BTCM Module Datasheet

This topic describes Tuya’s proprietary BTCM Bluetooth low energy (LE) module. It consists of a highly integrated Bluetooth chip TLSR8250F512ET32 and a few peripheral circuits. It has built-in Bluetooth protocol stacks and a rich set of library functions.

Overview

BTCM module is built around a 32-bit MCU with 512 KB flash and 48 KB SRAM. The embedded 2.4 GHz transceiver supports Bluetooth 5.0 low energy.

Features

• Built-in low-power 32-bit microcontroller unit (MCU) that also acts as an application processor.
  • Clock rate of 48 MHz
• Operating voltage: 3.0V to 3.6V
• Peripherals: 6 pulse-width modulators (PWMs) and 1 universal asynchronous receiver/transmitter (UART)
• Bluetooth LE radio frequency (RF) features
  • Bluetooth LE 5.0
  • RF data rate of up to 2 Mbit/s
  • Transmitter power: +9 dBm
  • Receiver sensitivity: -94 dBm@Bluetooth Low Energy 1 Mbit/s
• Embedded hardware Advanced Encryption Standard (AES) encryption
• External antenna
• Operating temperature: -40°C to +85°C.

Applications

• Smart LED
• Smart home
• Smart low power sensor

Module interfaces

Dimensions and footprint

BTCM has four rows of pins with a 1.5±0.1mm pin spacing.

The BTCM dimensions are 113.5±0.35 mm (W) × 12±0.35 mm (L) × 2.8±0.15 mm (H).

Pin definition

Pin No.	Symbol	I/O type	Feature
1	GND	P	Ground pin.
2	RF	I/O	An RF port, corresponding to ANT (Pin 27) on the IC.
3	GND	P	Ground pin.
4	GND	P	Ground pin.
5	RST	I	A hardware reset pin, corresponding to RESETB (Pin 25) on the IC. It outputs high by default, and is effective when pulled down.
6	D4	I/O	A normal I/O pin, corresponding to D4 (Pin 1) on the IC.
7	GND	P	Ground pin.
8	A1	I/O	A normal I/O pin, corresponding to A1 (Pin 4) on the IC.
9	D3	I/O	A normal I/O pin, corresponding to D3 (Pin 32) on the IC.
10	B6	I/O	A normal I/O pin, corresponding to B6 (Pin 16) on the IC.
11	D7	I/O	A normal I/O pin, corresponding to D7 (Pin 2) on the IC.
12	D2	I/O	A normal I/O pin, corresponding to D2 (Pin 31) on the IC. This pin can be used as PWM output for the LED driver.
13	C2	I/O	A normal I/O pin, corresponding to C2 (Pin 22) on the IC. This pin can be used as PWM output for the LED driver.
14	SWS	I/O	Used for firmware flashing, corresponding to SWS (Pin 5) on the IC.
15	C0	I/O	A normal I/O pin, corresponding to C0 (Pin 20) on the IC.
16	TX	I/O	A serial transmitter pin UART TX, corresponding to B1 (Pin 6) on the IC.
17	RX	I/O	A serial receiver pin UART RX, corresponding to B7 (Pin 17) on the IC.
18	GND	P	Ground pin.
19	GND	P	Ground pin.
20	3V3	P	Power supply pin (3.3V).
21	GND	P	Ground pin.
22	NC	NC	No connection.
23	A0	I/O	A normal I/O pin, corresponding to A0 (Pin 3) on the IC.
24	B5	I/O	A normal I/O pin, corresponding to B5 (Pin 15) on the IC. This pin can be used as PWM output for the LED driver.
25	C4	I/O	A normal I/O pin, corresponding to C4 (Pin 24) on the IC. This pin can be used as PWM output for the LED driver.
26	B4	I/O	A normal I/O pin, corresponding to B4 (Pin 14) on the IC. This pin can be used as PWM output for the LED driver.
27	C3	I/O	A normal I/O pin, corresponding to C3 (Pin 23) on the IC. This pin can be used as PWM output for the LED driver.
28	C1	I/O	A normal I/O pin, corresponding to C1 (Pin 21) on the IC.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-65	150	°C
VCC	Supply voltage	-0.3	3.9	V
Electrostatic discharge voltage (human body model)	TAMB-25°C	-	2	kV
Electrostatic discharge voltage (machine model)	TAMB-25°C	-	0.5	kV

Operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	-40	-	85	°C
VCC	Operating voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	VSS	-	VCC × 0.3	V
VIH	I/O high-level input	VCC × 0.7	-	VCC	V
VOL	I/O low-level input	VSS	-	VCC × 0.1	V
VOH	I/O high-level output	VCC × 0.9	-	VCC	V

Power consumption in working mode

Symbol	Condition	Max (Typical)	Unit
Itx	Continuous transmission, with an output power of 10 dBm	18	mA
Irx	Continuous reception	6.7	mA
IDC	Average value when connected over Bluetooth mesh	6.6	mA
IDC	Peak value when connected over Bluetooth mesh	24.9	mA
Ideepsleep1	Deep sleep mode (16 KB RAM reserved)	1.2	μA
Ideepsleep2	Deep sleep mode (RAM not reserved)	0.4	μA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.4 GHz ISM band
Wireless standard	Bluetooth LE 5.0
Data transmission rate	1 Mbit/s and 2 Mbit/s
Antenna type	External antenna

RF output power

Parameter	Min value	Typical value	Max value	Unit
RF average output power	-22	10	11	dBm
Bandwidth of 20 dB modulation signal (1 Mbit/s)	N/A	2500	-	KHz
Bandwidth of 20 dB modulation signal (2 Mbit/s)	N/A	1400	-	KHz

RF receiving sensitivity

Parameter	Min value	Typical value	Max value	Unit
RX sensitivity at 1 Mbit/s	-	-96	-	dBm
RX sensitivity at 2 Mbit/s	-	-93	-	dBm
Frequency offset error at 1 Mbit/s	-250	-	+300	KHz
Frequency offset error at 2 Mbit/s	-300	-	+200	KHz
Co-channel interference suppression	-	-10	-	dB

Antenna information

Antenna type

The BTCM module uses an external monopole antenna.

Antenna interference reduction

The distance between the antenna and other metal components should be at least 15 mm to provide the best radio performance. If metal materials wrap the surrounding of the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. Allow enough space to support the RF layout when designing your product.

Packing and production instructions

Mechanical dimensions

The PCB dimensions are 13.5±0.35 mm (W) × 12±0.35 mm (L) × 0.8±0.1 mm (H).

SMT package

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indication card (HIC) in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher (the circle turns pink on the HIC).
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: Ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	Number of modules per reel	Number of reels per carton
BTCM	6,000	Tape and reel	1,500	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.