WR3N Module Datasheet

WR3N is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RTL8710BN) and an external flash chip, with an embedded Wi-Fi network protocol stack and robust library functions. WR3N also contains a low-power Arm Cortex-M4F microcontroller unit (MCU), WLAN MAC protocol, 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals.

Overview

WR3N also contains an N32S032 security chip, embedded with a hardware algorithm co-processor to provide excellent performance DES / 3DES, AES, SHA, RSA, ECC, and national commercial passwords SM1 / SM2 / SM3 / SM4 and other security algorithm modules.

WR3N is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Clock rate: 125 MHz
• Operating voltage: 3.0 V to 3.6 V
• Peripherals: 7×GPIOs, 2×UART, 1×ADC
• Wi-Fi connectivity
  • 802.11b/g/n20/n40
  • Channels 1 to 14 at 2.4 GHz
  • WEP/WPA/WPA2/WPA2 PSK (AES) security mode
  • Up to +20 dBm output power in 802.11b mode
  • STA, AP, and STA+AP working modes
  • Smart and AP network configuration modes for Android and iOS devices
  • Onboard PCB antenna
  • Operating temperature: –20°C to +85°C

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Network camera
• Intelligent bus

Module Interfaces

Dimensions and Footprint

WR3N has two lines of pins (2 x 8 ) with a 2 mm pin spacing.

The WR3N dimensions (W x D x H) are 16±0.35 mm x 24±0.35 mm x 2.9±0.15 mm. The PCB thickness is 0.8±0.1 mm. The shield cover height is 2.0±0.05 mm.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	RST	/	Reset
2	ADC	AI	ADC pin with the maximum output voltage of 5 V
3	CHIP_EN	I/O	Function has been disabled by software, users can disconnect it
4	GPIOA_29	I/O	UART_Log_RXD, which is used for printing the module internal information and can be configured as a common GPIO (The pin has been pulled up and cannot be set to be triggered at a high level.)
5	GPIOA_14	I/O	GPIOA_14, hardware PWM pin, which is connected to pin 13 on the internal IC
6	GPIOA_15	I/O	GPIOA_15, hardware PWM pin, which is connected to pin 14 on the internal IC
7	GPIOA_0	I/O	GPIOA_0, hardware PWM pin, which is connected to pin 16 on the internal IC (The pin cannot be pulled up during power-on and can be configured after power-on.
8	VCC	P	Power supply pin (3.3 V)
9	GND	P	Power supply reference ground pin
10	NC	/	NC
11	TX0	I/O	UART_Log_TXD, which is used for printing the module internal information and can be configured as a common GPIO
12	NC	/	NC
13	GPIOA_5	I/O	GPIOA_5, hardware PWM pin, which is connected to pin 28 on the internal IC
14	GPIOA_12	I/O	GPIOA_12, hardware PWM pin, which is connected to pin 17 on the internal IC
15	RXD	I/O	UART0_RXD, which is used as a user-side serial interface pin
16	TXD	I/O	UART0_TXD, which is used as a user-side serial interface pin

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–40	105	°C
VDD	Power supply voltage	–0.3	3.6	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Electrical conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	–20	N/A	85	°C
VDD	Operating voltage	3.0	N/A	3.6	V
VIL	I/O low-level input	-0.3	-	3V3*0.25	V
VIH	I/O high-level input	3V3*0.75	-	3.6	V
VOL	I/O low-level output	-	-	3V3*0.1	V
VOH	I/O high-level output	3V3*0.8	-	3V3	V
Imax	I/O drive current	-	-	12	mA
Cpad	IO input pin capacitance	-	2	-	pF

RF current consumption

Working status	Mode	Rate	TX Power/Receiving	Typical value	Unit
Tx	11b	11Mbps	+17.5dBm	350	mA
Tx	11g	54Mbps	+14.5dBm	320	mA
Tx	11n	MCS0	+13.5dBm	350	mA
Tx	11n	MCS7	+13.5dBm	300	mA
RX	802.11b	11 Mbit/s	Constant receiving	137	mA
RX	802.11g	54 Mbit/s	Constant receiving	137	mA
RX	802.11n	MCS7	Constant receiving	127	mA

Operating current

Working mode	Working status (Ta = 25°C)	Typical value	Peak value	Unit
EZ	The module is in EZ mode, and the Wi-Fi indicator blinks quickly.	177	418	mA
AP	The module is in AP mode, and the Wi-Fi indicator blinks slowly.	168	434	mA
Network connect without operation	The internet is connected, and the Wi-Fi indicator always blinks.	155	430	mA
Network connect with operation	The internet is connected, and the Wi-Fi indicator always blinks.	154	430	mA
Network disconnect	The internet is disconnected, and the Wi-Fi indicator not blink.	155	414	mA

RF features

Basic RF features

Parameter	Description
Frequency band	2.412 GHz to 2.4835 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate	802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7
Antenna type	Onbiard PCB antenna

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s	-	17.5	-	dBm
Average RF output power, 802.11g OFDM mode54 Mbit/s	-	14.5	-	dBm
Average RF output power, 802.11n OFDM modeMCS7	-	13.5	-	dBm
Frequency error	–20	-	+20	ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm	-	-16	-
EVM@802.11g OFDM 54Mbps Mode 15.0dBm	-	-30	-
EVM@802.11n OFDM MCS7 Mode 14.0dBm	-	-31	-

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, 802.11b CCK mode1 Mbit/s	-	–91	-	dBm
PER < 10%, 802.11g OFDM mode54 Mbit/s	-	–75	-	dBm
PER < 10%, 802.11n OFDM modeMCS7	-	–72	-	dBm

Antenna

Antenna type

WR3N uses an onboard PCB antenna (default).

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance.

Packaging information and production instructions

Mechanical dimensions

Recommended PCB layout

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
  • Time: 48 hours for reelizing and 12 hours for palletizing
  • Alarm temperature: 65°C for reelizing and 135°C for palletizing
  • Production ready temperature after natural cooling: < 36°C
  • The number of drying times: 1
  • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.
  If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis
• B: Time axis
• C: Liquidus temperature: 217 to 220°C
• D: Ramp-up slope: 1 to 3°C/s
• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
• F: Duration above the liquidus: 50 to 70s
• G: Peak temperature: 235 to 245°C
• H: Ramp-down slope: 1 to 4°C/s

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
WR3N	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WR3N. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WR3N”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.