Last Updated on : 2023-06-05 01:39:53download
TYBT8 is a low-power embedded Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8269) and a small number of peripheral circuits, with a built-in Bluetooth network communication protocol stack and robust library functions.
After a period of service, this module will become deprecated due to product upgrades and iterations, user requirements, production inventory, or other reasons. To improve the compatibility of your smart devices and minimize the impact on your use, Tuya continues to provide webpage documentation of deprecated modules, but no longer maintains or updates the documentation. The content herein is for reference only.
If you have any questions, submit a ticket to contact Tuya or consult Tuya’s account manager to request support. If you need similar substitute products, see BT8C-E Module Datasheet.
TYBT8 also contains a 32-bit low-power MCU, Bluetooth 2.4G radio, 512 KB flash, 32 KB SRAM, and nine reusable I/O interfaces.
TYBT8 provides a total of six pins on the front and back sides for plug-in assembly.
TYBT8 size: 8.5±0.35 mm (W)×12.7±0.35 mm (L)
Figure 2.1 shows the overall pin layout of TYBT8.
Figure 2.1 Overall pin layout of TYBT8
Table 2.1 describes the interface pins.
Table 2.1 TYBT8 interface pins
|1||ANT||I/O||RF signal input and output port|
|2||GND||P||Module power supply reference ground pin|
|3||PWM0||I/O||Common I/O interface, which can be used for PWM output of LED drives|
|4||PWM1||I/O||Common I/O interface, which can be used for PWM output of LED drives|
|5||PWM4||I/O||Common I/O interface, which can be used for PWM output of LED drives|
|6||3.3V||P||Module power supply input pin|
|TP1||SWS||I/O||Test point: Bluetooth chip programming pin|
|TP2||RST||I||Test point: Module reset pin|
|TP3||TX||I/O||Serial port sending pin, which can be used as a common I/O interface|
|TP4||RX||I/O||Serial port receiving pin, which can be used as a common I/O interface|
Note: P indicates power-supply pins, and I/O indicates input/output pins.
The SWS pin is used only for the programming of module firmware.
Table 3.1 Absolute electrical parameters
|Parameter||Description||Minimum Value||Maximum Value||Unit|
|Static electricity voltage (human model)||TAMB -25℃||-||2||KV|
|Static electricity voltage (machine model)||TAMB -25℃||-||0.5||KV|
Table 3.2 Normal electrical conditions
|Parameter||Description||Minimum Value||Typical Value||Maximum Value||Unit|
|VIL||I/O low-level input||-0.3||-||VCC x 0.3||V|
|VIH||I/O high-level input||VCC x 0.7||-||VCC||V|
|VOL||I/O low-level output||VSS||-||0.3||V|
|VOH||I/O high-level output||VCC - 0.3||-||VCC||V|
Table 3.3 TX power consumption during constant emission
|ITX||Constant sending with 0 dBm output power||15||mA|
|Isleep||Sleep mode with I/O waked up||10||μA|
|Ideepsleep||Deep sleep mode||1.7||μA|
Table 4.1 Basic RF features
|Frequency band||2.4 GHz ISM band|
|Radio standard||Bluetooth 4.2|
|Data transmission rate||1 Mbit/s|
|Antenna type||External antenna|
Table 4.2 TX power during constant emission
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|RF average output power||3.8||7||8||dBm|
|20 dB modulation signal bandwidth (1 M)||-||1300||-||KHz|
Table 4.3 RX sensitivity
|Parameter||Rate||Minimum Value||Typical Value||Maximum Value||Unit|
|Frequency offset error||1Mbit/s||-300||-||+300||KHz|
|Co-channel interference suppression||-||-||-7||-||dB|
TYBT8 uses an external spring antenna, and the specific gain and size can be customized according to customer requirements.
To ensure optimal RF performance, it is recommended that the antenna on the module be at least 15 mm away from other metal parts. If the antenna is wrapped with metal materials, the wireless signal will be significantly attenuated, thereby deteriorating the RF performance. Because the module is installed as a plug-in, reserve enough space for the antenna.
Figure 6.1 TYBT8 size diagram
For the in-line module developed by Tuya, wave soldering equipment is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
Soldering equipment and materials:
The module needs to be baked in the following cases:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the quality of products, you must pay attention to the following items:
For oven temperature setting, refer to oven temperatures for wave soldering. The peak temperature is 260°C±5°C. The wave soldering temperature curve is shown below:
Recommended soldering temperature:
|Recommended wave soldering oven temperature||Recommended manual soldering temperature|
|Preheat temperature||80 to 130 °C||Soldering temperature||360±20°C|
|Preheat time||75 to 100s||Soldering time||＜3s/point|
|Peak contact time||3 to 5s||NA||NA|
|Temperature of tin cylinder||260±5°C||NA||NA|
Storage conditions for a delivered module are as follows:
The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
The package contains a humidity indicator card (HIC).
|Product number||MOQ (pcs)||Shipment packaging method||The number of modules per reel||The number of reels per carton|
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