Last Updated on : 2023-05-15 07:08:29download
This topic describes Tuya’s proprietary BTCM Bluetooth low energy (LE) module. It consists of a highly integrated Bluetooth chip TLSR8250F512ET32 and a few peripheral circuits. It has built-in Bluetooth protocol stacks and a rich set of library functions.
BTCM module is built around a 32-bit MCU with 512 KB flash and 48 KB SRAM. The embedded 2.4 GHz transceiver supports Bluetooth 5.0 low energy.
BTCM has four rows of pins with a 1.5±0.1mm pin spacing.
The BTCM dimensions are 113.5±0.35 mm (W) × 12±0.35 mm (L) × 2.8±0.15 mm (H).
|Pin No.||Symbol||I/O type||Feature|
|2||RF||I/O||An RF port, corresponding to ANT (Pin 27) on the IC.|
|5||RST||I||A hardware reset pin, corresponding to RESETB (Pin 25) on the IC. It outputs high by default, and is effective when pulled down.|
|6||D4||I/O||A normal I/O pin, corresponding to D4 (Pin 1) on the IC.|
|8||A1||I/O||A normal I/O pin, corresponding to A1 (Pin 4) on the IC.|
|9||D3||I/O||A normal I/O pin, corresponding to D3 (Pin 32) on the IC.|
|10||B6||I/O||A normal I/O pin, corresponding to B6 (Pin 16) on the IC.|
|11||D7||I/O||A normal I/O pin, corresponding to D7 (Pin 2) on the IC.|
|12||D2||I/O||A normal I/O pin, corresponding to D2 (Pin 31) on the IC. This pin can be used as PWM output for the LED driver.|
|13||C2||I/O||A normal I/O pin, corresponding to C2 (Pin 22) on the IC. This pin can be used as PWM output for the LED driver.|
|14||SWS||I/O||Used for firmware flashing, corresponding to SWS (Pin 5) on the IC.|
|15||C0||I/O||A normal I/O pin, corresponding to C0 (Pin 20) on the IC.|
|16||TX||I/O||A serial transmitter pin UART TX, corresponding to B1 (Pin 6) on the IC.|
|17||RX||I/O||A serial receiver pin UART RX, corresponding to B7 (Pin 17) on the IC.|
|20||3V3||P||Power supply pin (3.3V).|
|23||A0||I/O||A normal I/O pin, corresponding to A0 (Pin 3) on the IC.|
|24||B5||I/O||A normal I/O pin, corresponding to B5 (Pin 15) on the IC. This pin can be used as PWM output for the LED driver.|
|25||C4||I/O||A normal I/O pin, corresponding to C4 (Pin 24) on the IC. This pin can be used as PWM output for the LED driver.|
|26||B4||I/O||A normal I/O pin, corresponding to B4 (Pin 14) on the IC. This pin can be used as PWM output for the LED driver.|
|27||C3||I/O||A normal I/O pin, corresponding to C3 (Pin 23) on the IC. This pin can be used as PWM output for the LED driver.|
|28||C1||I/O||A normal I/O pin, corresponding to C1 (Pin 21) on the IC.|
P indicates the power pin, and I/O indicates the input and output pin.
|Parameter||Description||Min value||Max value||Unit|
|Electrostatic discharge voltage (human body model)||TAMB-25°C||-||2||kV|
|Electrostatic discharge voltage (machine model)||TAMB-25°C||-||0.5||kV|
|Parameter||Description||Min value||Typical value||Max value||Unit|
|VIL||I/O low-level input||VSS||-||VCC × 0.3||V|
|VIH||I/O high-level input||VCC × 0.7||-||VCC||V|
|VOL||I/O low-level input||VSS||-||VCC × 0.1||V|
|VOH||I/O high-level output||VCC × 0.9||-||VCC||V|
|Itx||Continuous transmission, with an output power of 10 dBm||18||mA|
|IDC||Average value when connected over Bluetooth mesh||6.6||mA|
|IDC||Peak value when connected over Bluetooth mesh||24.9||mA|
|Ideepsleep1||Deep sleep mode (16 KB RAM reserved)||1.2||μA|
|Ideepsleep2||Deep sleep mode (RAM not reserved)||0.4||μA|
|Operating frequency||2.4 GHz ISM band|
|Wireless standard||Bluetooth LE 5.0|
|Data transmission rate||1 Mbit/s and 2 Mbit/s|
|Antenna type||External antenna|
|Parameter||Min value||Typical value||Max value||Unit|
|RF average output power||-22||10||11||dBm|
|Bandwidth of 20 dB modulation signal (1 Mbit/s)||N/A||2500||-||KHz|
|Bandwidth of 20 dB modulation signal (2 Mbit/s)||N/A||1400||-||KHz|
|Parameter||Min value||Typical value||Max value||Unit|
|RX sensitivity at 1 Mbit/s||-||-96||-||dBm|
|RX sensitivity at 2 Mbit/s||-||-93||-||dBm|
|Frequency offset error at 1 Mbit/s||-250||-||+300||KHz|
|Frequency offset error at 2 Mbit/s||-300||-||+200||KHz|
|Co-channel interference suppression||-||-10||-||dB|
The BTCM module uses an external monopole antenna.
The distance between the antenna and other metal components should be at least 15 mm to provide the best radio performance. If metal materials wrap the surrounding of the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. Allow enough space to support the RF layout when designing your product.
The PCB dimensions are 13.5±0.35 mm (W) × 12±0.35 mm (L) × 0.8±0.1 mm (H).
Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.
A delivered module must meet the following storage requirements:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indication card (HIC) in the sealed package.
The module needs to be baked in the following cases:
The baking parameter settings are described below:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: temperature axis
B: time axis
C: alloy liquidus temperature from 217°C to 220°C
D: ramp-up slope from 1°C/s to 3°C/s
E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s
F: temperature above liquidus temperature for 50s to 70s
G: peak temperature from 235°C to 245°C
H: Ramp-down slope from 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.
|Product model||MOQ (pcs)||Shipping packaging method||Number of modules per reel||Number of reels per carton|
|BTCM||6,000||Tape and reel||1,500||4|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining FCC authorization by a Class II permissive change application or a new application.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm from the human body.
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