Last Updated on : 2024-08-19 01:43:12download
TYZS11 is a low power embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless radio processor chip (EFR32MG13P732) and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.
After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support. If you need similar substitute products, see ZTU Module Datasheet.
TYZS11 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources.
Figure 1 shows the architecture of TYZS11.
Figure 1 TYZS11 architecture
TYZS11 provides three lines of pins with a distance of 1.0 mm between every two pins.
TYZS11 dimension: 15.3±0.35 mm (W) x 22±0.35 mm (L) x 2±0.15 mm (H). The following figure shows the overall pin layout of TYZS11.
Table 1 describes the interface pins.
Table 1 TYZS11 interface pins
No. | Symbol | I/O type | Functions |
---|---|---|---|
1, 2, 11, 12, 13, and 17 | GND | P | Module reference ground pins |
19, 22, and 27 | |||
3 | GPIO3 | I/O | Corresponds to PD15 pin of the IC and functions as a GPIO. |
4 | PF3 | I/O | PF3 pin of the IC and functions as a GPIO. |
5 | SWCLK | I/O | JLINK SWCLK programming pin, which can also be used as a GPIO in normal programs. |
6 | SWDIO | I/O | JLINK SWDIO programming pin, which can also be used as a GPIO in normal programs. |
7 | ADC | AI | ADC port 1, corresponding to PB11 pin of the IC. ADC is a 12-bit precision SAR analog-to-digital converter. |
8 and 18 | 3.3 V | P | Power-supply pins of TYZS11 (typical power-supply voltage: 3.3 V) |
9 | SWO | I/O | Corresponds to PF2 pin of the IC and functions as a GPIO. It can be used as an output pin when J-Link is used. |
10 | PF6 | I/O | Corresponds to PF6 pin of the IC and functions as a GPIO. |
14 | UART_TXD | O | UART0_TXD communication interface, corresponding to PA0 pin of the IC. |
15 | UART_RXD | I | UART0_RXD communication interface, corresponding to PA1 pin of the IC. |
16 | PD14 | I/O | Corresponds to PD14 pin of the IC and functions as a GPIO. |
20 | PWM3 | I/O | Corresponds to PF4 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO. |
21 | PWM2 | I/O | Corresponds to PA2 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO. |
23 | nRST | I | Hardware reset pin, and the chip is reset when the level is low. TYZS11 has a power-on reset function, and this pin is not necessary for the actual situation. |
24 | GPIO2 | I/O | Corresponds to PA5 pin of the IC and functions as a GPIO. |
25 | GPIO0 | I/O | Corresponds to PA3 pin of the IC and functions as a GPIO. |
26 | PWM1 | I/O | Corresponds to PF5 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO. |
Note:
- P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
- The nRST is only a module hardware reset pin, which cannot clear the Zigbee pairing.
- This pin can only be used as the ADC interface and cannot be used as the common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using the software.
Table 2 describes the test pins.
Table 2 TYZS11 test pins
No. | Symbol | I/O type | Functions |
---|---|---|---|
- | - | I | Used for the module production test. |
Note: It is recommended that test pins not be used.
Table 3 Absolute electrical characteristics
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -50 | 150 | °C |
VCC | Power-supply voltage | -0.3 | 3.8 | V |
ESD voltage (human body model) | TAMB -25°C | - | 2.5 | kV |
ESD voltage (machine model) | TAMB -25°C | - | 0.5 | kV |
Table 4 Normal electrical conditions
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Working temperature | -40 | - | 85 | °C |
VCC | Working voltage | 1.8 | 3.3 | 3.8 | V |
VIL | I/O low-level input | -0.3 | - | VCC x 0.25 | V |
VIH | I/O high-level input | VCC x 0.75 | - | VCC | V |
VOL | I/O low-level output | - | - | VCC x 0.1 | V |
VOH | I/O high-level output | VCC x 0.8 | - | VCC | V |
Imax | I/O drive current | - | - | 12 | mA |
Table 5 TX power consumption during constant emission
Symbol | Rate | TX power | Typical value | Unit |
---|---|---|---|---|
IRF | 250 kbit/s | +19 dBm | 120 | mA |
IRF | 250 kbit/s | +13 dBm | 50 | mA |
IRF | 250 kbit/s | +10 dBm | 32 | mA |
IRF | 250 kbit/s | +4 dBm | 17 | mA |
IRF | 250 kbit/s | +1 dBm | 11.8 | mA |
Note: When the preceding data is being tested, the duty cycle is set to 100%.
Table 6 RX power consumption during constant receiving
Symbol | Rate | Typical value | Unit |
---|---|---|---|
IRF | 250 kbit/s | 8 | mA |
Note: When the UART is in the active state, the received current is 14 mA.
Table 7 TYZS11 working current
Working mode | Working status (Ta = 25°C) | Average value | Maximum value | Unit |
---|---|---|---|---|
EZ mode | The module is in the EZ state. | 10 | 40 | mA |
Operation mode | The module is in the connected state. | 3 | 5 | mA |
Deep sleep mode | The module is in the deep sleep mode, with the 64 KB flash. | 3.5 | 6 | uA |
Low power EM2 | Low power EM2 mode, with the 64 KB flash. | 5 | - | uA |
Table 8 Basic RF features
Parameter | Description |
---|---|
Frequency band | 2.400 GHz to 2.484 GHz |
Physical-layer standard | IEEE 802.15.4 |
Data transmitting rate | 250 kbit/s |
Antenna type | External copper column spring antenna and onboard PCB antenna |
Line-of-sight transmission distance | > 120 m |
Table 9 TX continuous transmission performance
Parameter | Minimum Value | Typical Value | Maximum Value | Unit |
---|---|---|---|---|
Maximum output power | - | +19 | - | dBm |
Minimum output power | - | -30 | - | dBm |
Output power adjustment step | - | 0.5 | 1 | dB |
Frequency error | -15 | - | +15 | ppm |
Output spectrum adjacent-channel rejection ratio | -31 | dBc |
Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.
Table 10 RX sensitivity
Parameter | Minimum Value | Typical Value | Maximum Value | Unit |
---|---|---|---|---|
PER < 10%, RX sensitivity, 250 kbit/s@OQPSK | - | -101 | - | dBm |
By default, the onboard PCB antenna is used. It can be connected to an external copper spring antenna using a connector, which is used for wireless extended coverage in complex installation conditions.
When you use a copper column antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent a negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.
The schematic diagram of footprint:
Recommended PCB footprint
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Product model | MOQ (pcs) | Packing method | Number of modules per reel | Number of reels per carton |
---|---|---|---|---|
TYZS11 | 6400 | Tape reel | 1600 | 4 |
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