English
English
简体中文
Contact Us
Register
Log In
Language
English
English
简体中文
Contact Us
Log In
Register
Go to main website
App Develop

App Development

Tuya provides multiple mobile app development methods such as no-code or IoT App SDK development to maximize the monetization of IoT apps.
layoutIndex

WR3E Module Datasheet

Last Updated on : 2021-09-25 09:22:19download

WR3E is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RTL8710BN) and an external flash chip, with an embedded Wi-Fi network protocol stack and rich library functions.

Overview

With the maximum CPU clock rate of 125 MHz, WR3E also contains a low-power ARM CM4F, a WLAN MAC, a 1T1R WLAN module, 256-KB static random-access memory (SRAM), 2-MB flash memory, and rich peripherals.

WR3E is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • Clock rate: 125 MHz
  • Operating voltage: 3.0 to 3.6 V
  • Peripherals: 7 GPIOs, 2 UARTs, and 1 ADC
  • Wi-Fi connectivity
    • 802.11 B/G/N20/N40
    • Channels 1 to 14@2.4 GHz
    • Support WEP/WPA/WPA2/WPA2 PSK (AES) security mode
    • Up to + 20dBm output power in 802.11b mode
    • Support SmartConfig functions for Android and iOS devices
    • Onboard PCB antenna with a gain of 2.5 dBi
    • Passed CE, FCC, and SRRC certifications
    • Operating temperature: -20℃ to 85℃

Applications

  • Intelligent building
  • Smart household and home appliances
  • Medical health care
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Update date Updated content Version after update
01/28/2019 This is the first release. 1.0.0
06/22/2019 Updated the tolerance of the module 1.0.1
09/21/2019 Updated the instructions on the production process 1.0.2
04/13/2020 Updated the data of power consumption 1.0.3

Module interfaces

Dimensions and package

WR3E has two lines of pins with a 2-mm pin spacing. Each row has 8 pins.
The WR3E dimensions are 16±0.35 mm (W)×24±0.35 mm (L)× 3.4±0.15 mm (H). The thickness of the PCB is 0.8 ± 0.1 mm. The shield case is 2.5±0.05 mm.

WR3E Module Datasheet

Pin definition

Descriptions on the arrangement of pins of WR3E:

Pin number Symbol I/O type Function
1 NC / Pulled up and not connected, to be compatible with other modules
2 ADC AI ADC port, the maximum input voltage is 5V
3 CHIP_EN I/O When software disables the function, connection by a user fails
4 GPIOA_29 I/O UART_Log_RXD (used to print the internal information of the module), which can be configured as a universal GPIO. The module has been pulled up and cannot be used for triggering the high level
5 GPIOA_14 I/O GPIOA_14, hardware PWM, Pin 13 of the IC
6 GPIOA_15 I/O GPIOA_15, hardware PWM, Pin 14 of the IC
7 GPIOA_22 I/O GPIOA_22, hardware PWM, Pin 31 of the IC
8 VCC P Power supply pin (3.3V)
9 GND P Power supply reference ground
10 GPIOA_0 I/O GPIOA_0, which cannot be pulled high when powered on, and which is configurable after the level is pulled to be high, hardware PWM, Pin 16 of the IC
11 GPIOA_30 I/O UART_Log_TXD (used to print the internal information of the module), which can be configured as a universal GPIO
12 GPIOA_19 I/O GPIOA_19, a universal I/O port, Pin 30 of the IC
13 GPIOA_5 I/O GPIOA_5, hardware PWM, Pin 28 of the IC
14 GPIOA_12 I/O GPIOA_12, hardware PWM, Pin 17 of the IC
15 RXD I/O UART0_RXD (user-side serial interface)
16 TXD I/O UART0_TXD (user-side serial interface)

Note: P indicates a power supply pin, I/O indicates an input/output pin and AI indicates an analog input pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum Value Unit
Ts Storage temperature -40 105
VCC Supply voltage -0.3 3.6 V
ESD voltage (human body model) TAMB-25℃ - 2 kV
ESD voltage (machine model) TAMB-25℃ - 0.5 kV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 - 85
VDD Operating voltage 3.0 - 3.6 V
VIL I/O low level input -0.3 - VDD*0.25 V
VIH I/O high level input VDD*0.75 - 3.6 V
VOL I/O low level output - - VDD*0.1 V
VOH I/O high level output VDD*0.8 - VDD V
Imax I/O drive current - - 16 mA
Cpad Input pin capacitance - 2 - pF

RF power consumption

Working status Mode Rate Transmit power/Receive Average value Peak value (Typical value) Unit
Transmit 11b 11Mbps +17dBm 287 367 mA
Transmit 11b 11Mbps +18dBm 295 382 mA
Transmit 11g 54Mbps +15dBm 255 406 mA
Transmit 11g 54Mbps +17.5dBm 267 428 mA
Transmit 11n-HT20 MCS7 13dBm 244 395 mA
Transmit 11n-HT20 MCS7 16.5dBm 257 422 mA
Transmit 11n-HT40 MCS7 13dBm 220 393 mA
Transmit 11n-HT40 MCS7 16.5dBm 230 420 mA

RX power consumption:

Symbol Mode Average value Unit
Receive CPU Sleep 90 mA
Receive CPU Active 120 mA

Working power consumption

Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit
Quick network connection state The module is in the fast network connection state and the Wi-Fi indicator flashes fast 115 376 mA
Hotspot network configuration state The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly 60 386 mA
Network connection idle state The module is connected to the network and the Wi-Fi indicator is always on 105 389 mA
Network connection operation state The module is connected to the network and the Wi-Fi indicator is always on 105 389 mA
Disconnected state The module is disconnected and the Wi-Fi indicator is dark 45 381 mA

Note: The peak value lasts about 5us. The above parameters may vary with firmware functions.

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11n/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
11n: HT20 MCS0 to 7
11n: HT40 MCS0 to 7
Antenna type PCB antenna with a gain of 2.5 dBi

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 17.5 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 13.5 - dBm
Frequency error -20 - -20 ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm - -16 -
EVM@802.11g OFDM 54Mbps Mode 15.0dBm - -30 -
EVM@802.11n OFDM MCS7 Mode 14.0dBm - -31 -

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 11M - -91 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -75 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm

Antenna information

Antenna type

By default, WR3E uses only the PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. The main points of the layout: 1. Make sure that there is no substrate medium directly below or above the printed antenna. 2. Make sure that the area around the printed antenna is far away from copper, so as to ensure the radiation effect of the antenna to the greatest extent.

WR3E Module Datasheet

Packaging information and production instructions

Mechanical dimensions

WR3E Module Datasheet

Recommended PCB packaging

WR3E Module Datasheet)

Production instructions

  • The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT equipment:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Oven temperature tester
      • Automated optical inspection (AOI) equipment
    • Baking equipment:
      • Cabinet oven
      • Anti-static heat-resistant pallets
      • Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      WR3E Module Datasheet
  • The module needs to be baked in the following cases:

    • Vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
    • Time: 48 hours for reelizing and 12 hours for palletizing
    • Alarm temperature: 65°C for reelizing and 135°C for palletizing
    • Production ready temperature after natural cooling: < 36°C
    • The number of drying times: 1
    • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

      Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

WR3E Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WR3E Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
WR3E 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

  1. This device may not cause harmful interference.
  2. This device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WR3E. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WR3E”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WR3E Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WR3E Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.