TYZS10 Module Datasheet

Last Updated on : 2023-06-05 01:36:28download

TYZS10 is a low-power embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732F512GM48) and several peripherals. TYZS10 is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.

After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support.


TYZS10 is a silicon module that can be used to develop Zigbee applications. In terms of hardware, it has PA and DC-DC. In terms of software, it can provide complete basic APIs for Zigbee. Based on this, users can develop embedded Zigbee products as required.

The schematic diagram of TYZS10:
TYZS10 Module Datasheet


  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and the floating-point unit, which can also function as an application processor
  • Clock rate: 40 MHz
  • Wide working voltage: 1.8 V to 3.8 V
  • Peripherals: 2 PWMs, 1 UART
  • Zigbee features
    • Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
    • Built-in DC-DC circuit, maximizing the power-supply efficiency
    • Maximum output power: +19 dBm
    • Power consumption when TYZS10 is working: 63 μA/MHz; current when TYZS10 is in the sleep state: 1.4 μA
    • Onboard PCB antenna
    • Working temperature: -40°C to 85°C
    • AES 128/256-based hardware encryption


  • Intelligent building
  • Intelligent home and household applications
  • Intelligent socket and light
  • Industrial wireless control
  • Health care and measurement
  • Asset tracing

Module interfaces

Dimensions and footprint

TYZS10 uses female headers to draw PWMs, UARTs, 3.3 V, and GND signals. TYZS10 has two lines of pins, 10 pins in total (2*5), with a spacing of 2.0 mm between pins.

The dimensions of TYZS10: 41.3mm ±0.35mm (W)×16.8mm ±0.35mm (L) ×2.5mm± 0.15mm (H).
The overall layout of pins of TYZS10:
TYZS10 Module Datasheet

Pin Definition

Table 1 describes the pins.
Table 1 TYZS10 pins

Pin number Symbol Type Function
1 UART_RX I/O UART0_RXD communication interface, which is used to receive data from serial ports.
2 3.3 V P Power-supply pin of TYZS10 (typical power-supply voltage: 3.3 V)
3 PWM1 I/O Functions as a GPIO and can output PWM signals to control lights.
5 NC - No pin is used.
6 PWM3 I/O Functions as a GPIO and can output PWM signals to control lights.
7 GND P Module reference ground pin
8 NC - No pin is used.
9 GND P Module reference ground pin
10 NC - No pin is used.
TP1 test point nRST I Hardware reset pin, and the chip is reset when the level is low. TYZS10 has a power-on reset function, and this pin is not necessary in the actual situation.
TP2 test point SWCLK I/O JLINK SWCLK programming pin, which can also be used as a GPIO in normal programs.
TP3 test point SWDIO I/O JLINK SWDIO programming pin, which can also be used as a GPIO in normal programs.

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins. nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration. When PWM is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using software.

Definitions of test pins

Table 2 describes the test pins.
Table 2 TYZS10 test pins

Pin number Symbol Type Function
- - I Used for the module production test.

Note: Test pins are not recommended for use.

Electrical parameters

Absolute electrical parameters

Table 3 Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150 °C
VCC Supply voltage -0.3 3.8 V
ESD voltage (human body model) TAMB -25°C - 2.5 kV
ESD voltage (machine model) TAMB -25°C - 0.5 kV

Electrical conditions

Table 4 Normal electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 85 °C
VCC Working voltage 1.8 3.3 3.8 V
VIL Voltage input low -0.3 - VCC x 0.25 V
VIH Voltage input high VCC x 0.75 - VCC V
VOL Voltage output low - - VCC x 0.1 V
VOH Voltage output high VCC x 0.8 - VCC V
Imax Drive current - - 12 mA

Zigbee TX power consumption

Table 5 TX power consumption during constant emission

Symbol Rate TX power Typical value Unit**
IRF 250 kbit/s +19 dBm 120 mA
IRF 250 kbit/s +13 dBm 50 mA
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX power consumption

Table 6 RX power consumption during constant receiving

Symbol Rate Typical value Unit
IRF 250 kbit/s 8 mA

Note: When the UART is in the active state, the received current is 14 mA.

Power consumption in operating mode

Table 7 TYZS11 working current

Working mode Working status (Ta = 25°C) Average value Maximum value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is in the connected state. 5 10 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 1.4 3 uA

RF features

Basic RF features

Table 8 Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type Onboard PCB antenna
Line-of-sight transmission distance > 120 m

Zigbee output performance

Table 9 TX continuous transmission performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output power - +19 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output spectrum adjacent-channel rejection ratio -31 dBc

Note: The maximum wireless output power over an air interface can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

Zigbee RX Sensitivity

Table 10 RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER < 10%, RX sensitivity, 250 kbit/s@OQPSK - -101 - dBm

Antenna information

Antenna type

By default, the onboard PCB antenna is used.

Antenna interference reduction

When you use a copper column antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.

To prevent negative effects on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.

Recommended PCB footprint

Mechanical dimensions

TYZS10 Module Datasheet

Recommended PCB footprint

TYZS10 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYZS10 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

TYZS10 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS10 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method Number of modules per reel Number of reels per carton
TYZS10 6400 Tape reel 1600 4