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NM1 Module Datasheet

Last Updated on : 2021-04-24 11:07:38download

NM1 is a low-power embedded LPWA module in the NB-IoT series that Tuya has developed. It supports the NB-IoT radio communication protocol (3GPP Rel.13).

Overview

NM1 contains a highly integrated Soc MT2625 ( which is internally embedded with an application processor, a low-power multi-band NB-IoT transceiver and a power management unit (PMU)) and a few peripherals.

NM1 further contains an embedded low-power 32-bit central processing unit (CPU), is integrated with a 32Mb pseudo static random access memory (PSRAM), 32Mb flash memory, and supports interfaces including UART, I2C, SPI, PWM, ADC, USB、keyboard, and USIM.

Features

  • Embedded low-power 32-bit ARM Cortex-M4 processor
  • Power supply voltage
    • Working voltage: 2.1 to 3.63 V
    • Typical working voltage: 3.3 V
  • Peripherals: 26 GPIOs, 3 universal asynchronous receiver/transmitters (UART), 4 pulse width modulations (PWM), 1 analog-to-digital converter (ADC), 1 serial peripheral interface (SPI) and 1 inter-integrated circuit (I2C)
  • SIM: 3V/1.8V SIM card
  • USB interface: USB 1.1
  • NB-IoT network
    • Cat NB1/Cat NB2
    • B1/B2*/B3/B5/B8/B12*/B13*/B17*/B18*/B19*/B20/B25*/B26*/B28*/B66*
    • Maximum transmit power: 23 dBm±2 dB
    • Receiving sensitivity <-123dBm/15kHz (not retransmission)
      • 50Ω characteristic impedance, an antenna provided by the third party
      • Data rate:
        • Single-tone: 25.5 kbps (downlink) and 16.7 kbps (uplink)
        • Multi-tone: 25.5 kbps (downlink) and 62.5 kbps (uplink)
      • Network protocol feature: UDP/TCP/CoAP/LWM2M/ PPP*/SSL*/DTLS*/FTP*/ HTTP*/MQTT*/HTTPS*
  • Working temperature
    • Normal working temperature: -35°C to +75°C1
    • Extended working temperature: -40°C to +85℃2
    • Storage temperature: -40°C to +90℃
  • Upgrade through the main serial interface OTA

Note:
*1 * indicates that when the module works in this temperature range, the relevant performance of the module meets the requirements of 3GPP standard.
*2 * indicates that when the module works in this temperature range, the module can still work normally, and only a few RF indicators may slightly exceed the requirements of 3GPP specification.

Applications

  • Public utilities: meter reading (water, gas and electricity), intelligent water affairs (pipe network, leakage and quality inspection), smart fire extinguisher, fire hydrant, etc.
  • Smart health: drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart armor monitoring, baby monitor, etc.
  • Smart city: smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
  • Consumers: wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets and vehicle rental), and payment/POS machines
  • Agricultural environment: precision planting (environment parameters: water, temperature, sunshine, biocide and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
  • Logistics warehousing: asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking
  • Smart building: access control, smart HVAC, smoke detection, fire detection and elevator failure/repair
  • Manufacturing industry: production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment and predictive maintenance (home appliances, machinery, etc.)

Change history

Date Updated content Version after update
07/18/2019 This is the first release. V1.0.0

Module interfaces

Pin distribution

NM1 has 66 pins in total. Among them, there are 52 LCC pins and 14 LGA pins. This part illustrates module interfaces and their definitions in details.
NM1 Module Datasheet

