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WRG2-IPEX Module Datasheet

Last Updated on : 2021-06-21 07:52:40download

WRG2-IPEX is a Tuya Wi-Fi module featured in gateway Armcore. It consists of a highly integrated RF chip (8197FS) and peripherals. Besides, it has rich peripheral interfaces and the Realtek 2x2 Wi-Fi.

Features

  • Basic features

    • Support the 2x2 IEEE 802.11 b/g/n mode
    • Support the band width of 40MHz
    • Maximum transmit power: 18 dB
    • Receive power: -99dB@1M
    • Frequency band: 2412 MHz to 2484 MHz
  • Working conditions

    • Voltage range: 3.15 to 3.45V. The recommended voltage: 3.3V
    • Working temperature: 0 to 75℃
  • Security feature: Support WPA-PSK/WPA2-PSK/WPA/WPA2/AES 128

Applications

The module featured in gateway Armcore is used for finished products, such as gateway.

Change history

Update date Updated content Version after update
April 2, 2021 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

WRG2-IPEX has 74 pins in total. The distance between two pins is 1.4±0.1 mm.

The dimensions of WRG2-IPEX are 42±0.35 mm (L)×33±0.35 mm (W) ×3.4±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

WRG2-IPEX is shown below:

WRG2-IPEX Module Datasheet

Pin definition

WRG2-IPEX Module Datasheet

Pin number The corresponded pin on the IC Function
1 Pin 66 Default IIS_MCLK
2 Pin128 Default IIS_SCLK
3 Pin 70 Default IIS_WS
4 Pin 3 Default IIS_SD
5 Pin 73 Default IIC_SDA
6 Pin 71 Default IIC_SCL
7 GND GND
8 Pin 4 Default UART1_CTS
9 Pin 75 Default UART1_RX
10 Pin 5 Default UART1_TX
11 Pin 76 Default UART1_RTS
12 GND GND
13 Pin 80 If the SD function uses the pin, the output voltage is 1.8V/3.3V.
14 Pin 127 Optionally connected to the SD card. Used to enable or disable the power supply to the SD card, or used as a GPIO
15 Pin 67 Optionally connected to the SD card. Used to write protection to the SD card, or used as a GPIO.
16 Pin 69 Optionally connected to the SD card. Used to detect the SD card, or used as a GPIO.
17 Pin 10 Optionally connected to the SD card. Used to output the clock signal of the SD card, or used as a GPIO.
18 Pin 11 Optionally connected to the SD card. Used to output a command to the SD card, or used as a GPIO.
19 Pin 8 Optionally connected to the SD card. Used for data transmission of the SD card, or used as a UART2_RX.
20 Pin 78 Optionally connected to the SD card. Used for data transmission of the SD card, or used as a UART2_CTS.
21 Pin 83 Optionally connected to the SD card. Used for data transmission of the SD card, or used as a UART2_RTS.
22 Pin 12 Optionally connected to the SD card. Used for data transmission of the SD card, or used as a UART2_TX.
23 GND GND
24 Pin 82 By default, the pin is a common GPIO.
25 Pin 9 By default, the pin is a common GPIO.
26 Pin 79 By default, the pin is a common GPIO.
27 Pin 81 By default, the pin is a common GPIO.
28 GND GND
29 Pin 28 By default, the pin is used as a LED light or a common GPIO.
30 Pin 42 By default, the pin is used as a LED light or a common GPIO.
31 Pin 43 By default, the pin is used as a LED light or a common GPIO.
32 Pin 106 By default, the pin is used as a LED light or a common GPIO.
33 Pin 38 By default, it is used as UART0_RX for receiving logs.
34 Pin 101 By default, it is used as UART0_TX for transmitting logs.
35 GND GND
36 VDD5_ATX If a PA is added, the external power supply of 5V is needed. If a PA is not needed, do not connect the pin to anything.
37 VDD5_ATX If a PA is added, the external power supply of 5V is needed. If a PA is not needed, do not connect the pin to anything.
38 GND GND
39 Pin 93 By default, if a PA is not added, it can be used as a GPIO. If a PA is added, the pin needs to act as the PA control pin.
40 Pin 27 By default, if a PA is not added, it can be used as a GPIO. If a PA is added, the pin needs to act as the PA control pin.
41 Pin 92 By default, if a PA is not added, it can be used as a PTA control pin.
42 Pin 46 By default, if a PA is not added, it can be used as a PTA control pin.
43 Pin 108 By default, if a PA is not added, it can be used as a PTA control pin.
44 Pin 47 By default, a PA is not added, it can be used as a GPIO. If a PA is added, the pin needs to act as the PA control pin.
45 Pin 110 By default, if a PA is not added, it can be used as a GPIO. If a PA is added, the pin needs to act as the PA control pin.
46 Pin 48 By default, it is used as a GPIO.
47 GND GND
48 Pin 44 By default, it is used as PCIE_RSTN.
49 Pin 113 By default, it is used as PCIE_HSOP.
50 Pin 51 By default, it is used as PCIE_HSON.
51 Pin 114 By default, it is used as PCIE_CLK_P.
52 Pin 52 By default, it is used as PCIE_CLK_N.
53 Pin 53 By default, it is used as PCIE_HSIP.
54 Pin 54 By default, it is used as PCIE_HSIN.
55 GND GND
56 VDD33 Power supply of 3.3V
57 VDD33 Power supply of 3.3V
58 GND GND
59 Pin 57 By default, it is used as the first group USB—USBDN0.
60 Pin 116 By default, it is used as the first group USB—USBDP0.
61 Pin 117 By default, it is used as the second group USB—USBDN1.
62 Pin 59 By default, it is used as the second group USB—USBDP1.
63 GND GND
64 Pin 122 By default, it is used as the network interface—TXOP4.
65 Pin 64 By default, it is used as the network interface—TXON4
66 Pin 123 By default, it is used as the network interface—RXIP4
67 Pin 65 By default, it is used as the network interface—RXIN4
68 GND GND
69 GND GND
70 Pin 2 By default, it is used as a common GPIO.
71 Pin 74 By default, it is used as a common GPIO.
72 Pin 77 By default, it is used as a common GPIO.
73 GND GND
74 GND GND

