English
English
简体中文
Contact Us
Register
Log In

Tuya IoT Development Platform

layoutIndex

BT5S Module Datasheet

Last Updated on : 2022-10-17 01:43:09download

BT5S is an embedded Bluetooth low energy (Bluetooth LE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral circuits, with an embedded Bluetooth network protocol stack and robust library functions.

Overview

BT5S contains a low-power 32-bit microcontroller unit (MCU), Bluetooth LE 5.0 or 2.4 GHz radio, 512 KB flash memory, 48 KB static random-access memory (SRAM), and six multiplexing I/O pins.

Features

  • Embedded low-power 32-bit MCU, which can also function as an application processor

    Clock rate: 48 MHz

  • Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.)

  • Peripherals: one Inter-Integrated Circuit (I2C) bus, four pulse width modulation (PWM) pins, and one universal asynchronous receiver/transmitter (UART)

  • Bluetooth LE RF features:

    • Compatible with Bluetooth LE 5.0
    • RF data rate: 1 Mbit/s or 2 Mbit/s
    • TX power: +10 dBm
    • RX sensitivity: -94.5 dBm at Bluetooth LE 1 Mbit/s
  • Embedded Advanced Encryption Standard (AES) hardware encryption

  • Onboard PCB antenna

  • Working temperature: -40°C to +85°C

Scenarios

  • Smart households
  • Smart low-power sensors

Module interfaces

Dimensions and footprint

BT5S has two rows of 14 pins on the front and rear sides with a 2 mm pin spacing.
The BT5S dimensions (H x W x D) are 2.0±0.15 mm x 14.8±0.35 mm x 20.4±0.35 mm. The following figures show the front and rear views.
BT5S Module Datasheet
BT5S Module Datasheet

Interface pin definition

Pin No. Symbol I/O type Function
1 GND P Power supply reference ground pin
2 B1 I/O Serial TX pin, which can be used as a common I/O pin and is connected to the PB1 pin on the internal IC
3 3V3 P Power supply pin
4 RST I Reset pin, which is connected to the RESETB pin on the internal IC (The module is embedded with a pull-up resistor.)
5 B7 I/O Serial RX pin, which can be used as a common I/O pin and is connected to the PB7 pin on the internal IC
6 C2 I/O Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the PC2 pin on the internal IC
7 SWS I/O Bluetooth chip programming pin, which is connected to the SWS pin on the internal IC
8 C3 I/O Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the PC3 pin on the internal IC
9 D2 I/O Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the PD2 pin on the internal IC
10 C0 I/O I2C data cable pin, which can be used as a common I/O pin and is connected to the PC0 pin on the internal IC
11 C1 I/O I2C clock cable pin, which can be used as a common I/O pin and is connected to the PC1 pin on the internal IC
12 3V3 P Power supply pin
13 B4 I/O Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the PB4 pin on the internal IC
14 GND P Power supply reference ground pin

Note: P indicates a power supply pin, and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature –65 150 °C
VCC Power supply voltage –0.3 3.9 V
Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV
Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 N/A 85 °C
VCC Working voltage 1.8 3.3 3.6 V
VIL I/O low-level input VSS N/A VCC x 0.3 V
VIH I/O high-level input VCC x 0.7 N/A VCC V
VOL I/O low-level output VSS N/A VCC x 0.1 V
VOH I/O high-level output VCC x 0.9 N/A VCC V

Working current

Symbol Condition Typical value Maximum value Unit
Itx Continuous TX, 10 dBm output power 16.8 18.4 mA
Itx Continuous TX, 0 dBm output power 6.3 8.8 mA
Irx Continuous RX 6.3 8.9 mA
IDC Network pairing 6.8 32 mA
IDC Connected 6.8 32 mA
Isleep Sleep mode 1.5 30 μA

RF features

Basic RF features

Parameter Description
Working frequency 2.4 GHz ISM band
Wireless standard Bluetooth LE 5.0
Data transmission rate 1 Mbit/s or 2 Mbit/s
Antenna type Onboard PCB antenna

RF TX power

Parameter Minimum value Typical value Maximum value Unit
Average RF output power –22 10 10.5 dBm
20 dB modulation signal bandwidth (1 Mbit/s) N/A 2500 N/A kHz
20 dB modulation signal bandwidth (2 Mbit/s) N/A 2600 N/A kHz

RF RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity (1 Mbit/s) N/A –94.5 N/A dBm
RX sensitivity (2 Mbit/s) N/A –90 N/A dBm
Frequency offset error (1 Mbit/s) –300 N/A +300 kHz
Frequency offset error (2 Mbit/s) –200 N/A +200 kHz
Co-channel interference suppression N/A –7 N/A dB

Antenna

Antenna type

BT5S uses an onboard PCB antenna.

Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance.

BT5S Module Datasheet

BT5S Module Datasheet

BT5S Module Datasheet

BT5S Module Datasheet

Packaging information and production instructions

Mechanical dimensions and rear solder pad dimensions

BT5S Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for some measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Recommended footprint:

BT5S Module Datasheet

Note:Note that the recommended pad size of pin 11 is smaller than other pin pads to prevent tin connection.

Production instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
    • SMT placement equipment
      • Reflow soldering machine
      • Automated optical inspection (AOI) equipment
      • Nozzle with a 6 mm to 8 mm diameter
    • Baking equipment
      • Cabinet oven
      • Anti-static heat-resistant trays
      • Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:
    • The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
    • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      BT5S Module Datasheet
  3. Bake a module based on HIC status as follows when you unpack the module package:
    • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    • If the 30% circle is pink, bake the module for 4 consecutive hours.
    • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings:
    • Baking temperature: 125±5°C
    • Alarm temperature: 130°C
    • SMT placement ready temperature after natural cooling: < 36°C
    • Number of drying times: 1
    • Rebaking condition: The module is not soldered within 12 hours after baking.
  5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
  6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before the first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

BT5S Module Datasheet

Storage conditions

BT5S Module Datasheet

MOQ and packing information

Product model MOQ Packing method Number of modules in each reel pack Number of reel packs in each box
BT5S 6000 Carrier tape and reel packing 1500 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-BT5S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BT5S”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

BT5S Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

BT5S Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.