Pin definition

Pin Number Symbo I/O Type Functions Remarks
1 GND GND
2 GPIO0 I GPIO0 1.8V, GPIO0 needs to be pulled down to the low level in the USB download mode
3 SPI_MISO I Master input slave output/GPIO14 1.8V, support only the slave mode
4 SPI_MOSI O Master output slave input/GPIO13 1.8V, support only the slave mode
5 SPI_SCLK O Serial clock signal/GPIO15 1.8V, support only the slave mode
6 SPI_CS O Chip selection signal/GPIO12 1.8V, support only the slave mode
7 PWRKEY I Pull down PWRKEY to start the module V IL max=0.3VBAT and V IH min=0.7VBAT
8 GPIO22 GPIO22
9 ADC0 I A universal analog-to-digital converter 0 to 1.4V (by default, firmware does not support ADC0)
10 SIM_GND A SIM card dedicated place
11 SIM_DATA A SIM card data signal V IL max=0.25SIM_VDD, V IH min=0.75SIM_VDD, V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
12 SIM_RST SIM card reset signal V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
13 SIM_CLK SIM card clock signal V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
14 SIM_VDD SIM card power supply
15 RESET I Reset module 3.3V, active low
16 NETLIGHT I/O GPIO20 A universal GPIO interface If you need the network indication function, the pin is recommended
17 UART0_RXD I A main serial port, which is used for receiving data 1.8V Please pay attention to reference level conversion
18 UART0_TXD O A main serial port, which is used for transmitting data 1.8V Please pay attention to reference level conversion
19 PSM_EINT I An external interrupt pin, which can wake up the module in the PSM mode 3.3V, active low
20 SRCLKENAI NFC interface
21 USB_DP USB data positive signal USB download, PIN 63 needs the voltage of 3.3V
22 USB_DM USB data minus signal U B download, PIN 63 needs the voltage of 3.3V
23 USB_EINT USB_EINT
24 VIO18_EXT O 1.8V output power supply (no output in PSM mode) Vmin=1.53V, Vnorm=1.8V
25 DVDD_IO NC NC NC
26 NC NC
27 GND GND
28 UART1_RXD I A default universal docking user serial interface, which is used for receiving data 1.8V Please pay attention to reference level conversion
29 UART1_TXD O A default universal docking user serial interface, which is used for transmitting data 1.8V Please pay attention to reference level conversion
30 UART1_CTS Whether to receive data 1.8V Please pay attention to reference level conversion
31 UART1_RTS Whether to transmit data 1.8V Please pay attention to reference level conversion
32 I2C0_SDA I/O I2C0_data/GPIO7 A default I2C interface
33 I2C0_SCL O I2C0_clock/GPIO6 A default I2C interface
34 GND GND
35 RF_ANT RF_antenna 50Ω characteristic impedance
36, 37 GND GND
38 UART2_RXD I Receive data By default, it is log serial interface. 1.8V Please pay attention to the reference level conversion
39 UART2_TXD O Transmit data By default, it is log serial interface. 1.8V Please pay attention to the reference level conversion
40, 41 GND GND
42 VSYS_BB I Input power supply V=2.1 to 3.63V, Vnorm=3.3V
43 VBAT_BOOST I Input power supply V=2.1 to 3.63V, Vnorm=3.3V
44 VSYS_PA O Output power suppl 3.3V
45 GPIO11 NC
46 GPIO10 NC
47 GPIO25 NC
48 MD_WAKEUP GPIO27
49 GPIO28 NC
50 AP_READY GPIO29
51 STATUS GPIO26
52 GPIO24 NC
53 GPIO34 NC
54 GPIO33 NC
55 GPIO21 NC
56 GPIO20 NC
57 GPIO8 NC
58 GPIO1 NC
59 GPIO19 NC
60 RTC_GPIO0 DCDC ENABLE Not recommended for external use
61 SIM_DET* GPIO35 SIM card detection pin, currently not supported
62 GPIO32 NC
63 AVDD33_VUSB I Internal USB power supply The voltage of 3.3V
64 FREF Reference frequency
65 GPIO31 NC
66 GND GND

Note: “*” indicates “still under development” and “currently not supported”.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 90
VBAT Power supply voltage 2.1 3.63 V
Contact discharge VBAT, GND -5 +5 KV
Contact discharge Antenna interface -5 +5 KV
Contact discharge Other interfaces -0.5 +0.5 KV
Air discharge VBAT, GND -10 +10 KV
Air discharge Antenna interface -10 +10 KV
Air discharge Other interfaces -1 +1 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -35 25 75
VBAT Power supply voltage 2.1 3.3 3.63 V
VIL IO low level output -0.3 - VCC*0.25 V
VIH IO high level input VCC*0.75 - VCC V
VOL IO low level output - - VCC*0.1 V
VOH IO high level output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

