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WRD2L Module Datasheet

Last Updated on : 2021-06-09 04:13:31download

WRD2L is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (RDA5981BM), a few peripherals, an embedded Wi-Fi network protocol stack, and varied library functions.

Overview

WRD2L has an embedded low-power ARM-CM4 MCU, 2-MB flash memory, 384-KB static random-access memory (SRAM), and rich peripherals.

WRD2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • The maxium clock rate: 160 MHz
  • Working voltage: 3.3 ± 0.3V
  • Peripherals: 5 GPIOs
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 Ghz
    • Support WPA and WPA 2 security modes
    • Up to +17 dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig and AP network configuration manners for Android and iOS devices
    • Onboard PCB antenna with a gain of 1.0 dBi
    • Working temperature: -20 to 105℃

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Date Updated content Version after update
10/12/2019 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

WRD2L has a row of pins with a 2± 0.1 mm pin spacing.

The WRD2L dimensions are 17.3±0.35 mm (L)×15±0.35 mm (W) ×2.8±0.15 mm (H).
Diagram of dimensions of WRD2L.png

WRD2L Module Datasheet

Pin definition

Pin number Symbol I/O type Function
1 GPIO25 I/O Support hardware PWM and correspond to GPIO 25 (Pin 31) of IC
2 GPIO24 I/O Support hardware PWM and correspond to GPIO 24 (Pin 32) of IC
3 GPIO3 I/O Support hardware PWM and correspond to GPIO 03 (Pin 23) of IC
4 GPIO23 I/O Support hardware PWM and correspond to GPIO 23 (Pin 33) of IC
5 GPIO22 I/O Support hardware PWM and correspond to GPIO 22 (Pin 34) of IC
6 GND P Power supply reference ground
7 3V3 P Power supply pin (3.3V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test points

Pin number Symbol I/O type Function
- GND P Power supply reference ground
- RST I Hardware reset pin; by default, high level; active low
- U_TX I/O UART_TX, user-side serial interface
- U_RX I/O UART_RX, user-side serial interface
- L_TX I/O LOG TX interface
- L_RX I/O LOG RX interface

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VBAT Power supply voltage 3.0 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 105
VBAT Power supply voltage 3.0 3.3 3.6 V
VIL IO low-level input -0.3 - VCC*0.25 V
VIH IO high-level input VCC*0.75 - VCC V
VOL IO low-level output - - VCC*0.1 V
VOH IO high-level output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

TX and RX power consumption

Working Status Mode Rate Transmit Power/Receive Average value Peak value (Typical value)) Unit
Transmit 11 b 11Mbps +17 dBm 200 260 mA
Transmit 11 g 54Mbps +13.5 dBm 170 215 mA
Transmit 11 n MCS 7 +12 dBm 166 200 mA
Receive 11b 11Mbps Constantly receive 65 80 mA
Receive 11g 54Mbps Constantly receive 65 80 mA
Receive 11n MCS 7 Constantly receive 65 80 mA

Working current

Working Mode Working Status, Ta = 25°C Average value Maximum value (Typical value) Unit
Quick connection network state The module is in the fast network connection state and the Wi-Fi indicator always flashes 80 325 mA
Hotspot network configuration state The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly 80 358 mA
Network connection idle state The module is connected to the network and the Wi-Fi indicator is always on 75 245 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; HT40 MCS 0 to 7
Antenna type PCB antenna with a gain of 1.0 dBi

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11 M - 17 - dBm
Average RF output power, 802.11g OFDM Mode 54 M - 13.5 - dBm
Average RF output power, 802.11n OFDM Mode MCS 7 - 12 - dBm
EVM@802.11b CCK 11 Mbps Mode 16 dBm - -23 - dB
EVM@802.11g OFDM 54 Mbps Mode 13.5 dBm - -27 - dB
EVM@802.11n OFDM MCS7 Mode 12 dBm - -28 - dB
Frequency error -10 - 10 ppm

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -83 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -72 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -70 - dBm

Antenna

Antenna type

WRD2L uses only an onboard PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area.

The main points of the layout:

  • Make sure that there is no substrate medium directly below or above the printed antenna.

  • Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.

    WRD2L Module Datasheet

    WRD2L Module Datasheet

    WRD2L Module Datasheet

    WRD2L Module Datasheet

Packaging and production

Mechanical dimensions

The PCB dimensions are 17.3±0.35mm (W)×15±0.35 mm (L) ×2.8±0.15mm (H).

WRD2L Module Datasheet

Side view

WRD2L Module Datasheet

The schematic diagram of a packaging

WRD2L Module Datasheet

The diagram of PCB packaging-pin

WB2L can choose SMT or pin header plug-in. The dimensions of the plug-in are as follows:

WRD2L Module Datasheet

The diagram of PCB Packaging-SMT

WRD2L Module Datasheet

Production instructions

  1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • (SMT process) SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • (Wave soldering process) Wave soldering devices
      • Wave soldering equipment
      • Wave soldering fixture
      • Constant-temperature soldering iron
      • Tin bar, tin wire, and flux
      • Thermal profiler
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      WRD2L Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

WRD2L Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

WRD2L Module Datasheet
Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

WRD2L Module Datasheet

MOQ and packaging information

Product number MOQ (pcs Shipping packaging method The number of modules per reel The number of reels per carton
WRD2L 4000 Tape reel 1000 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WRD2L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WRD2L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.