TYWE2L Module Datasheet

Last Updated on : 2022-07-29 08:00:43download

TYWE2L is a low power-consumption built-in Wi-Fi module developed by Hangzhou. It consists of a highly integrated RF chip (ESP8285) and several peripherals, with a built-in Wi-Fi network protocol stack and rich library functions.


​TYWE2L provides a low power-consumption 32-bit CPU, 1-MB flash memory, 50-KB SRAM, and rich peripheral resources.

TYWE2L is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. Users can develop embedded Wi-Fi products as required based on the function libraries.


  • Built-in low power-consuming 32-bit CPU, which can also be used as an application processor

  • Clock rate: 80 MHz and 160 MHz supported

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: 5 GPIOs

  • Wi-Fi connectivity

    • 802.11 b/g/n

    • Channel 1-14@2.4GHz(CH1-11 for US/CA, CH1-13 for EU/CN)

    • WEP/WPA/WPA2/WPA2 PSK (AES) security mode supported

    • Up to +20 dBm output power in 802.11b mode

    • STA/AP/STA+AP working mode supported

    • SmartConfig and AP network configuration modes supported (for Android and iOS devices)

    • Onboard PCB antenna

    • Working temperature: –20°C to +105°C


  • Intelligent building
  • Intelligent home and household applications
  • Intelligent socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

TYWE2L provides two lines of pins with a distance of 2.0 mm between every two pins.

TYWE2L dimensions: 17.3±0.35mm (L) x 15±0.35mm (W) x 3±0.15 mm (H)

TYWE2L Module Datasheet

Pin definition

​ Table 1 TYWE2L pins

Pin number Symbol I/O type Function
1 14 I/O GPIO_14, correspond to MTMS of the IC (Pin 9)
2 12 I/O GPIO_12, correspond to MTDI of the IC (Pin 10)
3 13 I/O GPIO_13, correspond to MTCK of the IC (Pin 12)
4 5 I/O GPIO_05, correspond to GPIO 5 of the IC (Pin 24)
5 4 I/O GPIO_04, correspond to GPIO 4 of the IC (Pin 16)
6 GND P Power supply reference ground
7 3V3 P Power supply pin (3.3 V)

P indicates power supply pins and I/O indicates input/output pins.

Test pin definition

​Table 2 TYWE2L test pins

Pin number Symbol I/O type Function
- IO2 I/O UART1_TXD (interface for displaying module information)
- RST I/O Reset pin
- IO0 I/O IO0 is involved in module startup. If IO0 is disconnected, the module enters the normal running state.
  • I/O indicates input/output pins. If I/O 0 is disconnected, the module enters the normal running state. If I/O 0 is at a low level, the module enters the firmware programming state.
  • Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Table 3 Absolute electrical parameters

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -20 105
VCC Power supply voltage -0.3 3.6 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Working conditions

​Table 4 Normal working conditions

Parameters Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 105
VCC Working voltage 3.0 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC*0.25 V
VIH I/O high-level input VCC*0.75 - VCC V
VOL I/O low-level output - - VCC*0.1 V
VOH I/O high-level output VCC*0.8 - VCC V
Imax I/O drive current - - 12 mA

RF power consumption

​Table 5 TX power consumption during constant emission

Working status Mode Rate Transmit power/Receive Average value (Typical value) Unit
Transmit 11b 11Mbps +17dBm 220 mA
Transmit 11g 54Mbps +15dBm 110 mA
Transmit 11n MCS0 +14dBm 120 mA
Transmit 11n MCS7 +13dBm 100 mA
Receive 11b 11Mbps Constantly receive 76 mA
Receive 11g 54Mbps Constantly receive 76 mA
Receive 11n MCS7 Constantly receive 76 mA

Power consumption in operating mode

​Table 6 TYWE2L working current

Working mode Working status (Ta=25°C) Average value Maximum value Unit
EZ mode The module is in EZ state and the Wi-Fi indicator quickly flashes. 80 415 mA
AP mode The module is in AP state and the Wi-Fi indicator slowly flashes. 90 451 mA
Connected The module is in connected state and the Wi-Fi indicator is steady on. 58.5 411 mA
Disconnected The module is in disconnected state and the Wi-Fi indicator is steady off. 80 430 mA

RF features

Basic RF features

​Table 7 Basic RF features

Parameter Description
Frequency band 2.412–2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1–14)
Data transmitting rate 11b: 1, 2, 5.5, 11 (Mbit/s)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbit/s)
11n: HT20 MCS0–MCS7
Antenna type PCB antenna (default)

Wi-Fi output power

​Table 8 Transmission performance

Parameter Minimum value Typical value Maximum value Unit
RF average output power, 802.11b CCK mode 1 M - 20 -
RF average output power, 802.11g OFDM mode 54 M - 17 -
RF average output power, 802.11n OFDM mode MCS7 - 14 -
Frequency error -10 - 10

Reception performance

​Table 9 RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER < 8%, RX sensitivity, 802.11b CCK mode 1 M - -91 - dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode 54 M - -75 - dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode MCS7 - -72 - dBm


Antenna type

​TYWE2L uses the onboard PCB antenna.

Antenna interference reduction

​To ensure optimal Wi-Fi performance when the Wi-Fi module uses the onboard PCB antenna, it is recommended that there be a space of at least 15 mm between the module antenna and other metal parts.

Placement of the antenna
TYWE2L Module Datasheet

Packaging information and production instructions

Mechanical dimensions

TYWE2L Module Datasheet

TYWE2L Module Datasheet
TYWE2L Module Datasheet

The default dimensional tolerance is ±0.35 mm. If you have any special requirements on the key dimensions, make them clear in the module datasheet after communication.

Recommended PCB footprint

TYWE2L Module Datasheet

TYWE2L can be packaged with the SMT or in an in-line way.

Diagram of dimensions of pin header
TYWE2L Module Datasheet

Diagram of PCB footprint
TYWE2L Module Datasheet

Production instructions

  1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • (SMT process) SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • (Wave soldering process) Wave soldering devices
      • Wave soldering equipment
      • Wave soldering fixture
      • Constant-temperature soldering iron
      • Tin bar, tin wire, and flux
      • Thermal profiler
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYWE2L Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

TYWE2L Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

TYWE2L Module Datasheet
Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

TYWE2L Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
TYWE2L 4000 Tape reel 1000 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYWE2L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYWE2L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYWE2L Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYWE2L Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.