Note:
The above is the default pin definition of Tuya. Currently, there is no PA in the module featured in gateway Armcore. Its purpose is to achieve the PTA function.
If you have any other definitions and requirements on pins, please contact Tuya business personnel.

Electrical parameters

Absolute electrical parameters

Parameter Minimum value Maximum value Unit
Ts -55 125
Working temperature 0 70
Junction temperature 0 125

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature 0 - 70
VCC Working voltage 3.15 3.3 3.45 V

Power consumption during consistent transmission and reception and in power-consumption state

Symbol Conditions Average value Maximum value (Typical value) Unit
Itx Constantly transmit, output power of 18dB in 11b 1M 500 560 mA
Itx Constantly transmit, output power of 14.5dB in 11g 54M 460 580 mA
Itx Constantly transmit, output power of 14dB in 11n HT20 MCS7 460 540 mA
Itx Constantly transmit, output power of 14dB in 11n HT40 MCS7 450 540 mA
Irx Constantly receive in 11b 11M 360 407 mA
Irx Constantly receive in 11g 54M 360 407 mA
Irx Constantly receive in 11n HT20 MCS7 360 407 mA
Irx Constantly receive in 11n HT40 MCS7 360 407 mA

RF parameters

Basic RF features

Parameter Description
Working frequency Wi-Fi: 2.412 GHz to 2.484 Ghz (Ch1-11 for US/CA,Ch1-13 for EU/CN);
Wi-Fi standard IEEE 802.11b/g/n
Data transmission rate Wi-Fi: 11b:1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7
Antenna Type IPEX antenna

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 18 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average RF output power, 802.11n HT20 Mode MCS7 - 14 - dBm
Average RF output power, 802.11n HT40 Mode MCS7 - 14 - dBm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M - -99 - dBm
PER<10%, RX sensitivity, 802.11g 54 M - -76 - dBm
PER<10%, RX sensitivity, 802.11n HT20-MCS7 - -72.5 - dBm
PER<10%, RX sensitivity, 802.11n HT40-MCS7 - -69.5 - dBm

Packaging information and production instructions

Mechanical dimensions

The dimensions of the PCB are 42±0.35 mm (L)×33±0.35 mm (W) ×0.8±0.1 mm (H)

WRG2-IPEX Module Datasheet

Recommended PCB footprint

WRG2-IPEX Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      WRG2-IPEX Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months has passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

WRG2-IPEX Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WRG2-IPEX Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
WRG2-IPEX 4400 Tape reel 1100 4