TYBT4 Module Datasheet

Last Updated on : 2023-06-05 01:53:21download

Overview

After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support. If you need similar substitute products, see BT3L Module Datasheet and BP3L Module Datasheet.

TYBT4 is a Bluetooth module designed by Hangzhou Tuya Technology Corporation. The Bluetooth Module consists of a highly integrated wireless Bluetooth chip TLSR8266 and some extra electric circuits that have been programmed with Bluetooth network protocol and plenty of software examples. TYBT4 includes a 32-bit CPU, Bluetooth 2.4G radio, 512K byte flash, 16k SRAM, and 9 multiplex IO pins.

Features

  • Integrated low power consumption 32-bit CPU, also known as application processor
  • Basic frequency of the CPU can support 48 MHz
  • Supply voltage range: 1.9V to 3.6V
  • Peripherals: 5×PWM, 1×I2C, 1×UART
  • Bluetooth RF features:
  • Compatible with Bluetooth 4.2/4.0
  • Transmitting data rate can go up to 2Mbps
    • TX transmitting power: +7dBm
    • RX receiving sensitivity: -92dBm
  • AES hardware encryption
  • On-board PCB antenna
  • Operating temperature range: -20℃ to 85℃

Main application fields

  • Smart LED
  • Smart household applications
  • Smart low-power consumption sensors

Dimensions and footprint

Dimensions

TYBT4 has double sides of pins, total 16 pins. The distance between each Pin is 2.0mm.

Size of TYBT4: 16mm(W) × 24mm(L).

Figure 2 shows the dimensions of TYBT4.

TYBT4 Module Datasheet

Pin definition

Table 1 shows the general pin attributes of TYBT4.

Pin No. Name Type Description
1 RST I Reset pin for the module, Internal pull-up 4.7k resistance
2 ADC I External analog signal input
3 EN I Enable. No need for the internal pull-up. It is connected to DVDD (3.3V) internally
4 I2CSCL I/O I2C, clock interface. Can be used as normal GPIO, while used for the I2C clock signal, Need external pull-up 4.7k resistance
5 PWM4 I/O normal IO pin, can be used as PWM output pin, default for blue LED line
6 PWM3 I/O normal IO pin, can be used as PWM output pin, default for Green LED line
7 PWM1 I/O normal IO pin, can be used as PWM output pin, default for warm white LED line
8 VCC P Supply voltage, range from 1.9 to 3.6V
9 GND P Ground
10 GPIO I/O Reserved GPIO
11 SWS I/O Bluetooth chipset burning pin
12 I2CSDA I/O I2C, data interface. Can be used as normal GPIO, while used for I2C SDA signal, Need external pull-up 4.7k resistance
13 PWM2 I/O Normal IO pin, which can be used as PWM output pin, default for Red LED line
14 PWM0 I/O Normal IO pin, which can be used as PWM output pin, default for cold white line
15 U_RX I/O UART RX, which can be used as a normal IO pin
16 U_TX I/O UART TX, which can be used as a normal IO pin
  • P: Power supply pins; I/O: Digital input or output pins.
  • SW pin is ONLY used for burning firmware, Can NOT be used for other functions.
  • While Pin4 and Pin12 are used for I2C functions, external 4.7k pull-up resistances are necessary.
  • When the PWM1 pin is outputting the PWM signal, it has the opposite phase compared to the PWM signal from PWM2, PWM3, PWM4, and PWM0 pins. If you need any customization of PWM output, please contact our BD manager.

Electrical characteristics

Absolute maximum ratings

​ Table 2. Absolute maximum ratings

Parameter Description Min. Max. Unit
Ts Storage temperature -20 85 °C
VCC Supply voltage -0.3 3.9 V
Electrostatic release quantity (Human body model) TAMB-25°C - 2 KV
Electrostatic release quantity (Machine model) TAMB-25°C - 0.5 KV

Electrical conditions

​ Table 3. Electrical conditions

Parameter Description Min. Typical Max. Unit
Ta Temperature for Commercial grade -20 - 85 °C
VCC Supply voltage 2.5 3.3 3.6 V
VIL IO negative level input -0.3 - VCC*0.25 V
VIH IO positive level input VCC*0.75 - VCC V
VOL IO negative level output - - VCC*0.1 V
VoH IO positive level output VCC*0.8 - VCC V

Transmitting current consumptions

​ Table 4. TX current consumption

Parameter Mode Typical Unit
Itx Continuously transmitting, 0dBm power output 13 mA
Irx Continuously receiving 13 mA
IDC Normal working mode 80 μA

Radio specification

Basic radio frequency characteristics

​ Table 5. Basic radio frequency characteristics

Parameter Description
Working Frequency 2.4GHz ISM band
Radio standard Bluetooth 4.0
Data transmitting rate 1Mbps, 2Mbps
Type of Antenna On-board PCB Antenna

Transmitting power

​ Table 6. Transmitting power

Parameter Min. Typical Max. Unit
RF Average output power consumption 3.8 7 - dBm
20dB bandwidth - 1000 - KHz

Receiving sensitivity

​ Table 7. Receiving sensitivity

Parameter Rate Min Typical Max. Unit
RX sensitivity 1Mbps -93 -92 -90 dBm
Frequency bias error - -300 - +300 KHz
Co-channel interference Restrain - - -7 - dB

Antenna information

Antenna type

The TYBT4 module uses a 2.4 GHz onboard PCB antenna.

Reduce antenna interference

In order to have the best RF performance, it is recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.

Since PCBA manufacturers use the SMT process to weld the TYBT4 module and other electrical components onto the PCB board, RF performance will depend on the layout location and pattern of the onboard PCB antenna. The following figures are some recommended and dis-recommended demonstrations from our R&D team.

In demonstrations 1 and 2 of Figure 3, the onboard PCB antenna lies outside of the PCB frame. It is recommended to use the layout pattern shown in demonstrations 1 and 2. Either the onboard PCB antenna lays outside of the PCB frame directly or the PCB frame carves out a certain area for the antenna. The overall PCBA performance for these two ways will be the same as testing the module independently.

Restricted due to some reason, if the onboard PCB antenna layout has to be inside the PCB frame, it is suggested to refer to demonstration 3. The antenna lays inside the PCB frame, but no copper or wire beneath the antenna. RF performance will have some loss, approximately 1~2 dBm.

It is NOT recommended to use demonstration 4, the antenna lays inside the PCB frame, and there are copper and wire beneath it. RF performance will have significant attenuation.

​Figure 3. Layout demonstrations

TYBT4 Module Datasheet

TYBT4 Module Datasheet

Packaging information and production guide

Mechanical dimensions

​Figure 4. Dimensions of the module

TYBT4 Module Datasheet

Production guide

The storage for the delivered module should meet the following condition:

  • The anti-moisture bag should be kept in an environment with temperature < 30℃ and humidity < 85% RH.
  • The expiration date is 6 months since the dry packaging products are sealed.

Cautions:

  • All the operators should wear an electrostatic ring throughout the whole process of production.
  • While operating, water and dirt should not have any contact with the modules.