WRG2-IPEX Module Datasheet

WRG2-IPEX is a Tuya Wi-Fi module featured in gateway Armcore. It consists of a highly integrated RF chip (8197FS) and peripherals. Besides, it has rich peripheral interfaces and the Realtek 2x2 Wi-Fi.

Features

• Basic features

  • Support the 2x2 IEEE 802.11 b/g/n mode
  • Support the band width of 40MHz
  • Maximum transmit power: 18 dB
  • Receive power: -99dB@1M
  • Frequency band: 2412 MHz to 2484 MHz

• Working conditions

  • Voltage range: 3.15 to 3.45V. The recommended voltage: 3.3V
  • Working temperature: 0 to 75℃

• Security feature: Support WPA-PSK/WPA2-PSK/WPA/WPA2/AES 128

Applications

The module featured in gateway Armcore is used for finished products, such as gateway.

Module interfaces

Dimensions and footprint

WRG2-IPEX has 74 pins in total. The distance between two pins is 1.4±0.1 mm.

The dimensions of WRG2-IPEX are 42±0.35 mm (L)×33±0.35 mm (W) ×3.4±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

WRG2-IPEX is shown below:

Pin definition

Note:
The above is the default pin definition of Tuya. Currently, there is no PA in the module featured in gateway Armcore. Its purpose is to achieve the PTA function.
If you have any other definitions and requirements on pins, please contact Tuya business personnel.

Electrical parameters

Absolute electrical parameters

Normal working conditions

Power consumption during consistent transmission and reception and in power-consumption state

RF parameters

Basic RF features

TX performance

TX performance

RX performance

RX sensitivity

Packaging information and production instructions

Mechanical dimensions

The dimensions of the PCB are 42±0.35 mm (L)×33±0.35 mm (W) ×0.8±0.1 mm (H)

Recommended PCB footprint

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information