NM1 Module Datasheet

NM1 is a low-power embedded LPWA module in the NB-IoT series that Tuya has developed. It supports the NB-IoT radio communication protocol (3GPP Rel.13).

Overview

NM1 contains a highly integrated Soc MT2625 (which is internally embedded with an application processor, a low-power multi-band NB-IoT transceiver and a power management unit (PMU)) and a few peripherals.

NM1 further contains an embedded low-power 32-bit central processing unit (CPU), is integrated with a 32Mb pseudo static random access memory (PSRAM), 32Mb flash memory, and supports interfaces including UART, I2C, SPI, PWM, ADC, USB, keyboard, and USIM.

Features

• Embedded low-power 32-bit ARM Cortex-M4 processor
• Power supply voltage
  • Working voltage: 2.1 to 3.63 V
  • Typical working voltage: 3.3 V

• Peripherals: 26 GPIOs, 3 universal asynchronous receiver/transmitters (UART), 4 pulse width modulations (PWM), 1 analog-to-digital converter (ADC), 1 serial peripheral interface (SPI), and 1 inter-integrated circuit (I2C)
• SIM: 3V/1.8V SIM card
• USB interface: USB 1.1
• NB-IoT network
  • Cat NB1/Cat NB2
  • B1/B2/B3/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26/B28/B66
  • Maximum transmit power: 23 dBm±2 dB
  • Receiving sensitivity ＜-123dBm/15kHz (not retransmission)
    • 50Ω characteristic impedance, an antenna provided by the third party
    • Data rate:
      • Single-tone: 25.5 kbps (downlink) and 16.7 kbps (uplink)
      • Multi-tone: 25.5 kbps (downlink) and 62.5 kbps (uplink)
    • Network protocol feature: UDP/TCP/CoAP/LWM2M/ PPP*/SSL*/DTLS*/FTP*/ HTTP*/MQTT*/HTTPS*
• Working temperature
  • Normal working temperature: -35°C to +75°C¹
  • Extended working temperature: -40°C to +85℃²
• Upgrade through the main serial interface OTA

Note:

• 1 indicates that when the module works in this temperature range, the relevant performance of the module meets the requirements of the 3GPP standard.
• 2 indicates that when the module works in this temperature range, the module can still work normally, and only a few RF indicators may slightly exceed the requirements of the 3GPP specification.

Applications

• Public utilities: Meter reading (water, gas, and electricity), intelligent water affairs (pipe network, leakage, and quality inspection), smart fire extinguisher, fire hydrant, etc.
• Smart health: Drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart monitoring, baby monitor, etc.
• Smart city: Smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
• Consumers: Wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets, and vehicle rental), and payment/POS machines
• Agricultural environment: Precision planting (environment parameters: water, temperature, sunshine, biocide, and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
• Logistics warehousing: Asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking
• Smart building: Access control, smart HVAC, smoke detection, fire detection, and elevator failure/repair
• Manufacturing industry: Production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment, and predictive maintenance (home appliances, machinery, etc.)

Module interfaces

Pin distribution

NM1 has 66 pins in total. Among them, there are 52 LCC pins and 14 LGA pins. This part illustrates module interfaces and their definitions in detail.

