TYLC3V Module Datasheet

Last Updated on : 2024-11-20 08:22:21download

Product Overview

After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support.

TYLC3V is a low-power built-in Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8267) and several peripheral electrical circuits, with a built-in Bluetooth network communication protocol stack and robust library functions.

TYLC3V also contains a low power-consuming 32-bit MCU, a Bluetooth 2.4 GHz radio, a 512 KB flash, a 16 KB SRAM, and nine multiplex I/O ports.

Features

Built-in low power-consuming 32-bit MCU, which can also be used as an application processor
Basic frequency: 48 MHz supported
Working voltage: 5–38 V (16–38 V by default)
Peripherals: five GPIOs
Bluetooth RF features
Compatible with Bluetooth 4.2
RF data rate: up to 2 Mbit/s
- TX power: +7 dBm
- RX sensitivity: –92 dBm
Built-in AES encryption for hardware
Onboard PCB antenna
Working temperature: –20°C to +105°C

Major application fields

Intelligent LED
Intelligent home
Intelligent low-power sensor

Module Interfaces

Dimensions and Footprint

TYLC3V provides two rows of pins with a distance of 2.0 mm between every two pins.

TYLC3V dimensions: 17.25 mm (W) x 26 mm (L) (see figure 2.1)

TYLC3V Module Datasheet

Pin definition

Table 2.1 describes the interface pins.

Table 2.1, TYLC3V interface pins

Pin	Symbol	I/O Type	Functions
1	WW	I/O	PWM2_N, common I/O interface, which can be used for PWM output of the LED driver. It controls the warm white LED by default.
2	GND	P	Power supply reference ground pin
3	VIN	P	Power supply input pin
4	3.3 V	P	Power supply output pin
5	CW	I/O	PWM4, common I/O interface, which can be used for PWM output of the LED driver. It controls the cold white LED by default.
6	B	I/O	PWM1, common I/O interface, which can be used for PWM output of the LED driver. It controls the blue LED by default.
7	G	I/O	PWM0, common I/O interface, which can be used for PWM output of the LED driver. It controls the green LED by default.
8	R	I/O	PWM5, common I/O interface, which can be used for PWM output of the LED driver. It controls the red LED by default.

P indicates power-supply pins and I/O indicates input/output pins.
When the WW pin is used for PWM output, its polarity is opposite to that of the R, G, B, and CW pins used for PWM output. If you have special requirements for the light color controlled by PWM output, contact our business manager.

Electrical Parameters

Absolute electrical parameters

Table 3.1 Absolute electrical characteristics

Parameters	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	℃
VIN	Power supply voltage	-0.3	40	V
Static electricity voltage (human model)	TAMB-25℃	-	2	KV
Static electricity voltage (machine model)	TAMB-25℃	-	0.5	KV

Operating conditions

Table 3.2 Normal electrical conditions

Parameters	Description	Min	Typ	Max	Unit
Ta	Working temperature	-20	-	105	℃
VIN	Working voltage	5*	-	38	V
VIL	I/O low-level input	VSS	-	1	V
VIH	I/O high input	2.3	-	3.3	V
VOL	I/O low-level output	VSS	-	0.3	V
VOH	I/O high-level output	3	-	3.3	V

The minimal value for the working voltage of the delivered module is 16 V by default. To change this value, you need to specify it in the order.

Power Consumption in Operating Mode

Table 3.3 TX power consumption during constant emission

Symbol	Condition	Typ	Unit
Itx	Constant emission, with 0 dBm output power	15	mA
Irx	Constant receiving	12	mA
IDC	Mesh connected	27	mA
Ideepsleen	Sleep mode	18	uA

RF Features

Basic RF Features

Table 4.1 Basic RF features

Parameter	Description
Frequency band	2.4 GHz ISM band
Radio standard	Bluetooth 4.2
Data transmitting rate	1 Mbps and 2 Mbps
Antenna type	Plug-in spring antenna

RF Output Power

Table 4.2 TX power during constant emission

Parameter	Min	Typ	Max	Unit
RF average output power	3.8	7	8	dBm
20 dB bandwidth (1 M)	-	1300	-	KHz
20 dB bandwidth (2 M)	-	2600	-	KHz

RF RX sensitivity

Table 4.3 RX Sensitivity

Parameter	Rate	Minimum Value	Typical Value	Maximum Value	Unit
RX sensitivity	1Mbps	-93	-92	-90	dBm
RX sensitivity	2Mbps	-90	-89	-86	dBm
Frequency offset error	1Mbps	-300	-	+300	KHz
Frequency offset error	2Mbps	-200	-	+200	KHz
Co-channel interference suppression	-	-	-7	-	dB

Antenna Information

Antenna type

TYLC3V uses the plug-in spring antenna working in the 2.4 GHz Wi-Fi band for the PCB.
Figure 5.1 shows the antenna dimensions.

TYLC3V Module Datasheet

Antenna Interference Reduction

To ensure optimal RF performance, it is recommended that there be a space of at least 15 mm between the module antenna and other metal parts. The antenna must be far away from the PCB and high devices, especially high metal parts.

If the distance is too small, the electromagnetic wave radiated by the antenna generates the induced electromotive force at the edge of the PCB. In this case, an induced magnetic field is generated, which consumes some energy of the original electromagnetic field, reducing the antenna radiation efficiency. It is recommended that the antenna be at least 15 mm away from the PCB.

Packaging and Production Instructions

Mechanical Dimensions and Size of the Back Pad

TYLC3V Module Datasheet

Production Instructions

Storage conditions of a delivered module are as follows:

The anti-moisture bag is placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

Precautions:

Throughout the production process, each involved operator must wear an electrostatic ring.
During the operation, strictly protect the module from water and strains.