WR6-H Module Datasheet

WR6-H is a low power-consuming built-in Wi-Fi module developed by Hangzhou Tuya Inc. It consists of a highly integrated RF microchip (RTL8710BN) and an external flash chip, with a built-in Wi-Fi network protocol stack and robust library functions.

Overview

WR6 also contains a low power-consuming ARM CM4F, a WLAN MAC, a 1T1R WLAN, and the maximum basic frequency of 125 MHz, and is embedded with a 256 KB SRAM, a 2 MB flash, and rich peripheral resources.

WR6-H is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop built-in Wi-Fi products as required.

Features

• Built-in low power-consuming 32-bit CPU functioning as an application processor
• Basic frequency: 125 MHz
• Operating voltage: 4.5 V to 5.5 V
• Peripherals: 9 GPIOs, 1 UART, and 1 ADC
• Wi-Fi connectivity
  • 802.11b/g/n20/n40
  • Channels 1 to 14 at 2.4 GHz
  • WEP/WPA/WPA2/WPA2 PSK (AES) security mode
  • +20 dBm output power in 802.11b mode
  • Smart network configuration function (for Android and iOS devices)
  • Onboard PCB antenna and external antenna connected through the IPEX connector
  • Operating temperature: -20°C to +85°C

Applications

• Intelligent building
• Smart home and household appliances
• Healthcare
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WR6-H has two rows of pins (2 x 7) with a 2 mm pin pitch.

Dimensions (H x W x D) of WR6-H are as follows: 37.8±0.35 mm (W)×21.7±0.35 mm (L) ×4.8±0.2 mm (H). See the following figure:

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	A_14	I/O	GPIOA_14
2	A_15	I/O	GPIOA_15
3	EN	I/O	External enabled reset pin (active at a low level)
4	A_0	I/O	GPIOA_0, which cannot be pulled up during power-on and can be configured after power-on
5	A_12	I/O	GPIOA_12
6	ADC	AI	ADC port, with the maximum output power of 5 V
7	A_5	I/O	GPIOA_5
8	3.3V	P	Module power supply pin (3.3 V)
9	GND	P	Power supply reference ground pin
10	A_19	I/O	GPIOA_19
11	A_22	I/O	GPIOA_22
12	Log_Tx	I/O	UART_Log_TXD (used for printing the module internal information)
13	Log_Rx	I/O	UART_Log_RXD (used for printing the module internal information)
14	GND	P	Power supply reference ground pin
15	VIN	P	External power input (5 V)
16	GND	P	Power supply reference ground pin
17	RXD1	I/O	UART0_RXD (user serial port)
18	TXD1	I/O	UART0_TXD (user serial port)

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input
pins.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	°C
VCC	Power supply voltage	-0.3	5	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Electrical conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-20	N/A	85	°C
VCC	Power supply voltage	4.5	5.0	5.5	V
VIL	I/O low-level input	-0.3	N/A	VCC x 0.25	V
VIH	I/Ohigh-level input	VCC x 0.75	N/A	VCC	V
VOL	I/O low-level output	N/A	N/A	VCC x 0.1	V
VoH	I/O high-level output	VCC x 0.8	N/A	VCC	V
Imax	I/O drive current	N/A	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

Continuous TX power dissipation

Working status	Mode	Rate	TX power	Typical value	Unit
TX	11b	11Mbps	+18dBm	343	-
TX	11b	11Mbps	+17dBm	295	-
TX	11g	54Mbps	+15dBm	255	-
TX	11g	54Mbps	+17.5dBm	267	-
TX	11n BW20	MCS7	+13dBm	244	-
TX	11n BW20	MCS7	+16.5dBm	257	-
TX	11n BW40	MCS7	+13dBm	220	-
TX	11n BW40	MCS7	+16.5dBm	230	-

Continuous RX power dissipation

Working status	Mode	Rate	Receiving	Typical value	Unit
RX	CPU Sleep	11Mbps	Continuous RX 90	-	mA
RX	CPU Active	MCS7 BW20	Continuous RX	120	-

Operating current

Working mode	Working status (Ta = 25°C)	Average value	Peak value*(Typical value)	Unit
Quick configuration	Module in the quick net-pairing state, Wi-Fi indicator blinking	115	310	mA
Network connection idle	Module connected to the network, Wi-Fi indicator constantly on	60	295	mA
Network connection active	Module connected to the network, Wi-Fi indicator constantly on	118	328	mA
Disconnected	Module not connected to the network, Wi-Fi indicator always off	120	320	mA

Note: The preceding parameter values vary depending on the firmware functions.

RF features

Basic RF features

Parameter	Description
Frequency band	2.412 GHz to 2.483.5 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS0-7;
Antenna type	PCB On Board antenna (default)

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s	N/A	17.5	N/A	dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s	N/A	14.5	N/A	dBm
Average RF output power, 802.11n OFDM mode MCS7	N/A	13.5	N/A	dBm
Frequency error	-20	N/A	+20	ppm

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s	N/A	-91	N/A	dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s	N/A	-76	N/A	dBm
PER < 10%, 802.11n OFDM mode MCS7	N/A	-73	N/A	dBm

Antenna

Antenna type

WR6 supports the onboard PCB antenna and external antenna. By default, the module uses an onboard PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

U.FL RF connector

U.FL RF connector parameter as below:

Packaging information and production instructions

Mechanical dimensions

PCB Size: 21.7±0.35mm (W)×37.8±0.35mm (L) ×1.0±0.15mm (H).

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

Connection terminal specifications

The connector on the PCB board is JC20-4P, the following figure illustrates the specification:

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	Modules per reel	Packaging reels per box
WR6-H	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WR6-H. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WR6-H”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.