TYBT8 Module Datasheet

Last Updated on : 2023-06-05 01:39:53download

TYBT8 is a low-power embedded Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8269) and a small number of peripheral circuits, with a built-in Bluetooth network communication protocol stack and robust library functions.

After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support. If you need similar substitute products, see BT8C-E Module Datasheet.


TYBT8 also contains a 32-bit low-power MCU, Bluetooth 2.4G radio, 512 KB flash, 32 KB SRAM, and nine reusable I/O interfaces.


  • Built-in 32-bit low power-consuming MCU, which can also be used as an application processor
    Basic frequency: 48 MHz supported
  • Working voltage: 1.9 V to 3.6 V
  • Peripheral equipment: three PWMs
  • Bluetooth RF
    • Compatible with Bluetooth 4.2
    • RF data rate: up to 2 Mbit/s
    • TX power: +7 dBm
    • RX sensitivity: –92 dBm @ Bluetooth 1 Mbit/s
    • Built-in AES encryption for hardware
    • External antenna
    • Working temperature: -40℃ to 105℃

Major application fields

  • Intelligent LED
  • Intelligent home appliances
  • Intelligent low power-consuming sensors

Module interfaces

Dimensions and pin layout

TYBT8 provides a total of six pins on the front and back sides for plug-in assembly.

TYBT8 size: 8.5±0.35 mm (W)×12.7±0.35 mm (L)

Figure 2.1 shows the overall pin layout of TYBT8.

TYBT8 Module Datasheet

TYBT8 Module Datasheet

Figure 2.1 Overall pin layout of TYBT8

Pin definition

Table 2.1 describes the interface pins.
Table 2.1 TYBT8 interface pins

No. Symbol I/O Type Functions
1 ANT I/O RF signal input and output port
2 GND P Module power supply reference ground pin
3 PWM0 I/O Common I/O interface, which can be used for PWM output of LED drives
4 PWM1 I/O Common I/O interface, which can be used for PWM output of LED drives
5 PWM4 I/O Common I/O interface, which can be used for PWM output of LED drives
6 3.3V P Module power supply input pin
TP1 SWS I/O Test point: Bluetooth chip programming pin
TP2 RST I Test point: Module reset pin
TP3 TX I/O Serial port sending pin, which can be used as a common I/O interface
TP4 RX I/O Serial port receiving pin, which can be used as a common I/O interface

Note: P indicates power-supply pins, and I/O indicates input/output pins.
The SWS pin is used only for the programming of module firmware.

Electrical parameters

Absolute electrical parameters

Table 3.1 Absolute electrical parameters

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -20 125
VCC Power-supply voltage -0.3 3.9 V
Static electricity voltage (human model) TAMB -25℃ - 2 KV
Static electricity voltage (machine model) TAMB -25℃ - 0.5 KV

Electrical conditions

Table 3.2 Normal electrical conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature -20 - 85
VCC Working voltage 1.9 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC x 0.3 V
VIH I/O high-level input VCC x 0.7 - VCC V
VOL I/O low-level output VSS - 0.3 V
VOH I/O high-level output VCC - 0.3 - VCC V

Power consumption in operating mode

Table 3.3 TX power consumption during constant emission

Symbol Condition Typical Value Unit
ITX Constant sending with 0 dBm output power 15 mA
IRX Constant receiving 12 mA
IDC Mesh connected 27 mA
Isleep Sleep mode with I/O waked up 10 μA
Ideepsleep Deep sleep mode 1.7 μA

RF features

Basic RF features

Table 4.1 Basic RF features

Parameter Description
Frequency band 2.4 GHz ISM band
Radio standard Bluetooth 4.2
Data transmission rate 1 Mbit/s
Antenna type External antenna

RF output power

Table 4.2 TX power during constant emission

Parameter Minimum Value Typical Value Maximum Value Unit
RF average output power 3.8 7 8 dBm
20 dB modulation signal bandwidth (1 M) - 1300 - KHz

RF RX sensitivity

Table 4.3 RX sensitivity

Parameter Rate Minimum Value Typical Value Maximum Value Unit
RX sensitivity 1Mbit/s -93 -92 -90 dBm
Frequency offset error 1Mbit/s -300 - +300 KHz
Co-channel interference suppression - - -7 - dB

Antenna information

Antenna types

TYBT8 uses an external spring antenna, and the specific gain and size can be customized according to customer requirements.

Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna on the module be at least 15 mm away from other metal parts. If the antenna is wrapped with metal materials, the wireless signal will be significantly attenuated, thereby deteriorating the RF performance. Because the module is installed as a plug-in, reserve enough space for the antenna.

Packaging information and production instructions

Mechanical dimensions and size of the back pad

TYBT8 Module Datasheet

Figure 6.1 TYBT8 size diagram

Production instructions

  • For the in-line module developed by Tuya, wave soldering equipment is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).

  • Soldering equipment and materials:

    • Wave soldering equipment
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Oven temperature tester
  • Baking equipment:

    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves
  • The module needs to be baked in the following cases:

    • The vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the quality of products, you must pay attention to the following items:

    • The amount of soldering flux.
    • The height of the wave peak.
    • Whether the tin slag and copper content in the wave soldering tank exceed standards.
    • Whether the window and thickness of the wave soldering fixture are appropriate.
    • Whether the wave soldering oven temperature curve is reasonable.

Recommended oven temperature curve and temperature

For oven temperature setting, refer to oven temperatures for wave soldering. The peak temperature is 260°C±5°C. The wave soldering temperature curve is shown below:

TYBT8 Module Datasheet

Recommended soldering temperature:

Recommended wave soldering oven temperature Recommended manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • The package contains a humidity indicator card (HIC).

    TYBT8 Module Datasheet

    TYBT8 Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Shipment packaging method The number of modules per reel The number of reels per carton
TYBT8 5600 Tape reel 1400 4