Pin definition

Pin Number	Symbo	I/O Type	Functions	Remarks
1	GND	–	GND	–
2	GPIO0	I	GPIO0	1.8V, GPIO0 needs to be pulled down to the low level in the USB download mode, do not pull down before power on, otherwise it will not start
3	SPI_MISO	I	Master input slave output/GPIO14	1.8V, support only the slave mode
4	SPI_MOSI	O	Master output slave input/GPIO13	1.8V, support only the slave mode
5	SPI_SCLK	O	Serial clock signal/GPIO15	1.8V, support only the slave mode
6	SPI_CS	O	Chip selection signal/GPIO12	1.8V, support only the slave mode
7	PWRKEY	I	Pull down PWRKEY to start the module	V IL max=0.3VBAT and V IH min=0.7VBAT
8	GPIO22	–	GPIO22	–
9	ADC0	I	A universal analog-to-digital converter	0 to 1.4V (by default, the firmware does not support ADC0)
10	SIM_GND	–	A SIM card dedicated place	–
11	SIM_DATA	–	A SIM card data signal	V IL max=0.25SIM_VDD, V IH min=0.75SIM_VDD, V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
12	SIM_RST	–	SIM card reset signal	V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
13	SIM_CLK	–	SIM card clock signal	V OL max=0.15SIM_VDD, V OH min=0.85SIM_VDD
14	SIM_VDD	–	SIM card power supply	–
15	RESET	I	Reset module	3.3V, active low
16	NETLIGHT	I/O	GPIO20	A universal GPIO interface If you need the network indication function, the pin is recommended
17	UART0_RXD	I	A main serial port, which is used for receiving data	1.8V Please pay attention to reference level conversion
18	UART0_TXD	O	A main serial port, which is used for transmitting data	1.8V Please pay attention to reference level conversion
19	PSM_EINT	I	An external interrupt pin, which can wake up the module in the PSM mode	3.3V, active low
20	SRCLKENAI	–	NFC interface	–
21	USB_DP	–	USB data positive signal	USB download, PIN 63 needs a voltage of 3.3V
22	USB_DM	–	USB data minus signal	U B download, PIN 63 needs a voltage of 3.3V
23	USB_EINT	–	USB_EINT	–
24	VIO18_EXT	O	1.8V output power supply (no output in PSM mode)	Vmin=1.53V, Vnorm=1.8V
25	DVDD_IO	NC	NC	NC
26	NC	–	NC	–
27	GND	–	GND	–
28	UART1_RXD	I	A default universal docking user serial interface, which is used for receiving data	1.8V Please pay attention to reference level conversion
29	UART1_TXD	O	A default universal docking user serial interface, which is used for transmitting data	1.8V Please pay attention to reference level conversion
30	UART1_CTS	–	Whether to receive data	1.8V Please pay attention to reference level conversion
31	UART1_RTS	–	Whether to transmit data	1.8V Please pay attention to reference level conversion
32	I2C0_SDA	I/O	I2C0_data/GPIO7	A default I2C interface
33	I2C0_SCL	O	I2C0_clock/GPIO6	A default I2C interface
34	GND	–	GND	–
35	RF_ANT	–	RF_antenna	50Ω characteristic impedance
36, 37	GND	–	GND	–
38	UART2_RXD	I	Receive data	By default, it is a log serial interface. 1.8V Please pay attention to the reference level conversion
39	UART2_TXD	O	Transmit data	By default, it is a log serial interface. 1.8V Please pay attention to the reference level conversion
40, 41	GND	–	GND	–
42	VSYS_BB	I	Input power supply	V=2.1 to 3.63V, Vnorm=3.3V
43	VBAT_BOOST	I	Input power supply	V=2.1 to 3.63V, Vnorm=3.3V
44	VSYS_PA	O	Output power suppl	3.3V
45	GPIO11	–	NC	–
46	GPIO10	–	NC	–
47	GPIO25	–	NC	–
48	MD_WAKEUP	–	GPIO27	–
49	GPIO28	–	NC	–
50	AP_READY	–	GPIO29	–
51	STATUS	–	GPIO26	–
52	GPIO24	–	NC	–
53	GPIO34	–	NC	–
54	GPIO33	–	NC	–
55	GPIO21	–	NC	–
56	GPIO20	–	NC	–
57	GPIO8	–	NC	–
58	GPIO1	–	NC	–
59	GPIO19	–	NC	–
60	RTC_GPIO0	–	DCDC ENABLE	Not recommended for external use
61	SIM_DET*	–	GPIO35	SIM card detection pin, currently not supported
62	GPIO32	–	NC	–
63	AVDD33_VUSB	I	Internal USB power supply	The voltage of 3.3V
64	FREF	–	Reference frequency	–
65	GPIO31	–	NC	–
66	GND	–	GND	–

Note: * indicates still under development and currently not supported.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	90	℃
VBAT	Power supply voltage	2.1	3.63	V
Contact discharge	VBAT, GND	-5	+5	KV
Contact discharge	Antenna interface	-5	+5	KV
Contact discharge	Other interfaces	-0.5	+0.5	KV
Air discharge	VBAT, GND	-10	+10	KV
Air discharge	Antenna interface	-10	+10	KV
Air discharge	Other interfaces	-1	+1	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-35	25	75	℃
VBAT	Power supply voltage	2.1	3.3	3.63	V
VIL	I/O low-level output	-0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	VCC	V
VOL	I/O low-level output	-	-	VCC*0.1	V
VOH	I/O high-level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

