WBR3L Module Datasheet

WBR3L is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated wireless RF chip (W701H-VT2-CG), with an embedded Wi-Fi network protocol stack and varied library functions.

Overview

With the maximum CPU clock rate of 100MHz, WBR3L also contains a low-power KM4 microcontroller unit (MCU), a WLAN MAC, a 1T1R WLAN module, 256-KB static random-access memory (SRAM), 2-MB flash memory, and extensive peripherals. WBR3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power KM4 MCU, which can also function as an application processor; Clock rate: 100MHz
• Working voltage: 3.0 to 3.6 V
• Peripherals: 9 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 log transmitter
• Wi-Fi/BT connectivity
  • 802.11 B/G/N20
  • Channels 1 to 14 at 2.4 Ghz (channels 1 to 11 for US/CA and channels 1 to 13 for EU/CN)
  • Support WEP/WPA/WPA2/WPA2 PSK (AES) security modes
  • Support Bluetooth (Bluetooth Low Energy) 4.2
  • Up to +20 dBm output power in 802.11b mode
  • Support SmartConfig functions for Android and iOS devices
  • Onboard PCB antenna
  • Passed CE and FCC certification
  • Working temperature: -40°C to 105°C

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WBR3L has two rows of pins with a 2 mm pin spacing. Each row has 8 pins. The WBR3L dimensions are 16±0.35 mm (W)×24±0.35 mm (L) ×2.9±0.15 mm (H). The dimensions of WBR3L as follows:

Pin definition

The definition of interface pins is shown in the following table:

Pin number	Symbol	I/O type	Function
1	NC	/	It is pulled up to be compatible with other modules
2	A_7	I/O	GPIOA_7, hardware PWM, IC Pin 21
3	EN	I/O	Enabling pin, which works at the high level and is pulled up and controlled by a user externally
4	A_11	I/O	GPIOA_11, hardware PWM, IC Pin 25
5	A_2	I/O	GPIOA_2, hardware PWM, IC Pin 18
6	A_3	I/O	GPIOA_3, hardware PWM, IC Pin 19
7	A_4	I/O	GPIOA_4, hardware PWM, IC Pin 20
8	VCC	P	Power supply pin (3.3V)
9	GND	P	Power supply reference ground
10	A_12	I/O	GPIOA_12, hardware PWM, IC Pin 26
11	A_16	I/O	GPIOA_16, UART_Log_TXD, which is used for displaying the module internal information and can be configured as a common GPIO
12	A_17	I/O	GPIOA_17, hardware PWM, IC Pin 38
13	A_18	I/O	GPIOA_18, hardware PWM, IC Pin 39
14	A_19	I/O	GPIOA_19, hardware PWM, IC Pin 40
15	RXD	I/O	GPIOA_13, UART0_RXD, which is used as a user-side serial interface pin
16	TXD	I/O	GPIOA_14, UART0_TXD, which is used as a user-side serial interface pin

Note: P indicates power supply pins and I/O indicates input/output pins.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	℃
VDD	Power supply voltage	-0.3	3.6	V
Static electricity discharge voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity discharge voltage (machine model)	TAMB-25℃	-	0.5	KV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	-	105	℃
VDD	Working voltage	3.0	-	3.6	V
VIL	I/O low-level input	-	-	0.8	V
VIH	I/O high-level input	2.0	-	-	V
VOL	I/O low-level output	-	-	0.4	V
VOH	I/O high-level output	2.4	-	-	V
Imax	I/O drive current	-	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

RF power consumption

TX power consumption:

Symbol	Mode	Average value	Peak value (Typical value)	Unit
IRF	11B 11M	63	65	mA
IRF	11G 54M	65	67	mA
IRF	11N HT20 MCS7	65	67	mA

RX power consumption:

Symbol	Mode	Average value	Peak value (Typical value)	Unit
IRF	11B 11M	63	65	mA
IRF	11G 54M	65	67	mA
IRF	11N HT20 MCS7	65	67	mA

Working power consumption

Working mode	Working status (Ta = 25°C)	Average value	Peak value (Typical value)	Unit
Quick connection network status	The module is in the fast network connection state and the Wi-Fi indicator always flashes	75	324	mA
Network connection idle state	The module is connected to the network and the Wi-Fi indicator is always on	64	314	mA
Network connection operation status	The module is connected to the network and the Wi-Fi indicator is always on	66	305	mA
Disconnected status	The module is offline and the Wi-Fi indicator is dark	66	309	mA

RF parameters

Basic RF features

Parameter	Description
Frequency range	2.400 to 2.4835 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth standard	Bluetooth 4.2
Data transmission rate	Data transmission rate
Data transmission rate	11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
Data transmission rate	11n: HT20 MCS 0 to 7
Antenna Type	PCB antenna with a gain of 1.82 dBi

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode, 1 Mbit/s	-	17.5	-	dBm
Average RF output power, 802.11g OFDM mode, 54 Mbit/s	-	14.5	-	dBm
Average RF output power, 802.11n OFDM mode, MCS7	-	13.5	-	dBm
Average RF output power, Bluetooth 4.2, 1 Mbit/s	-	6.5	-	dBm
Frequency error	-20	-	20	ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm	-	-	-10	dB
EVM@802.11g OFDM 54Mbps Mode 14.5dBm	-	-	-29	dB
EVM@802.11n OFDM MCS7 Mode 13.5dBm	-	-	-30	dB

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M	-	-97	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm
PER<10%, RX sensitivity, Bluetooth 4.2 1M	-	-93	-	dBm

Antenna

Antenna type

WBR3L uses only an onboard PCB antenna with a gain of 1.82 dBi.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

Power-on/off sequence

Power-on sequence

The W701H chip has requirements on the power-on sequence. It is recommended that the voltage rises from 0 to 3.3V within 20 ms.

Power-off sequence

Symbol	Parameter	Minimum value	Typical value	Maximum value	Unit
TPRDY	3.3V ready time	0.6	-	20	ms
CHIP_EN	CHIP_EN ready time	0.6	-	20	ms
VBOR	BOR occurs after 3.3V is lower than this voltage	2	-	-	V
TRST	The required time that 3.3V is lower than VBOR	1	-	-	ms

Packaging information and production instructions

Mechanical dimensions

The mechanical dimensions of the PCB of WBR3L are 16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H). The following figure shows the mechanical dimensions of WBR3L.

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Recommended PCB layout

The following figure is a schematic diagram of WBR3L which shows how pins correspond to each other.

WBR3L PCB Layout is shown as below:

Pin header specifications

WBR3L supports stamp hole connection and pin array connection. Which one is used depends on actual situations. Dimensions and recommended layout of pin headers are as follows (unit: mm):

Production instructions

1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • (SMT process) SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • (Wave soldering process) Wave soldering devices
     • Wave soldering equipment
     • Wave soldering fixture
     • Constant-temperature soldering iron
     • Tin bar, tin wire and flux
     • Thermal profiler
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them.Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
WBR3L	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBR3L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBR3L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.