	Maximum Value	Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s	N/A	-90	N/A	dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s	N/A	-73	N/A	dBm
PER < 10%, 802.11n OFDM mode MCS7	N/A	-70	N/A	dBm

Antenna

Antenna type

TYWRD2S supports onboard PCB antenna

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

U.FL RF connector

There is no antenna connector in this module.

Packaging information and production instructions

Mechanical dimensions

Side view

SCH footprint

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
  • Time: 48 hours for reelizing and 12 hours for palletizing
  • Alarm temperature: 65°C for reelizing and 135°C for palletizing
  • Production ready temperature after natural cooling: < 36°C
  • The number of drying times: 1
  • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

    Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and Packaging information

Product number	MOQ (pcs)	Shipping packaging method	Modules per reel	Packaging reels per box
TYWRD2S	3600	Carrier tape and reel packing	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYWRD2S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYWRD2S”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.