TX and RX power consumption

Working mode	Description	Average value	Peak value (Typical value)	Unit
PSM	Deep Sleep	3	/	μA
Idle	eDRX=81.92S,PTW=40.96S	287	/	μA
Idle	@DRX=1.28S	540	/	μA
Idle	@DRX=2.56S	436	/	μA
Single-tone carrier frequency of 15kHz	B1@23 dBm	99	280	mA
Single-tone carrier frequency of 15kHz	B3@23 dBm	106	310	mA
Single-tone carrier frequency of 15kHz	B5@23 dBm	105	305	mA
Single-tone carrier frequency of 15kHz	B8@23 dBm	108	320	mA
Single-tone carrier frequency of 15kHz	B20@23 dBm	109	300	mA
Single-tone carrier frequency of 3.75kHz	B1@23 dBm	193	300	mA
Single-tone carrier frequency of 3.75kHz	B3@23 dBm	212	332	mA
Single-tone carrier frequency of 3.75kHz	B5@23 dBm	213	330	mA
Single-tone carrier frequency of 3.75kHz	B8@23 dBm	224	342	mA
Single-tone carrier frequency of 3.75kHz	B20@23 dBm	217	325	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	Band 1: 1920-1980MHz, 2110-2170 Mhz Band 3: 1710-1785Mhz, 1805-1880 Mhz Band 5: 824-849 Mhz, 869-894 Mhz Band 8: 880-915 Mhz, 925-960 Mhz Band 20: 832-862 Mhz, 791-821 MHz
NB-IoT standards	3GPP 36.521
	6.2.2F UE maximum output power for category NB1
	6.2.3F maximum power reduction (MPR) for category NB1
	6.2.5F configured UE transmitted output power for UE category NB1
	6.3.2F minimum output power for category NB1
	6.3.3F transmit off power for category NB1
	6.3.4 F1 ON/OFF time mask for category NB1
	6.3.4.F2 NPRACH time mask for category NB1
	6.3.5F.2 power control relative power tolerance for category NB1
	6.3.5F.1 power control absolute power tolerance for category NB1
	6.5.1F frequency error for category NB1
	6.5.2.1F.1 error vector magnitude (EVM) for category NB1
	6.5.2.2F carrier leakage for category NB1
	6.5.2.3F in-band emissions for non-allocated RB for category NB1
	6.6.1F occupied bandwidth for category NB1
	6.6.2.1F spectrum emission Mask for category NB1
	6.6.2.3F adjacent channel leakage power ratio for category NB1
	7.3F.1 reference sensitivity level without repetitions for category NB1
	7.4F maximum input level for category NB1
Data transmission rate	Single-tone: 25.5 kbps (downlink), 16.7 kbps (uplink) Multi-tone: 25.5 kbps (downlink), 62.5kbps (uplink)
Antenna type	Antenna provided by the third party (external antenna, FPC antenna, etc.)

TX performance

TX Performance

Frequency band	Minimum value	Maximum value	Unit
B1	<-39	23 dBm±2 dB	dBm
B3	<-39	23 dBm±2 dB	dBm
B5	<-39	23 dBm±2 dB	dBm
B8	<-39	23 dBm±2 dB	dBm
B20	<-39	23 dBm±2 dB	dBm

RX performance

RX sensitivity

Frequency Band	Typical value	Unit
Band 1	-123.8 dBm/15 kHz	dBm
Band 3	-123.8 dBm/15 kHz	dBm
Band 5	-123.8 dBm/15 kHz	dBm
Band 8	-123.8 dBm/15 kHz	dBm
Band 20	-123.8 dBm/15 kHz	dBm

Antenna information

Antenna type

The module does not have its own PCB board antenna, and the third party needs to provide an antenna. The antenna can be an external rod antenna, a spring antenna, an IPEX-FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

Antenna interference reduction

To ensure optimal NB-IoT performance, it is recommended that the antenna be at least 10mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

NM1 has 66 pins in total. 52 pins are the LCC package, and 14 pins are the LGA package.
The NM1 dimensions are 17.7±0.35mm (L)×15.8±0.35mm (W) ×2.3±0.15mm (H), which are shown as below:
The PCB thickness tolerance is ±0.1mm.

Top and bottom view

Side view

Schematic diagram of packaging

Diagram of PCB Packaging-SMT

Top/bottom/side view of the module

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
NM1	5600	Tape reel	1400	4