Last Updated on : 2022-07-29 08:17:42download
TYWE3L is a low-power embedded module developed by Tuya. Embedded with the Wi-Fi protocol stack and rich library functions, the Wi-Fi module consists of a highly integrated RF chip ESP8266 and a few peripherals.
TYWE3L includes a 32-bit CPU, 2-MB flash, 50-KB SRAM, and rich peripheral resources.
TYWE3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
TYWE3L has 2 lines of pins. The distance between two pins is 2mm. The dimensions of TYWE3L: 16±0.35 mm (W)×24±0.35 mm (L)×3.4±0.15mm(H)
The following figure shows the dimensions of TYWE3L.
The following table shows the general pin attributes of TYWE3L.
|1||RST||I/O||External reset singal(low level effects, there’s already had pull-up resistor)|
|2||ADC||AI||ADC terminal(10-bits SAR ADC)|
|3||EN||I||Enable pin for module, high level effects|
|4||GPIO16||I/O||GPIO_16 (10k pull-up resistor needed)|
|8||VCC||P||Supply voltage (3.3V)|
|10||GPIO15||O||GPIO_15(processing during initials, caution when used)|
|11||GPIO2||O||UART0_TXD(used to print module’s internal information)|
|12||GPIO0||I/O||GPIO_0(processing during initials, caution when used)|
- S: Power supply pins;
- I/O: Digital input or output pins;
- AI: Analog input.
- RST pin is the module hardware reset pin; it cannot eliminate module-pairing information.
- (1) This pin can only be used as ADC input, cannot use it as normal I/O. when not using, just connect nothing. When used as ADC input, the input voltage range is 0~1.0V.
- (2) UART0 is a serial port, during power-on progress; this serial port will output something, which can be ignored.
The following table shows the general test pin definition of TYWE3L.
|-||TEST||I||Used for production test for the module|
Note: This test pin is not recommended to use.
|Parameters||Description||Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||-0.3||3.6||V|
|ESD voltage (human body model)||TAMB-25℃||-||2||KV|
|ESD voltage (machine model)||TAMB-25℃||-||0.5||KV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||I/O low level input||-0.3||-||VCC*0.25||V|
|VIH||I/O high level input||VCC*0.75||-||VCC||V|
|VOL||I/O low level output||-||-||VCC*0.1||V|
|VOH||I/O high level output||VCC*0.8||-||VCC||V|
|Imax||I/O drive current||-||-||12||mA|
|Working status||Mode||Rate||Transmit power||Average value (Typical value)||Unit|
|Working status||Mode||Rate||Average value (Typical value)||Unit|
|Working mode||AT TA=25 ℃||Average value||Maximum value||Unit|
|EZ Mode||TYWE3L is under EZ paring mode, and the Wi-Fi indicator light flashes quickly||80||418||mA|
|AP Mode||TYWE3L is under AP paring mode, and the Wi-Fi indicator light flashes slowly||90||451||mA|
|Connected||TYWE3L is connected, and the Wi-Fi indicator light is on||58.5||411||mA|
|Disconnected||TYWE3L is disconnected, and the Wi-Fi indicator light is off||80||430||mA|
|Frequency band||2.4GHz to 2.5GHz|
|Wi-Fi standard||IEEE 802.11n/g/b (channels 1-14)|
|Data transmitting rate||11b: 1, 2, 5.5, 11(Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps)
11n: HT20, MCS0-7
|Antenna type||PCB antenna|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|RF average output power, 802.11b CCK Mode||1M||-||20||-|
|RF average output power, 802.11g OFDM Mode||54M||-||17||-|
|RF average output power, 802.11n OFDM Mode||MCS7||-||14||-|
|The Frequency error||-25||-||25||ppm|
|EVM@802.11b CCK 11Mbps Mode 17.5dBm||-||-16.0||-||dB|
|EVM@802.11g OFDM 54Mbps Mode 15.0dBm||-||-30.0||-||dB|
|EVM@802.11n OFDM MCS7 Mode 14.0dBm||-||-31.0||-||dB|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER<8%, Receiving sensitivity, 802.11b CCK Mode 1M||-||-91||-||dBm|
|PER<10%, Receiving sensitivity, 802.11g OFDM Mode 54M||-||-75||-||dBm|
|PER<10%, Receiving sensitivity, 802.11n OFDM Mode MCS7||-||-72||-||dBm|
The antenna can be connected only using an onboard PCB antenna.
While using the Onboard PCB antenna, in order to have the best Wi-Fi performance, it’s recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.
User’s own PCBA design is recommended NOT to pass any wire, NOT do copper pour under the region of the module’s antenna, to avoid interferences.
As shown in the following figure, the mechanical dimensions of the PCB of WBR3 are 16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H).
The following figure shows the module’s side view.
The following figure shows the PCB schematic.
The following figure shows the PCB Package.
For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
|Suggestions on oven temperature curve of wave soldering||Suggestions on manual soldering temperature|
|Preheat temperature||80 to 130 °C||Soldering temperature||360±20°C|
|Preheat time||75 to 100s||Soldering time||＜3s/point|
|Peak contact time||3 to 5s||NA||NA|
|Temperature of tin cylinder||260±5°C||NA||NA|
|Product number||MOQ (pcs)||Packing method||Modules per reel||Reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-TYWE3L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYWE3L”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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