TYJW1.1 Module Datasheet

Product overview

Developed by Tuya, TYJW1.1 is a Wi-Fi module that is suitable for serial communication of the 3.3 V TTL. It consists of a highly integrated wireless RF chip (ESP8266EX) and an external flash chip, with an embedded Wi-Fi network protocol stack and rich library functions. TYJW1.1 includes a low-power 32-bit CPU, 2-MB flash memory, and 36-KB SRAM.
TYJW1.1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. On the basis of the serial communication manner, you can develop embedded Wi-Fi products as required.

Features

• Embedded with the low-power 32-bit CPU, which can also function as an application processor
  • The clock rate supports 80 MHz and 160 MHz
• Operating voltage: 3.3V
• Peripheral: 1 UART
• Wi-Fi connectivity
  • 802.11 b/g/n20
  • Channels 1 to 14@2.4 GHz
  • Support WPA/WPA2 security mode
  • Up to +18dBm output power in 802.11b mode
  • Support STA/AP/STA+AP working mode
  • Support SmartConfig for Android and iOS devices
  • Onboard PCB antenna
  • Operating temperature: -20℃ to 85℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change history

Update date	Updated content	Version after update
December 02, 2016	This is the first release.	V1.0.0
January 23, 2018	Added the description of of the PCB dimensional tolerance	V1.0.1
June 17, 2020	Adjusted the format	V2.0.0

Module interfaces

Dimensions and footprint

The electrical interface of TYJW1.1 is the PHS connector with a spacing of 2.54 mm.

As shown in the following figure, the dimensions of TYJW1.1 are 57.5±0.35 mm (W)×31.4±0.35 mm (L) ×7.2±0.15 mm (H). The thickness of the PCB is 1.2±0.1 mm.

Pin definition

Pin number	Symbol	Type	Function
1	GND	P	Power supply reference ground
2	TX	I/O	Transmitting interface of the module, output the level of 3.3V TTL
3	RX	I/O	Receiving interface of the module, input the level of 3.3V TTL
4	VCC	P	Power supply pin (3.3V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test pins

Pin number	Symbol	Type	Function
5	3.3V	P	Power supply pin inside the module (3.3V)
6	IO0	I/O	The pin for enabling/disabling burning of firmware of the module, whose level needs to be pulled down to the low level during firmware burning.
7	RST	I/O	Hardware reset pin
8	TXD0	I/O	Interface for programming firmware of the module
9	RXD0	I/O	Interface for programming firmware of the module
10	TXD1	I/O	An interface for displaying information of the module
11	GND	P	Power supply reference ground

Note: P indicates power supply pins, and I/O indicates input or output pins. When the pin IO0 is pulled up, the module runs normally. When the pin IO0 is at low level, the module is in firmware programming state.
The RST is only a hardware reset pin and cannot be used for clearing information about Wi-Fi network configuration. The test points are prohibited.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VBAT	Supply voltage	-0.3	3.3	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	85	℃
VBAT	Power supply voltage	3.0	3.3	3.6	V
VIL	Voltage Input Low	-0.3	-	VCC*0.25	V
VIH	Voltage Input High	VCC*0.75	-	VCC	V
VOL	Voltage Output Low	-	-	VCC*0.1	V
VOH	Voltage Output High	VCC*0.8	-	VCC	V
Imax	Drive current	-	-	5	mA

TX power consumption

Working status	Mode	Rate	Transmit power	Average value	Peak value (typical value)	Unit
Transmit	11b	11Mbps	+17dBm	260	268	mA
Transmit	11g	54Mbps	+15dBm	100	188	mA
Transmit	11n BW20	MCS7	+13dBm	100	167	mA

RX power consumption

Working status	Mode	Receive	Average value	Peak value (typical value)	Unit
Receive	CPU Sleep	11Mbps	70	80	mA
Receive	CPU Active	54Mbps	70	78	mA
Receive	CPU Active	MCS7	70	78	mA

Power consumption in working mode

Working mode	Working status, Ta = 25°C	Average value	Peak value (typical value)	Unit
EZ	The module is in fast connection state	90	445	mA
Hotspot	The module is in hotspot mode	101	451	mA
Connected and operating	The module is connected to the network and operating normally	58.5	411	mA
Disconnected state	The module is disconnected	156	430	mA

Note: The peak lasts about 5 to 10ms. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.400 to 2.484 GHz
Wi-Fi standard	IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, and 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type	PCB antenna

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average output power, 802.11b CCK Mode 11M	-	17.5	-	dBm
Average output power, 802.11g OFDM Mode 54M	-	14.5	-	dBm
Average output power, 802.11n OFDM Mode MCS7	-	13.5	-	dBm
Frequency error	-20	-	20	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm

Antenna information

Antenna type

TYJW1.1 supports two types of antennas: Onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area of the PCB.

Specifications of antenna connector

There is no antenna connector for this module currently.

Packaging information and production instructions

Mechanical dimensions

Specifications of terminal
The terminal has 4 pins with a spacing of 2.54 mm between each other. Detailed parameters are as follows:

Production instructions

Storage conditions for a delivered module are as follows:

• The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the RH is lower than 85%.
• The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.

Caution:

• In the production process, all operators must wear electrostatic rings.
• During operation, strictly prevent the module from getting wet or dirty.

Recommended oven temperature curve

We mount the PCB with the SMT according to the following temperature curve. The peak temperature is 245°C.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	Modules per carton (pcs)	Reels per carton (reel)
TYJW1.1	400	Bubble bags	200	2