TYLC5S Module Datasheet

TYLC5S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (ESP8285), a few peripherals, an embedded Wi-Fi network protocol stack, and rich library functions.

Overview

TYLC5S has an embedded low-power 32-bit CPU, 1-MB flash memory, 50-KB SRAM, and rich peripherals.

TYLC5S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• The clock rate supports 80 Mhz and 160 Mhz
• Working voltage: 3.0 to 3.6 V
• Peripherals: 3 GPIOs and 1 universal asynchronous receiver/transmitter (UART)
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1-14@2.4GHz(CH1-11 for US/CA, CH1-13 for EU/CN)
  • Support WEP/WPA/WPA2/WPA2 PSK (AES) security mode
  • Up to + 20dBm output power in 802. 11b mode
  • Support STA/AP/STA+AP working mode
  • Support SmartConfig and AP network configuration manners for Android and IoS devices
  • External antenna
  • Working temperature: -20℃ to 105℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and package

TYLC5S has two rows of pins with a 2-mm pin spacing.
The TYLC5S dimensions are 8.5± 0.35 mm (W)×12.7±0.35 mm (L) × 2.6± 0.15 mm(H). The thickness of the PCB is 1.0 mm±0.1 mm.
The dimensions of TYLC5S are as follows:

Pin definition

Definitions on interface pins are shown as below:

Pin number	Symbol	I/O type	Function
1	ANT	-	RF antenna port, which is connected to an external antenna in a soldering manner
2	GND	P	Power supply reference ground
3	IO12	I/O	Correspond to MTDI (pin 10 ) of the IC
4	IO14	I/O	Correspond to IO4 (pin16) of the IC
5	IO4	I/O	Correspond to MTMS (pin 9) of the IC
6	VCC	P	Power supply pin (3.3V)

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Definitions on test points

The definitions of pins of TYLC5S are shown in the following table:

Pin number	Symbol	I/O type	Function
-	TP1	Rst	It is only a module reset pin and cannot be used for clearing Wi-Fi network pairing information
-	TP2	I/O	GPIO 0, used for the production test of the module
-	TP3	U0TXD	User serial interface. When the module is powered on and enabled, there is information output from the serial interface, which is used for production test.
-	TP4	U0RXD	User serial interface. When the module is powered on and enabled, there is information output from the serial interface, which is used for production test.

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	℃
VCC	Power supply voltage	-0.3	3.6	V
ESD voltage (human body model)	TAMB-25℃	-	2	kV
ESD voltage (machine model)	TAMB-25℃	-	0.5	kV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	105	℃
VCC	Power supply voltage	3. 0	3. 3	3. 6	V
VIL	I/O low level input	-0.3	-	VCC*0.25	V
VIH	I/O high level input	VCC*0.75	-	VCC	V
VOL	I/O low level output	-	-	VCC*0.1	V
VOH	I/O high level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

RF power consumption

Working status	Mode	Rate	Transmit power/Receive	Average value (Typical value)	Unit
Transmit	11b	11Mbps	+17dBm	220	mA
Transmit	11g	54Mbps	+15dBm	110	mA
Transmit	11n	MCS0	+14dBm	120	mA
Transmit	11n	MCS7	+13dBm	100	mA
Receive	11b	11Mbps	Constantly receive	76	mA
Receive	11g	54Mbps	Constantly receive	76	mA
Receive	11n	MCS7	Constantly receive	76	mA

Working power consumption

Working mode	Working status, Ta = 25°C	Average value	Peak value (Typical value)	Unit
Quick network connection state	The module is in the fast network connection state and the Wi-Fi indicator always flashes	80	415	mA
Hotspot network configuration state	The module is in the hotspot network configuration state and the Wi-Fi indicator always flashes slowly	90	451	mA
Network connection state	The module is connected to the network and the Wi-Fi indicator is always on	58.5	411	mA
Disconnected state	The module is disconnected and the Wi-Fi indicator is dark	80	430	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2. 412 to 2. 484 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type	Solered external antenna

TX performance

TX performance

Parameter	Minimum value	Average value	Peak value (Typical value)	Unit
Average RF output power, 802.11b CCK Mode 11M	-	20	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	17	-	dBm
Average RF output power, 802.11n OFDM Mode MCS7	-	14	-	dBm
Frequency error	-25	-	25	ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm	-	-16	-	dB
EVM@802.11g OFDM 54Mbps Mode 15.0dBm	-	-30	-	dB
EVM@802.11n OFDM MCS7 Mode 14.0dBm	-	-31	-	dB

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm

Antenna information

Antenna type

The module uses an external antenna which is soldered on the ANT pad of the module in a soldering manner.
An antenna with a length of 28 mm is recommended. For details, you can refer to the following figure:

Antenna interference reduction

To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. The main points of the layout: 1. Make sure that there is no substrate medium directly below or above the printed antenna. 2. Make sure that the area around the printed antenna is far away from copper, so as to ensure the radiation effect of the antenna to the greatest extent.

Specifications of antenna connector

There is no antenna connector for this module at the moment.

Packaging information and production instructions

Mechanical dimensions

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Recommended PCB packaging

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
TYLC5S	5600	Tape reel	1400	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYLC5S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYLC5S”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.