XR2 Module Datasheet

XR2 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (XR809) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.

Overview

XR2 is embedded with an Arm Cortex-M4F CPU, 2 MB flash read-only memory (ROM), and 384 KB static random-access memory (SRAM), and has extensive peripherals.

Features

• Clock rate: 160 MHz
• Working voltage: 2.7 V to 5.5 V
• Peripherals: 5×GPIOs, 1×UART
• Wi-Fi connectivity
  • 802.11b/g/n
  • Channels 1 to 14 at 2.4 GHz (CH1-11 for US/CA, CH1-13 for EU/CN)
  • WPA and WPA2 security modes
  • STA, AP, and STA+AP working modes
  • Smart and AP network configuration modes for Android and iOS devices
  • Onboard PCB antenna , gain 1.0dBi
  • CE, FCC, SRRC certified
  • Working temperature: –20°C to +85°C

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Network camera
• Intelligent bus

Change history

Date	Description	Version after change
2019-10-14	This is the first release.	2.0.0
2020-01-13	Change Electrical parameters	2.0.1
2020-05-28	Update Tx and power consumption parameters	2.0.2

Module interfaces

Dimensions and footprint

XR2 has two rows of pins with a 2 mm pin spacing.

The XR2 dimensions (H x W x D) are 2.3±0.15 mm x 15±0.35 mm x 18±0.35 mm. The PCB thickness is 0.8±0.1 mm.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	VCC-BAT	P	Power input pin (3.3 V)
2	PA22	I/O	PA22, which is connected to PA22 (pin 44) on the internal IC
3	GND	P	Power supply reference ground pin
4	PA21	I/O	PA21, which is connected to PA21 (pin 43) on the internal IC
5	U1RXD	I/O	Serial interface receiving pin (UART_RX)
6	PA20	I/O	PA20, which is connected to PA20 (pin 42) on the internal IC
7	U1TXD	I/O	Serial interface transmission pin (UART_TX)
8	PA14	I/O	PA14, which is connected to PA14 (pin 32) on the internal IC, can be used as ADC interface
9	PA19	I/O	PA19, which is connected to PA19 (pin 41) on the internal IC
10	CHIP_PWD	I/O	Enable/Reset pin (This pin is active at a high level, and is at a high level by default.)
11	PB03	I/O	PB03, which is connected to PB03 (pin 11) on the internal IC
TP1	PB02	I/O	PB02, which is connected to PB02 (pin 10) on the internal IC
TP2	TP2	U0RXD	can be used as debug UART
TP3	TP3	U0TXD	can be used as debug UART
RF-TEST	RF-TEST	P	RF test point

Note:

• P indicates power supply pins, I/O indicates input/output pins, and TP indicates test pins.
• During firmware burning, both PB02 and PB03 need to be connected to a low level. When the module works properly, PB02 and PB03 cannot be connected to a low level simultaneously.
• Pin8 PA14 can be used as an ADC input. If this pin is not used, it must be disconnected. When this pin is used as an ADC input, the input voltage range is 0 V to 2.5 V.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–40	125	°C
VDD	Power supply voltage	–0.3	5.8	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	4	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.8	kV

Electrical conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	–20	N/A	85	°C
VDD	Working voltage	2.7	3.3	5.5	V
VIL	I/O low-level input	–0.3	N/A	1.32	V
VIH	I/O high-level input	2.06	N/A	3.6	V
VOL	I/O low-level output	-0.3	N/A	0.4	V
VOH	I/O high-level output	2.9	N/A	3.3	V
Imax	I/O drive current	-40	N/A	40	mA
RPU	IO input pull-up resistance	40	-	110	KΩ
RPD	IO input pull-down resistance	40	-	110	KΩ

RF current consumption

Working Status	Mode	Rate	TX Power/Receiving	Typical value	Unit
TX	802.11b	11 Mbit/s	+14 dBm	155	mA
TX	802.11g	54 Mbit/s	+13.5 dBm	136	mA
TX	802.11n	MCS0	+13 dBm	144	mA
TX	802.11n	MCS7	+13 dBm	140	mA
RX	802.11b	11 Mbit/s	Constant receiving	34	mA
RX	802.11g	54 Mbit/s	Constant receiving	34	mA
RX	802.11n	MCS7	Constant receiving	34	mA

Working current

Working mode	Working status (Ta = 25°C)	Typical value	Peak value*	Unit
EZ	The module is in EZ mode, and the Wi-Fi indicator blinks quickly.	47	177	mA
AP	The module is in AP mode, and the Wi-Fi indicator blinks slowly.	82	184	mA
Network connection	The internet is connected, and the Wi-Fi indicator always blinks.	37	124	mA
Network disconnect	The internet is disconnected, and the Wi-Fi indicator not blink.	45	185	mA

RF features

Basic RF features

|Parameter|Description|
| ----| ----| ----|
| Frequency band|2.412 GHz to 2.4835 GHz|
| Wi-Fi standard|IEEE 802.11b/g/n (channels 1 to 14)|
| Data transmission rate|802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7|
| Antenna type|PCB antenna, gain 1.0 dBi |

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK mode 1 Mbit/s	-	14	-	dBm
Average RF output power, 802.11g OFDM mode54 Mbit/s	-	13.5	-	dBm
Average RF output power, 802.11n OFDM modeMCS7	-	13	-	dBm
Frequency error	–15	-	+15	ppm
EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm		–15		dB
EVM under 802.11g OFDM, 54 Mbit/s, 15.0 dBm		–29		dB
EVM under 802.11n OFDM, MCS7, 14.0 dBm		–30		dB

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, 802.11b CCK mode1 Mbit/s	-	–89	-	dBm
PER < 10%, 802.11g OFDM mode54 Mbit/s	-	–75	-	dBm
PER < 10%, 802.11n OFDM modeMCS7	-	–72	-	dBm

Antenna

Antenna type

XR2 uses an onboard PCB antenna(default way) , gain 1.0dBi.

Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance.

Mechanical dimensions

Recommended PCB layout

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
XR2	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-XR2. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-XR2”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.