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BT8C-E Module Datasheet

Last Updated on : 2022-02-28 01:13:59download

BT8C-E is a low-power embedded Bluetooth module that Tuya has developed. Embedded with the Bluetooth communication protocol stack and rich library functions, it also consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and a few peripheral circuits.

Product overview

BT8C-E further contains a low-power 32-bit MCU, a Bluetooth LE 5.0/2.4-G Radio, 512-KB flash memory, 48-KB SRAM, and 3 reusable I/O ports.

Features

  • Embedded with a low-power 32-bit MCU, which can also function as an application processor
    • The clock rate: 48 MHz
  • Working voltage: 1.8 to 3.6 V. If the voltage is between 1.8 and 2.7 V, the module can start, but the optimal RF performance cannot be ensured. If the voltage is between 2.8 and 3.6 V, the overall performance will be normal.
  • Peripheral: 3 PWMs
  • Bluetooth LE RF features
    • Bluetooth LE 4.2/5.0
    • The RF data rate can be up to 2 Mbps.
    • TX power: +10 dBm
    • RX sensitivity: -94.5 dBm@Bluetooth LE 1 Mbps
    • Embedded hardware AES encryption
    • External antenna
    • Working temperature: -40℃ to +85℃

Applications

  • Smart LED
  • Smart home
  • Smart low-power sensor

Change history

Update Date Updated Content Version after Update
June 16, 2019 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

BT8C-E has six pins on the front and back sides for plug-in assembly.

The dimensions of BT8C-E are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15mm (H). The thickness of the PCB is 1.0±0.1mm. The footprint is shown below:
BT8C-E Module Datasheet

BT8C-E Module Datasheet

Pin definition

The definitions of pins are shown in the following table:

Pin No. Symbol I/O type Function
1 ANT I/O It is the port for inputting and outputting the RF signal and corresponds to ANT of the IC.
2 G P GND, Power supply reference ground
3 C3 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C3 of the IC
4 D2 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_D2 of the IC
5 C2 I/O Common I/O interface, which can be used as PWM output of the LED drive and corresponds to TL_C2 of the IC
6 P P Power supply pin (3.3V)

Note:

  • P indicates a power supply pin and I/O indicates an input/output pin.
  • If you have any special requirements on the light colour controlled by the PWM output, please contact the business personnel of Tuya.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -65 150
VCC Power supply voltage -0.3 3.9 V
ESD voltage (human body model) TAMB-25℃ - 2 kV
ESD voltage (machine model) TAMB-25℃ - 0.5 kV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 85
VCC Working voltage 2.8 3.3 3.6 V
VIL I/O low-level input VSS - VCC*0.3 V
VIH I/O high-level input VCC*0.7 - VCC V
VOL I/O low-level output VSS - VCC*0.1 V
VOH I/O high-level output VCC*0.9 - VCC V

Power consumption in working mode

Symbol Conditions Maximum value (Typical value) Unit
Itx Constantly transmit with the output power of 11.5 dBm 18 mA
Irx Constantly receive 6.7 mA
IDC Average value in mesh networking state 6.6 mA
IDC Peak value in mesh networking state 24.9 mA
Ideepsleep1 Deep sleep mode (reserve 16-KB RAM) 1.2 μA
Ideepsleep2 Deep sleep mode (not reserve RAM) 0.4 μA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.4 GHz ISM band
Wireless standard Bluetooth LE 4.2/5.0
Data transmission rate 1 Mbps, 2 Mbps
Antenna type External antenna

RF output power

Parameter Minimum value Typical value Maximum value Unit
Average RF output power -22 10 11 dBm
Bandwidth of 20-dB modulation signal (1M) - 2500 - KHz
Bandwidth of 20-dB modulation signal (2M) - 1400 - KHz

RF receiving sensitivity

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity 1 Mbps - -93 - dBm
RX sensitivity 2 Mbps - -90 - dBm
Frequency offset error 1 Mbps -250 - +300 KHz
Frequency offset error 2 Mbps -300 - +200 KHz
Co-channel interference suppression - -10 - dB

Antenna information

Antenna type

BT8C-E uses an external monopole sub-antenna.

Antenna interference reduction

To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.

Packaging information and production instructions

Mechanical dimensions and dimensions of the back of the pad

The PCB dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×1.0±0.1 mm (H).

BT8C-E Module Datasheet

Recommended PCB footprint

BT8C-E Module Datasheet

Production instructions

  1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
  2. Wave soldering devices and materials:
    • Wave soldering equipment
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Thermal profiler
  3. Baking devices:
    • Cabinet oven
    • Anti-electrostatic and heat-resistant trays
    • Anti-electrostatic and heat-resistant gloves
  4. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  5. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  6. In the whole production process, take electrostatic discharge (ESD) protective measures.
  7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

BT8C-E Module Datasheet

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

Storage conditions for a delivered module:

  • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • There is a humidity indicator card (HIC) in the packaging bag.

    BT8C-E Module Datasheet

    BT8C-E Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Packing method Modules per reel Reels per carton
BT8C-E 6000 Tape reel 1500 4

Appendix-Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

BT8C-E Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

BT8C-E Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.