TYLC3V Module Datasheet

Last Updated on : 2023-06-05 02:24:18download

Product Overview

After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support.

​ TYLC3V is a low-power built-in Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8267) and several peripheral electrical circuits, with a built-in Bluetooth network communication protocol stack and robust library functions.

TYLC3V also contains a low power-consuming 32-bit MCU, a Bluetooth 2.4 GHz radio, a 512 KB flash, a 16 KB SRAM, and nine multiplex I/O ports.


  • Built-in low power-consuming 32-bit MCU, which can also be used as an application processor

  • Basic frequency: 48 MHz supported

  • Working voltage: 5–38 V (16–38 V by default)

  • Peripherals: five GPIOs

  • Bluetooth RF features

  • Compatible with Bluetooth 4.2

  • RF data rate: up to 2 Mbit/s

    • TX power: +7 dBm

    • RX sensitivity: –92 dBm

  • Built-in AES encryption for hardware

  • Onboard PCB antenna

  • Working temperature: –20°C to +105°C

Major application fields

  • Intelligent LED
  • Intelligent home
  • Intelligent low-power sensor

Module Interfaces

Dimensions and Footprint

​ TYLC3V provides two rows of pins with a distance of 2.0 mm between every two pins.

​ TYLC3V dimensions: 17.25 mm (W) x 26 mm (L) (see figure 2.1)

TYLC3V Module Datasheet

Pin definition

Table 2.1 describes the interface pins.

​ Table 2.1, TYLC3V interface pins

Pin Symbol I/O Type Functions
1 WW I/O PWM2_N, common I/O interface, which can be used for PWM output of the LED driver. It controls the warm white LED by default.
2 GND P Power supply reference ground pin
3 VIN P Power supply input pin
4 3.3 V P Power supply output pin
5 CW I/O PWM4, common I/O interface, which can be used for PWM output of the LED driver. It controls the cold white LED by default.
6 B I/O PWM1, common I/O interface, which can be used for PWM output of the LED driver. It controls the blue LED by default.
7 G I/O PWM0, common I/O interface, which can be used for PWM output of the LED driver. It controls the green LED by default.
8 R I/O PWM5, common I/O interface, which can be used for PWM output of the LED driver. It controls the red LED by default.
  • P indicates power-supply pins and I/O indicates input/output pins.
  • When the WW pin is used for PWM output, its polarity is opposite to that of the R, G, B, and CW pins used for PWM output. If you have special requirements for the light color controlled by PWM output, contact our business manager.

Electrical Parameters

Absolute electrical parameters

Table 3.1 Absolute electrical characteristics

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -40 125
VIN Power supply voltage -0.3 40 V
Static electricity voltage (human model) TAMB-25℃ - 2 KV
Static electricity voltage (machine model) TAMB-25℃ - 0.5 KV

Operating conditions

​ Table 3.2 Normal electrical conditions

Parameters Description Min Typ Max Unit
Ta Working temperature -20 - 105
VIN Working voltage 5* - 38 V
VIL I/O low-level input VSS - 1 V
VIH I/O high input 2.3 - 3.3 V
VOL I/O low-level output VSS - 0.3 V
VOH I/O high-level output 3 - 3.3 V
  • The minimal value for the working voltage of the delivered module is 16 V by default. To change this value, you need to specify it in the order.

Power Consumption in Operating Mode

​ Table 3.3 TX power consumption during constant emission

Symbol Condition Typ Unit
Itx Constant emission, with 0 dBm output power 15 mA
Irx Constant receiving 12 mA
IDC Mesh connected 27 mA
Ideepsleen Sleep mode 18 uA

RF Features

Basic RF Features

​ Table 4.1 Basic RF features

Parameter Description
Frequency band 2.4 GHz ISM band
Radio standard Bluetooth 4.2
Data transmitting rate 1 Mbps and 2 Mbps
Antenna type Plug-in spring antenna

RF Output Power

​ Table 4.2 TX power during constant emission

Parameter Min Typ Max Unit
RF average output power 3.8 7 8 dBm
20 dB bandwidth (1 M) - 1300 - KHz
20 dB bandwidth (2 M) - 2600 - KHz

RF RX sensitivity

​ Table 4.3 RX Sensitivity

Parameter Rate Minimum Value Typical Value Maximum Value Unit
RX sensitivity 1Mbps -93 -92 -90 dBm
RX sensitivity 2Mbps -90 -89 -86 dBm
Frequency offset error 1Mbps -300 - +300 KHz
Frequency offset error 2Mbps -200 - +200 KHz
Co-channel interference suppression - - -7 - dB

Antenna Information

Antenna type

​ TYLC3V uses the plug-in spring antenna working in the 2.4 GHz Wi-Fi band for the PCB.
Figure 5.1 shows the antenna dimensions.

TYLC3V Module Datasheet

Antenna Interference Reduction

​ To ensure optimal RF performance, it is recommended that there be a space of at least 15 mm between the module antenna and other metal parts. The antenna must be far away from the PCB and high devices, especially high metal parts.

If the distance is too small, the electromagnetic wave radiated by the antenna generates the induced electromotive force at the edge of the PCB. In this case, an induced magnetic field is generated, which consumes some energy of the original electromagnetic field, reducing the antenna radiation efficiency. It is recommended that the antenna be at least 15 mm away from the PCB.

Packaging and Production Instructions

Mechanical Dimensions and Size of the Back Pad

TYLC3V Module Datasheet

Production Instructions

Storage conditions of a delivered module are as follows:

  • The anti-moisture bag is placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.


  • Throughout the production process, each involved operator must wear an electrostatic ring.
  • During the operation, strictly protect the module from water and strains.