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TYBT3 Module Datasheet

Last Updated on : 2021-05-11 07:03:27

TYBT3 is a Bluetooth LE module designed by HangZhou Tuya Smart. It consists of a highly integrated wireless Bluetooth chip TLSR8267 and some extra electric circuits that have been programmed with Bluetooth network protocol and plenty of software examples.

Overview

TYBT3 includes a 32-bit CPU, Bluetooth LE/2.4G radio, 512K byte flash, 16k SRAM, and 9 multiplex IO pins.

Features

  • Integrated low power consumption 32-bit CPU, also known as application processor
  • Basic frequency of the CPU can support 48 MHz
  • Supply voltage range: 1.9V to 3.6V
  • Peripherals: 5PWMs, 1I2C, 1*UART
  • Bluetooth LE RF features:
    • Compatible with Bluetooth LE 4.0
    • Transmitting data rate can go up to 2Mbps
    • TX transmitting power: +7dBm
    • RX receiving sensitivity: -92dBm
    • AES hardware encryption
    • On-board PCB antenna
    • Operating temperature range: -20℃ to 125℃

Main application fields

  • Intelligent LED
  • Intelligent household applications
  • Intelligent low-power consumption sensors

Dimensions and footprint

Dimensions

TYBT3 has double sides of pins. The distance between each Pin is 1.5mm.

Size of TYBT3: 16mm(W)*16.5mm(L).

The dimensions of TYBT3:

TYBT3 Module Datasheet

Pin definition

The typical pin definition of TYBT3:

Pin No. Name Type Description
1 SDA I/O I2C, data interface, internal pull-up 4.7k resistance
2 SCL I/O I2C, clock interface, internal pull-up 4.7k resistance
3 G I/O normal IO pin, can be used as PWM output pin, the default for Green LED line
4 B I/O normal IO pin, can be used as PWM output pin, the default for Blue LED line
5 WW I/O normal IO pin, can be used as PWM output pin, the default for Warm White LED line
6 CW I/O normal IO pin, can be used as PWM output pin, the default for Cold White LED line
7 R I/O normal IO pin, can be used as PWM output pin, the default for Red LED line
8 3.3V P Supply voltage
9 TX I/O UART TX, can be used as normal IO pin
10 RX I/O UART RX, can be used as normal IO pin
11 GND P Ground
12 SW I/O Bluetooth chipset burning pin
13 RST I reset pin for the module, internal pull-up 4.7k resistance
14 GND P Ground

Note: P: Power supply pins; I/O: Digital input or output pins.

  • SW pin is ONLY used for burning firmware, Can NOT be used for other functions.
  • While Pin4 and Pin12 are used for I2C functions, external 4.7k pull-up resistances are necessary.
  • When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal from R/G/B/CW pin.
  • If there’s any customization needed for PWM output, please contact our BD manager.

Electrical characteristics

Absolute maximum ratings

Absolute maximum ratings:

Parameters Description Min Max Unit
Ts Storage temperature -20 125
VCC Supply voltage -0.3 3.9 V
Electrostatic release quantity (Human body model) TAMB-25℃ - 2 KV
Electrostatic release quantity (Machine model) TAMB-25℃ - 0.5 KV

Electrical conditions

Electrical conditions:

Parameters DESCRIPTION Min Typical Max Unit
Ta Temperature for Commercial grade -20 - 125
VCC Supply voltage 1.9 3.3 3.6 V
VIL IO negative level input -0.3 - VCC*0.3 V
VIH IO positive level input VCC*0.75 - VCC V
VOL IO negative level output VSS - 0.3 V
VoH IO positive level output VCC*0.3 - VCC V

Transmitting current consumptions

TX current consumption:

Parameters MODE Typical Unit
Itx Continuously transmitting, 0dBm power output 15 mA
Irx Continuously receiving 12 mA
IDC Mesh working mode 27 mA
Ideepsleep Sleep mode 18 uA

Radio specification

Basic radio frequency characteristics

Basic Radio frequency characteristics:

Parameters DESCRIPTION
Working Frequency 2.4GHz ISM band
Radio standard Bluetooth LE 4.0
Data transmitting rate 1Mbps
Type of Antenna On-board PCB Antenna

Transmitting power

Parameters Min Typical Max Unit
RF Average output power consumption 3.8 7 8 dBm
20dB bandwidth(1M) - 1300 - KHz

Receiving sensitivity

Parameters Min Typical Max Unit
RX sensitivity 1Mbps -93 -92 -90 dBm
Frequency bias error 1Mbps -300 - +300 KHz
Co-channel interference Restrain - - -7 - dB

Antenna

Antenna type

The antenna for the TYBT3 module is using a 2.4 GHz onboard PCB antenna.

Reduce antenna interference

In order to have the best RF performance, it’s recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.

Since PCBA manufacture use SMT process to weld TYBT3 module and other electrical components onto the PCB board, RF performance will depend on the layout location and pattern of the On-board PCB antenna. The following figures are some recommended and dis-recommended demonstrations from the R&D team.

  • In demonstration 1 and 2 of figure 3, the onboard PCB antenna lays outside of the PCB frame. It’s recommended to use the layout pattern shown in demonstrations 1 and 2. Either the on-board PCB antenna lays outside of the PCB frame directly or the PCB frame carves out a certain area for the antenna. The overall PCBA performance for these two ways will be the same as testing the module independently.

  • Restricted due to some reason, if the onboard PCB antenna layout has to be inside the PCB frame, it’s suggested to refer to demonstration 3. The antenna lays inside the PCB frame, but no copper or wire beneath the antenna. RF performance will have some loss, Approximately 1~2 dBm.

  • It is not recommended to use demonstration 4, the antenna lays inside the PCB frame, and there are copper and wire beneath it. RF performance will have significant attenuation.

    Layout demonstration:

    TYBT3 Module Datasheet

    TYBT3 Module Datasheet

Packaging information and production guide

Mechanical dimensions

Dimensions of the module:

TYBT3 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYBT3 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

TYBT3 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYBT3 Module Datasheet

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYBT3. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYBT3”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYBT3 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYBT3 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.