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Tuya IoT Development Platform

TYZS11 Module Datasheet

Last Updated on : 2023-01-10 07:12:28download

TYZS11 is a low power-consuming embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless radio processor chip (EFR32MG13P732) and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.

Overview

TYZS11 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources.

Figure 1 shows the architecture of TYZS11.

TYZS11 Module Datasheet

Figure 1 TYZS11 architecture

Features

  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor
  • Basic frequency: 40 MHz supported
  • Wide working voltage: 1.8 V to 3.8 V
  • Peripherals: 12 GPIOs, one UART, and one ADC
  • Zigbee features
    • 802.15.4 MAC/PHY supported
    • Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
    • Built-in DC-DC circuit, maximizing the power-supply efficiency
    • Maximum output power: +19 dBm
    • Power consumption when TYZS11 is working: 63 uA/MHz; current when TYZS11 is in the sleep state: 1.4 uA
    • Copper column antenna and onboard PCB antenna
    • Working temperature: -40°C to 85°C
    • AES 128/256-based hardware encryption

Applications

  • Intelligent building
  • Intelligent home and household applications
  • Intelligent socket and light
  • Industrial wireless control
  • Health care and measurement
  • Asset tracing

Module interfaces

Dimensions and footprint

TYZS11 provides three lines of pins with a distance of 1.0 mm between every two pins.

TYZS11 dimension: 15.3±0.35 mm (W) x 22±0.35 mm (L) x 2±0.15 mm (H). The following figure shows the overall pin layout of TYZS11.

TYZS11 Module Datasheet

TYZS11 Module Datasheet

Pin definition

Table 1 describes the interface pins.

Table 1 TYZS11 interface pins

No. Symbol I/O type Functions
1, 2, 11, 12, 13, and 17 GND P Module reference ground pins
19, 22, and 27
3 GPIO3 I/O Corresponds to PD15 pin of the IC and functions as a GPIO.
4 PF3 I/O PF3 pin of the IC and functions as a GPIO.
5 SWCLK I/O JLINK SWCLK programming pin, which can also be used as a GPIO in normal programs.
6 SWDIO I/O JLINK SWDIO programming pin, which can also be used as a GPIO in normal programs.
7 ADC AI ADC port 1, corresponding to PB11 pin of the IC. ADC is a 12-bit precision SAR analog-to-digital converter.
8 and 18 3.3 V P Power-supply pins of TYZS11 (typical power-supply voltage: 3.3 V)
9 SWO I/O Corresponds to PF2 pin of the IC and functions as a GPIO. It can be used as an output pin when J-Link is used.
10 PF6 I/O Corresponds to PF6 pin of the IC and functions as a GPIO.
14 UART_TXD O UART0_TXD communication interface, corresponding to PA0 pin of the IC.
15 UART_RXD I UART0_RXD communication interface, corresponding to PA1 pin of the IC.
16 PD14 I/O Corresponds to PD14 pin of the IC and functions as a GPIO.
20 PWM3 I/O Corresponds to PF4 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.
21 PWM2 I/O Corresponds to PA2 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.
23 nRST I Hardware reset pin, and the chip is reset when the level is low. TYZS11 has a power-on reset function, and this pin is not necessary for the actual situation.
24 GPIO2 I/O Corresponds to PA5 pin of the IC and functions as a GPIO.
25 GPIO0 I/O Corresponds to PA3 pin of the IC and functions as a GPIO.
26 PWM1 I/O Corresponds to PF5 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

The nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration.

This pin can only be used as the ADC interface and cannot be used as the common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using the software.

Test pin definition

Table 2 describes the test pins.

Table 2 TYZS11 test pins

No. Symbol I/O type Functions
- - I Used for the module production test.

Note: It is recommended that test pins not be used.

Electrical characteristics

Absolute electrical characteristics

Table 3 Absolute electrical characteristics

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150 °C
VCC Power-supply voltage -0.3 3.8 V
ESD voltage (human body model) TAMB -25°C - 2.5 kV
ESD voltage (machine model) TAMB -25°C - 0.5 kV

Electrical conditions

Table 4 Normal electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 85 °C
VCC Working voltage 1.8 3.3 3.8 V
VIL I/O low-level input -0.3 - VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 - VCC V
VOL I/O low-level output - - VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 - VCC V
Imax I/O drive current - - 12 mA

Zigbee TX power consumption

Table 5 TX power consumption during constant emission

Symbol Rate TX power Typical value Unit
IRF 250 kbit/s +19 dBm 120 mA
IRF 250 kbit/s +13 dBm 50 mA
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX Power Consumption

Table 6 RX power consumption during constant receiving

Symbol Rate Typical value Unit
IRF 250 kbit/s 8 mA

Note: When the UART is in the active state, the received current is 14 mA.

Power consumption in operating mode

Table 7 TYZS11 working current

Working mode Working status (Ta = 25°C) Average value Maximum value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is in the connected state. 3 5 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 3.5 6 uA
Low power EM2 Low power EM2 mode, with the 64 KB flash. 5 - uA

RF Features

Basic RF Features

Table 8 Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type External copper column spring antenna and onboard PCB antenna
Line-of-sight transmission distance > 120 m

Zigbee output performance

Table 9 TX continuous transmission performance

Parameter Minimum Value Typical Value Maximum Value Unit
Maximum output power - +19 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output spectrum adjacent-channel rejection ratio -31 dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

Zigbee RX sensitivity

Table 10 RX sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
PER < 10%, RX sensitivity, 250 kbit/s@OQPSK - -101 - dBm

Antenna information

Antenna types

By default, the onboard PCB antenna is used. It can be connected to an external copper spring antenna using a connector, which is used for wireless extended coverage in complex installation conditions.

Antenna interference reduction

When you use a copper column antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.

To prevent a negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.

Packaging information and production instructions

Mechanical dimensions

TYZS11 Module Datasheet

TYZS11 Module Datasheet

Recommended PCB footprint

The schematic diagram of footprint:
TYZS11 Module Datasheet

Recommended PCB footprint
TYZS11 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYZS11 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS11 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS11 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method Number of modules per reel Number of reels per carton
TYZS11 6400 Tape reel 1600 4