TYWE1S Module Datasheet

Last Updated on : 2024-06-14 03:14:28download

TYWE1S is a low-power embedded Wi-Fi module that Tuya has developed. TYWE1S consists of a highly integrated wireless RF chip (ESP8266EX) and an external flash chip, with an embedded Wi-Fi network protocol stack and varied library functions.


TYWE1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

TYWE1S further contains a low-power 32-bit CPU, 2-MB flash memory, 36-KB static random-access memory (SRAM), and rich peripherals.


  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • The clock rate supports 80 Mhz and 160 Mhz
  • Working voltage: 3.0 to 3.6 V
  • Peripherals: 6 GPIOs, 2 universal asynchronous receiver/transmitters (UART) and 1 analog-to-digital converter (ADC)
  • Wi-Fi connectivity:
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 Ghz (channels 1 to 11 for US/CA and channels 1 to 13 for EU/CN)
    • Support WEP/WPA/WPA2/WPA2 PSK (AES) security modes
    • Up to +20 dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig functions for Android and iOS devices
    • Power consumption in standby state is less than 0.1 mW (DTIM3)
    • Onboard PCB antenna with a gain of 3 dBi and an internal antenna IPEX connector
    • Passed CE and FCC certification
    • Working temperature: -20 to 85℃


  • Intelligent building
  • Smart household and home appliances
  • Medical health care
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

TYWE1S has two rows of pins with a 1.5 mm pin spacing. Each row has 9 pins.
The TYWE1S dimensions are 18±0.35 mm (W)×23.5±0.35 mm (L) ×3.1±0.15mm (H). The thickness of the PCB is 1.0 mm±0.1 mm.
TYWE1S Module Datasheet
TYWE1S Module Datasheet

Pin definition

Illustration on the arrangement of pins of TYWE1S:

Pin number Symbol I/O type Function
1 Vin P UART1 power supply conversion (5V or 3.3V)
2 U1TX I/O UART1_TXD (user-side serial interface)
3 U1RX I/O UART1_RXD (user-side serial interface)
4 3V3 P The main power supply pin of the module (3.3V)
5 GND P Power supply reference ground
6 IO14 I/O GPIO_14, which corresponds to MTMS (Pin 9) of IC
7 IO12 I/O GPIO_12, which corresponds to MTDI (Pin10) of IC
8 U0TX I/O LOG_TXD (used to display the module internal information)
9 IO0 I/O GPIO_0 (In the module power-on initialization process, use with caution)
10 IO5 I/O GPIO_5, which corresponds to GPIO 5 (Pin 24) of IC
11 U0RX I/O LOG_RXD (used to display the module internal information)
12 IO1 I/O GPIO_1 (in the module initialization process, the status of the pin is unstable)
13 IO4 I/O GPIO_4, which corresponds to GPIO 4 (Pin 16) of IC
14 GND P Power supply reference ground
15 GND P Power supply reference ground
16 RESET I/O External reset signal (active low)
17 TOUT AI ADC port
18 GND P Power supply reference ground


  • P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
  • RST is only a module reset pin and cannot be used for clearing information about Wi-Fi network configuration.
  • Pin 17 can only be used as an ADC interface but cannot be used as a common IO interface. Once not used, it needs to be pulled up.
  • As an ADC input interface, the input voltage range is 0 to 1.0V.
  • UART1 is a user-side serial interface.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 125
VCC Power supply voltage -0.3 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VDD Working voltage 3.0 - 3.6 V
VIL I/O low-level input -0.3 - 3V3*0.25 V
VIH I/O high-level input 3V3*0.75 - 3.6 V
VOL I/O low-level output - - 3V3*0.1 V
VOH I/O high-level output 0.8 - 3V3 V
Imax I/O drive current - - 12 mA
Cpad Input pin capacitance - 2 - pF

RF power consumption

Symbol Mode Rate Transmit power/Receive Typical value Unit
Transmit 11b 11 Mbps +17 dBm 220 mA
Transmit 11g 54 Mbps +15 dBm 110 mA
Transmit 11n MCS 7 +13 dBm 100 mA
Receive 11b 11 Mbps Constantly receive 76 mA
Receive 11g 54 Mbps Constantly receive 76 mA
Receive 11n MCS7 Constantly receive 76 mA

Working power consumption

Working mode Working status, Ta = 25°C Average value Peak value (Typical value) Unit
Quick connection network state The module is in the fast network connection state and the Wi-Fi indicator always flashes 100 415 mA
Hotspot network configuration state The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly 105 451 mA
Network connection idle state The module is connected to the network and the Wi-Fi indicator is always on 58.5 411 mA
Network connection operation state The module is connected to the network and the Wi-Fi indicator is always on 100 411 mA
Disconnected state The module is disconnected and the Wi-Fi indicator is dark 156 430 mA

Note: The peak value lasts about 5us. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
11n: HT20 MCS 0 to 7
Antenna type PCB antenna with a gain of 3.0 dBi (default)
Antenna to which a U.FL RF connector is externally connected (optional)

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 20 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 17 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 14 - dBm
Frequency error -20 - 20 ppm
EVM@802.11b CCK 11 Mbps Mode 17.5 dBm - -16 - dB
EVM@802.11g OFDM 54 Mbps Mode 15.0 dBm - -30 - dB
EVM@802.11n OFDM MCS7 Mode 14.0 dBm - -31 - dB

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M - -91 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -73 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -70 - dBm


Antenna type

TYWE1S uses two types of antennas: onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.
The user can modify the antenna access method by switching the jumper resistor: (TYWE1S is equipped with resistor 0omh/0402 red mark).

TYWE1S Module Datasheet
TYWE1S Module Datasheet

Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area. The main points of the layout: 1. Make sure that there is no substrate medium directly below or above the printed antenna. 2. Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.

TYWE1S Module Datasheet

Specifications of antenna connector

Parameters of the U.FL RF connector are shown as below:

TYWE1S Module Datasheet

Packaging information and production instructions

Mechanical dimensions

TYWE1S Module Datasheet
TYWE1S Module Datasheet

Recommended PCB layout

TYWE1S Module Datasheet
TYWE1S Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYWE1S Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

TYWE1S Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYWE1S Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
TYWE1S 4000 Tape reel 1000 4

Appendix: statement

FCC caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation exposure statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYWE1S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYWE1S”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of conformity European notice

TYWE1S Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYWE1S Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.