TYWE3L Module Datasheet

TYWE3L is a low-power embedded module developed by Tuya. Embedded with the Wi-Fi protocol stack and rich library functions, the Wi-Fi module consists of a highly integrated RF chip ESP8266 and a few peripherals.

Overview

TYWE3L includes a 32-bit CPU, 2-MB flash, 50-KB SRAM, and rich peripheral resources.

TYWE3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Clock rate: 80MHz and 160MHz
• Power supply voltage: 3V to 3.6V
• Peripherals: 9 GPIOs, 1 UART, and 1 ADC
• Wi-Fi connectivity:
  • 802.11 b/g/n
  • Channels 1 to 14 @ 2.4GHz
  • Support WEP/WPA/WPA2/WPA2 PSK (AES) security mode
  • +20dBm output power in 802.11b mode
  • Support STA/AP/STA+AP operation mode
  • Support SmartConfig function for both Android and IOS devices
  • Onboard PCB antenna with a gain of 3.0 dBi
  • Operating temperature: -20℃ to 105℃

Applications

• Intelligent Building
• Intelligent home, Intelligent household applications
• Smart socket, smart lighting
• Industrial wireless control
• Baby monitor
• Webcam
• Intelligent bus

Dimensions and footprint

Dimensions

TYWE3L has 2 lines of pins. The distance between two pins is 2mm. The dimensions of TYWE3L: 16±0.35 mm (W)×24±0.35 mm (L)×3.4±0.15mm(H)

The following figure shows the dimensions of TYWE3L.

Pin definition

The following table shows the general pin attributes of TYWE3L.

Pin number	Name	Type	Description
1	RST	I/O	External reset singal(low level effects, there’s already had pull-up resistor)
2	ADC	AI	ADC terminal(10-bits SAR ADC)
3	EN	I	Enable pin for module, high level effects
4	GPIO16	I/O	GPIO_16 (10k pull-up resistor needed)
5	GPIO14	I/O	GPIO14
6	GPIO12	I/O	GPIO12
7	GPIO13	I/O	GPIO13
8	VCC	P	Supply voltage (3.3V)
9	GND	P	Ground
10	GPIO15	O	GPIO_15(processing during initials, caution when used)
11	GPIO2	O	UART0_TXD(used to print module’s internal information)
12	GPIO0	I/O	GPIO_0(processing during initials, caution when used)
13	GPIO4	I/O	GPIO4
14	GPIO5	I/O	GPIO5
15	RXD0	I/O	UART0_RXD
16	TXD0	O	UART0_TXD

Note:

• S: Power supply pins;
• I/O: Digital input or output pins;
• AI: Analog input.
• RST pin is the module hardware reset pin; it cannot eliminate module-pairing information.
• (1) This pin can only be used as ADC input, cannot use it as normal I/O. when not using, just connect nothing. When used as ADC input, the input voltage range is 0~1.0V.
• (2) UART0 is a serial port, during power-on progress; this serial port will output something, which can be ignored.

Test pin definition

The following table shows the general test pin definition of TYWE3L.

Pin number	Symbol	Type	Description
-	TEST	I	Used for production test for the module

Note: This test pin is not recommended to use.

Electrical parameters

Absolute electrical parameters

Parameters	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VCC	Power supply voltage	-0.3	3.6	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	105	℃
VCC	Working voltage	3	3.3	3.6	V
VIL	I/O low level input	-0.3	-	VCC*0.25	V
VIH	I/O high level input	VCC*0.75	-	VCC	V
VOL	I/O low level output	-	-	VCC*0.1	V
VOH	I/O high level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

Wi-Fi transmission power consumption

Working status	Mode	Rate	Transmit power	Average value (Typical value)	Unit
Transmit	11b	11Mbps	+17dBm	220	mA
Transmit	11g	54Mbps	+15dBm	110	mA
Transmit	11n	MCS7	+14dBm	120	mA
Transmit	11n	MCS7	+13dBm	100	mA

Wi-Fi receiving power consumption

Working status	Mode	Rate	Average value (Typical value)	Unit
Receive	11b	11Mbps	76	mA
Receive	11g	54Mbps	76	mA
Receive	11n	MCS7	76	mA

Power consumption in operating mode

Working mode	AT TA=25 ℃	Average value	Maximum value	Unit
EZ Mode	TYWE3L is under EZ paring mode, and the Wi-Fi indicator light flashes quickly	80	418	mA
AP Mode	TYWE3L is under AP paring mode, and the Wi-Fi indicator light flashes slowly	90	451	mA
Connected	TYWE3L is connected, and the Wi-Fi indicator light is on	58.5	411	mA
Disconnected	TYWE3L is disconnected, and the Wi-Fi indicator light is off	80	430	mA

RF features

Basic RF features

Parameter	Description
Frequency band	2.4GHz to 2.5GHz
Wi-Fi standard	IEEE 802.11n/g/b (channels 1-14)
Data transmitting rate	11b: 1, 2, 5.5, 11(Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps) 11n: HT20, MCS0-7
Antenna type	PCB antenna

Wi-Fi transmit power

Parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power, 802.11b CCK Mode	1M	-	20	-
RF average output power, 802.11g OFDM Mode	54M	-	17	-
RF average output power, 802.11n OFDM Mode	MCS7	-	14	-
The Frequency error	-25	-	25	ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm	-	-16.0	-	dB
EVM@802.11g OFDM 54Mbps Mode 15.0dBm	-	-30.0	-	dB
EVM@802.11n OFDM MCS7 Mode 14.0dBm	-	-31.0	-	dB

Wi-Fi receiving sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, Receiving sensitivity, 802.11b CCK Mode 1M	-	-91	-	dBm
PER<10%, Receiving sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, Receiving sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm

Antenna

Antenna type

The antenna can be connected only using an onboard PCB antenna.

Reduce antenna interference

While using the Onboard PCB antenna, in order to have the best Wi-Fi performance, it’s recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.

User’s own PCBA design is recommended NOT to pass any wire, NOT do copper pour under the region of the module’s antenna, to avoid interferences.

Packaging information and production guide

Mechanical dimensions

As shown in the following figure, the mechanical dimensions of the PCB of WBR3 are 16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H).

The following figure shows the module’s side view.

PCB recommended package

The following figure shows the PCB schematic.

The following figure shows the PCB Package.

Production instructions

1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • (SMT process) SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • (Wave soldering process) Wave soldering devices
     • Wave soldering equipment
     • Wave soldering fixture
     • Constant-temperature soldering iron
     • Tin bar, tin wire, and flux
     • Thermal profiler
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
TYWE3L	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYWE3L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYWE3L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.