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MD03 Module Datasheet

Last Updated on : 2021-09-06 07:17:48download

Product overview

Developed by Tuya, MD03 is a Wi-Fi module that is suitable for serial communication of the 5 V TTL. It consists of a highly integrated wireless RF chip (ESP8266EX) and an external flash chip, with an embedded Wi-Fi network protocol stack and rich library functions. MD03 includes a low-power 32-bit CPU, 2-MB flash memory, and 36-KB SRAM.
MD03 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. Based on the serial communication manner, you can develop embedded Wi-Fi products as required.


  • Embedded with a low-power 32-bit CPU, which can also function as an application processor
    • The clock rate supports 80 MHz and 160 MHz
  • Operating voltage: 5V
  • Peripheral: 1 UART
  • Wi-Fi connectivity
    • 802.11 b/g/n20
    • Channels 1 to 14@2.4 GHz
    • Support WPA/WPA2 security mode
    • Up to + 18dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig for Android and iOS devices
    • External antenna with the IPEX connector
    • Operating temperature: -20℃ to 85℃


  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Intelligent bus

Change history

Update date Updated content Version after update
August 10, 2019 This is the first release. V1.0.0
July 3, 2020 Adjust the format V2.0.0

Module interfaces

Dimensions and footprint

The electrical interface of MD03 is the PH-4AW connector with a spacing of 2.54 mm.
As shown in the following figure, the dimensions of MD03 are 31.9±0.35 mm (W)×44.5±0.35 mm (L) ×6.8±0.15 mm (H). The thickness of the PCB is 1.2±0.1 mm.
MD03  Module Datasheet
MD03  Module Datasheet

Pin definition

Pin number Symbol Type Function
1 GND P Power supply reference ground
2 RX I/O Receiving interface for communication of the module, input the level of 5V TTL
3 TX I/O Transmitting interface for communication of the module, output the level of 5V TTL
4 5V P Power supply pin (5V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test pins

Pin number Symbol Type Function
5 3.3V P Power supply pin inside the module (3.3V)
6 GND P Power supply reference ground
7 IO0 I/O The pin for enabling/disabling burning firmware of the module, whose level needs to be pulled down to a low level during firmware burning.
8 R_TX I/O The interface for burning firmware or displaying information.
9 R_RX I/O The interface for burning firmware or displaying information.
10 RST I/O Hardware reset pin

Note: P indicates power supply pins, and I/O indicates input or output pins. When the pin IO0 is pulled up, the module runs normally. When the pin IO0 is at low level, the module is in firmware programming state.
The RST is only a hardware reset pin and cannot be used for clearing information about Wi-Fi network configuration. The test points are prohibited.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VBAT Supply voltage -0.3 5 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal operating conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 - 85
VBAT Supply voltage 4.5 5.0 5.5 V
VIL Voltage Input Low -0.3 - VCC*0.25 V
VIH Voltage Input High VCC*0.75 - VCC V
VOL Voltage Output Low - - VCC*0.1 V
VOH Voltage Output High VCC*0.8 - VCC V
Imax Drive current - - 5 mA

TX power consumption

Operating status Mode Rate Transmit power Average value Peak value (typical value) Unit
Transmit 11b 11Mbps +17dBm 260 268 mA
Transmit 11g 54Mbps +15dBm 100 188 mA
Transmit 11n BW20 MCS7 +13dBm 100 167 mA

RX power consumption:

Operating status Mode Receive Average value Peak value (typical value) Unit
Receive CPU Sleep 11Mbps 70 80 mA
Receive CPU Active 54Mbps 70 78 mA
Receive CPU Active MCS7 70 78 mA

Power consumption in operating mode

Operating mode Operating status, Ta = 25°C Average value Peak value (typical value) Unit
EZ The module is in fast connection state 91 438 mA
Hotspot The module is in hotspot mode 97 462 mA
Connected and operating The module is connected to the network and operating normally 54 422 mA
Disconnected state The module is disconnected 82 435 mA

Note: The peak lasts about 5 to 10ms. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter Description
Operating frequency 2.400 to 2.484 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type External antenna with the U.FL RF connector

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average output power, 802.11b CCK Mode 11M - 17.5 - dBm
Average output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average output power, 802.11n OFDM Mode MCS7 - 13.5 - dBm
Frequency error -20 - 20 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M - -91 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -75 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm

Antenna information

Antenna type

Parameters of the U.FL RF connector are as below:
MD03  Module Datasheet

Antenna interference reduction

To ensure optimal Wi-Fi performance, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
MD03  Module Datasheet
MD03  Module Datasheet

Packaging information and production instructions

Mechanical dimensions

MD03  Module Datasheet![image.png]
Specifications of terminal
The terminal has 4 pins with a spacing of 2.54 mm between each other. Detailed parameters are as follows:
MD03  Module Datasheet

Production instructions

Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%.
  • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.


  • In the production process, all operators must wear electrostatic rings.
  • During operation, strictly prevent the module from getting wet or dirty.

Recommended oven temperature curve

We mount the PCB with the SMT according to the following temperature curve. The peak temperature is 245°C.

MD03  Module Datasheet

Storage conditions

MD03  Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method Number of modules per carton (pcs) Number of reels per carton (reel)
MD03 400 Bubble bags 200 2