WB3S-IPEX Module Datasheet

WB3S-IPEX is an embedded low-power Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated wireless RF chip (BK7231T), a few peripherals, an embedded Wi-Fi network protocol stack, and varied library functions.

Overview

With the maximum CPU clock rate of 120 MHz, WB3S-IPEX contains a low-power 32-bit MCU, a 1T1R WLAN module, 256-KB static random-access memory (SRAM), 2-MB flash memory, and rich extensive peripherals.

WB3S-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi Mac and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Main clock rate: 120 MHz
• Peripherals: 9 general-purpose input/output (GPIO), 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC)
• Wi-Fi connectivity:
  • 802.11 b/g/n
  • Channels 1 to 14 at 2.4 GHz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES),WPA3 security modes
  • Up to +16 dBm output power in 802.11b mode
  • Support SmartConfig functions for Android and iOS devices
  • External antenna IPEX connector
  • Working temperature: -40℃ to 85℃
• Bluetooth LE:
  • Support the lower-power Bluetooth (V4.2)
  • Maximum output power: +6 dBm
  • External antenna IPEX connector

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WB3S-IPEX has two rows of pins with a 2 mm pin spacing.
The dimensions of WB3S-IPEX are 16 mm (W)×24 mm (L) ×2.8 mm (H).

Note: The dimensional tolerance of W&L is ±0.35 mm. The other dimensional tolerance is ±0.15 mm.

Pin definition

Pin number	Symbol	I/O type	Function
1	CEN	I	Low-level reset, high level active (the pin has been pulled high internally), correspond to CEN of IC
2	ADC3	AI	ADC port, which corresponds to P 23 of IC
3	EN	I	Enabling pin, which is pulled high internally to be compatible with other modules
4	P14	I/O	A universal GPIO interface, which corresponds to P 14 of IC
5	P26	I/O	GPIOP_26, which corresponds to P 26 of IC
6	P24	I/O	GPIOP_24, a universal GPIO interface, which corresponds to P 24 of IC
7	P6	I/O	GPIOP_6, which corresponds to P 6 of IC
8	VCC	P	Power supply pin (3.3 V)
9	GND	P	Power supply reference ground
10	P7	I/O	GPIOP_7, which corresponds to P 7 of IC
11	P0	I/O	UART2_TXD (used to display the module internal information), which corresponds to P 0 of IC
12	P1	I/O	UART0_RXD (used to display the module internal information), which corresponds to P 1 of IC
13	P9	I/O	GPIOP_9, a universal GPIO interface, which corresponds to P 9 of IC
14	P8	I/O	GPIOP_8, which corresponds to P8 of IC
15	RXD1	I/O	UART1_RXD (user-side serial interface), which corresponds to P 10 of IC
16	TXD1	I/O	UART1_TXD (user-side serial interface), which corresponds to P 11 of IC

Note: P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
CEN is only a hardware reset pin and cannot be used for clearing information about Wi-Fi network configuration.
UART1 is a user-side serial interface. When the module is powered on and enabled, there is information output from the user-side serial interface, which can be neglected.

Definitions of test points

Pin Number	Symbol	I/O Type	Function
1	SO	I/O	Data output during flash download, which is used for production and programming of the module. The pin corresponds to P 23/ADC 3 of IC
2	SI	I/O	Data input during flash download, which is used for production and programming of the module. The pin corresponds to P 22 of IC.
3	CS	I/O	Chip selection during flash download, which is used for production and programming of the module. The pin corresponds to P 21 of IC.
4	SCK	I/O	Clock during flash download, which is used for production and programming of the module. The pin corresponds to P 20 of IC.

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	150	℃
VCC	Power supply voltage	-0.3	3.6	V
Static electricity discharge voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity discharge voltage (machine model)	TAMB-25℃	-	0.5	KV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	-	85	℃
VCC	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low-level intput	-0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	3.6	V
VOL	I/O low-level output	-	-	VCC*0.1	V
VOH	I/O high-level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	6	15	mA

RF power consumption

Working status	Mode	Rate	Transmit power/receive	Typical value	Unit
Transmit	11b	11Mbps	+16dBm	222	mA
	11g	54Mbps	+14dBm	195	mA
	11n HT20	MCS7	+13dBm	185	mA
Receive	11b	11Mbps	Constantly receive	98	mA
	11g	54Mbps	Constantly receive	98	mA
	11n HT20	MCS7	Constantly receive	98	mA

Working power consumption

Working mode	Working status, TA=25℃	Average value	Peak value (Typical value)	Unit
Quick connection network state (network configuration through Bluetooth)	The module is in the fast network connection state and the Wi-Fi indicator fast flashes	100	330	mA
Quick connection network state (network configuration through AP)	The module is in the fast network connection state and the Wi-Fi indicator flashes slowly	70	365	mA
Quick connection network state (network configuration through EZ)	The module is in the fast network connection state and the Wi-Fi indicator fast flashes	60	336	mA
Network connection idle state	The module is connected to the network and the Wi-Fi indicator is always on	40	270	mA
Network connection operation state	The module is connected to the network and the Wi-Fi indicator is always on	50	280	mA
Disconnected state	The module is disconnected	100	260	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.412 to 2.484 GHz
Wi-Fi standards	IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth LE	Bluetooth LE 4.2
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20 MCS0~7
Antenna type	IPEX antenna

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	16	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	14	-	dBm
Average RF output power, 802.11n OFDM Mode MCS7	-	13	-	dBm
Frequency error	-2	-	+2	ppm
EVM@802.11b CCK 11 Mbps Mode16 dBm	-	-18	-	dB
EVM@802.11g OFDM 54 Mbps Mode14 dBm	-30	-29	-25	dB
EVM@802.11n OFDM MCS7 Mode13 dBm	-31	-28	-27	dB

RX Performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M	-	-92	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-68	-	dBm
PER<10%, RX sensitivity, Bluetooth LE 1M	-	-95	-	dBm

Antenna

Antenna type

WB3S-IPEX uses an external IPEX antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area. Please deploy the antenna in the following manner shown in the picture.

Antenna connector specifications

Packaging information and production instructions

Mechanical dimensions

Recommended PCB layout

Production instructions

1. Tuya’s stamp hole package module must be mounted by the SMT machine within 24 hours after unpacking and programming of the firmware. Otherwise, it must be packaged again under vacuum. The module must be baked before mounting.

   • SMT equipment
     • Reflow soldering machine
     • Automated optical inspection (AOI) equipment
     • Nozzle with a 6 mm to 8 mm diameter
   • Baking equipment
     • Cabinet oven
     • Anti-static heat-resistant trays
     • Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

   • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.

   • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.

   • The package contains a humidity indicator card (HIC).

     

3. Bake a module based on HIC status as follows when you unpack the module package:

   • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
   • If the 30% circle is pink, bake the module for 4 consecutive hours.
   • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
   • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized after more than 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences.

6. Before SMT, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before the first mounting to determine proper methods for controlling the oven temperature and attaching and placing components. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is shown below:

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	Number of modules per reel	Number of reels per carton
WB3S-IPEX	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WB3S-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB3S-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.