TYLC4 Module Datasheet

​TYLC4 is a low-power embedded Wi-Fi module developed by Hangzhou Tuya Information Technology Co., Ltd., which consists of a highly integrated RFID chip ESP8266 and a few peripheral components with built-in Wi-Fi network protocol stack and abundant library functions.

Product overview

TYLC4 is embedded with low power 32-bit CPU, 1 Mbyte flash memory and rich peripheral resources.

TYLC4 is a RTOS platform which integrates all the function libraries of Wi-Fi MAC and TCP/IP protocol, base on which, users are enabled to develop embedded Wi-Fi products according to their specific requirements.

The functional principle of TYLC4 is shown as below:

Features

• The embedded low-power 32-bit CPU can also be used as application processor

• CPU Clock Speed: 80MHz and 160MHz

• Working voltage: 3.0V-3.6V

• Peripheral: 5×GPIOs, 1×UART

• Wi-Fi connectivity

  • 802.11 b/g/n

  • Channel: 1-14@2.4GHz

  • In support of WPA/WPA2 safe mode

  • A maximum output power of +20dBm in the mode of 802.11b

  • In support of STA/AP/STA+AP operating mode

  • In support of two distribution networks including SmartConfig and AP (Android and iOS devices included)

  • Onboard PCB plug-in PiFA antenna

  • Operating temperature: -20℃ to 125℃

Main applications

• Intelligent building
• Smart home/home appliances
• Smart power plug, intelligent light
• Industrial wireless control
• Baby monitor
• Webcam
• Intelligent public transportation

Module picture

• Front:

  

• Negative:

  

Module interface

Size package

TYLC4 has two rows of pins and the spacing between each two pins is 2mm.

TYLC4 size: 16.69±0.35mm (W)×16.66±0.35mm (L) ×3.5±0.15mm (H). TYLC4 size is shown in figure2：

Pin definition

Pin No.	Sign	IO type	Function
1	RST	I/O	Hardware reset pin (effective at low electrical level, with pull-up resistor inside)
2	EN	I	Module enabling pin needs to receive 3.3V power supply
3	GND	P	Power reference ground
4	GPIO14	I/O	GPIO_14
5	GPIO12	I/O	GPIO_12
6	GPIO13	I/O	GPIO_13
7	GPIO4	I/O	GPIO_04
8	GPIO5	I/O	GPIO_05
9	RXD0	I/O	UART0_RXD 1
10	TXD0	O	UART0_TXD 1
11	VCC	P	Module’s power pin (3.3V)

Test point definition

Pin No.	Sign	IO Type	Function
-	TEST1	I/O	GPIO2, used for module production test
-	TEST2	I/O	GPIO0, used for module production test

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum Value	Maximum Value	Unit
Ts	Storage temperature	-20	85	℃
VCC	Supply voltage	-0.3	3.6	V
Electrostatic Discharge Voltage (human model)	TAMB-25℃	-	2	KV
Electrostatic Discharge Voltage (machine model)	TAMB-25℃	-	0.5	KV

Operating conditions

Parameter	Description	Minimum Value	Typical Value	Maximum Value	Unit
Ta	Operating temperature	-20	-	125	℃
VCC	Operating voltage	3.0	3.3	3.6	V
VIL	IO low electrical level input	-0.3	-	VCC*0.25	V
VIH	IO high electrical level input	VCC*0.75	-	VCC	V
VOL	IO low electrical level output	-	-	VCC*0.1	V
VoH	IO high electrical level output	VCC*0.8	-	VCC	V
Imax	IO drive current	-	-	12	mA

Wi-Fi transmitting power

Sign	Parameter	Parameter	Parameter	Typical Value	Unit
Mode	Mode	Rate	Transmitting Power
IRF	11b	11Mbps	+17dBm	220	mA
IRF	11g	54Mbps	+15dBm	110	mA
IRF	11n	MCS7	+13dBm	100	mA

Wi-Fi receiving power

PowerSign	Mode	Rate	Typical Value	Unit
IRF	11b	11Mbps	76	mA
IRF	11g	54Mbps	76	mA
IRF	11n	MCS7	76	mA

Power in operating mode

Operating Mode	Operating Status, Ta=25℃	Average Value	Maximum Value	Unit
Fast connection distribution network	When the module is in a state of fast connection distribution network, Wi-Fi indicator light flashes quickly	80	151	mA
Hot spot distribution network	When the module is in a state of hot spot distribution network, Wi-Fi indicator light flashes slowly	90	451	mA
Internet connection	When the module is with internet connection, Wi-Fi indicator light goes on	58.5	411	mA
Offline	When the module is offline, Wi-Fi indicator light goes out	80	430	mA

RF characteristics

Basic RF characteristics

Parameter	Detailed Description
Operating frequency	2.412~2.484GHz
Wi-Fi standard	IEEE 802.11b/g/n (channel 1-14)
Data transmitting rate	11b:1,2,5.5, 11 (Mbps) 11g:6,9,12,18,24,36,48,54(Mbps) 11n:HT20 MCS0~7
Antenna type	PCB onboard plug-in antenna

Wi-Fi output power

Parameter		Minimum Value	Typical Value	Maximum Value	Unit
RF average output power, 802.11b CCK Mode	1M	-	20	-	dBm
RF average output power, 802.11g OFDM Mode	54M	-	17	-	dBm
RF average output power, 802.11n OFDM Mode	MCS7	-	14	-	dBm
Frequency Error	-	-10	-	10	ppm

Wi-Fi receiving sensitivity

Parameter		Minimum Value	Typical Value	Maximum Value	Unit
PER<8%，RX sensitivity, 802.11b CCK Mode	1M	-	-91	-	dBm
PER<10%，RX sensitivity, 802.11g OFDM Mode	54M	-	-75	-	dBm
PER<10%，RX sensitivity, 802.11n OFDM Mode	MCS7	-	-72	-	dBm

Antenna

Antenna type

PCB board has reserved IPEX interfaces to receive antenna with IPEX terminals.

Reduction of antenna interference

When using antenna with IPEX terminals on the Wi-Fi module, to ensure the best Wi-Fi performance, it is recommended that the distance between the module antenna and other metal parts should be at least 10mm.

Packaging information and manufacturing instructions

Mechanical dimensions

PCB recommended package

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.