TX and RX power consumption

Working mode Description Average value Peak value (Typical value) Unit
PSM Deep Sleep 3 / μA
Idle eDRX=81.92S,PTW=40.96S 287 / μA
Idle @DRX=1.28S 540 / μA
Idle @DRX=2.56S 436 / μA
Single-tone carrier frequency of 15kHz B1@23 dBm 99 280 mA
Single-tone carrier frequency of 15kHz B3@23 dBm 106 310 mA
Single-tone carrier frequency of 15kHz B5@23 dBm 105 305 mA
Single-tone carrier frequency of 15kHz B8@23 dBm 108 320 mA
Single-tone carrier frequency of 15kHz B20@23 dBm 109 300 mA
Single-tone carrier frequency of 3.75kHz B1@23 dBm 193 300 mA
Single-tone carrier frequency of 3.75kHz B3@23 dBm 212 332 mA
Single-tone carrier frequency of 3.75kHz B5@23 dBm 213 330 mA
Single-tone carrier frequency of 3.75kHz B8@23 dBm 224 342 mA
Single-tone carrier frequency of 3.75kHz B20@23 dBm 217 325 mA

RF parameters

Basic RF features

Parameter Description
Working frequency Band 1: 1920-1980MHz; 2110-2170 Mhz Band 3: 1710-1785Mhz; 1805-1880 Mhz Band 5: 824-849 Mhz; 869-894 Mhz Band 8: 880-915 Mhz; 925-960 Mhz Band 20: 832-862 Mhz; 791-821 MHz
NB-IoT standards 3GPP 36.521
6.2.2F UE maximum output power for category NB1
6.2.3F maximum power reduction (MPR) for category NB1
6.2.5F configured UE transmitted output power for UE category NB1
6.3.2F minimum output power for category NB1
6.3.3F transmit off power for category NB1
6.3.4 F1 ON/OFF time mask for category NB1
6.3.4.F2 NPRACH time mask for category NB1
6.3.5F.2 power control relative power tolerance for category NB1
6.3.5F.1 power control absolute power tolerance for category NB1
6.5.1F frequency error for category NB1
6.5.2.1F.1 error vector magnitude (EVM) for category NB1
6.5.2.2F carrier leakage for category NB1
6.5.2.3F in-band emissions for non-allocated RB for category NB1
6.6.1F occupied bandwidth for category NB1
6.6.2.1F spectrum emission Mask for category NB1
6.6.2.3F adjacent channel leakage power ratio for category NB1
7.3F.1 reference sensitivity level without repetitions for category NB1
7.4F maximum input level for category NB1
Data transmission rate Single-tone: 25.5 kbps (downlink), 16.7 kbps (uplink) Multi-tone: 25.5 kbps (downlink), 62.5kbps (uplink)
Antenna type Antenna provided by the third party (external antenna, FPC antenna, etc.)

TX performance

TX Performance

Frequency Band Minimum value Maximum value Unit
B1 <-39 23 dBm±2 dB dBm
B3 <-39 23 dBm±2 dB dBm
B5 <-39 23 dBm±2 dB dBm
B8 <-39 23 dBm±2 dB dBm
B20 <-39 23 dBm±2 dB dBm
B2*/B12*/B13*/B17*/B18*/B19*/B25*/B26*/B28*/B66* developing developing dBm

RX performance

RX sensitivity

Frequency Band Typical value Unit
Band 1 -123.8 dBm/15 kHz dBm
Band 3 -123.8 dBm/15 kHz dBm
Band 5 -123.8 dBm/15 kHz dBm
Band 8 -123.8 dBm/15 kHz dBm
Band 20 -123.8 dBm/15 kHz dBm

Antenna information

Antenna type

The module does not have its own PCB board antenna, and the third party needs to provide an antenna. The antenna can be an external rod antenna, a spring antenna, an IPEX-FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

NM1 Module Datasheet

NM1 Module Datasheet

NM1 Module Datasheet

Antenna interference reduction

To ensure optimal NB-IoT performance, it is recommended that the antenna be at least 10mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

NM1 has 66 pins in total. 52 pins are LCC package, and 14 pins are LGA package.
The NM1 dimensions are 17.7±0.35mm (L)×15.8±0.35mm (W) ×2.4±0.15mm (H), which are shown as belows:
The PCB thickness tolerance is ±0.1mm.

NM1 Module Datasheet
NM1 Module Datasheet

Side view

NM1 Module Datasheet

Schematic diagram of packaging

NM1 Module Datasheet

Diagram of PCB Packaging-SMT

NM1 Module Datasheet

Top/bottom/side view of the module

NM1 Module Datasheet
NM1 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      NM1 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

NM1 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

NM1 Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
NM1 5600 Tape reel 1400 4