BT5S Module Datasheet

Last Updated on : 2024-06-14 03:12:22download

This topic describes Tuya’s proprietary BT5S Bluetooth low energy (LE) module. It consists of a highly integrated Bluetooth chip TLSR8250F512ET32 and a few peripheral circuits. It has built-in Bluetooth protocol stacks and a rich set of library functions.


The BT5S module is built around a 32-bit MCU with 512 KB flash and 48 KB SRAM. It has 6 GPIOs. The embedded 2.4 GHz transceiver supports Bluetooth 5.0 low energy.


  • Built-in low-power 32-bit microcontroller unit (MCU) that also acts as an application processor.

    • Clock rate of 48 MHz.
  • Operating voltage range: 3.0V to 3.6V.

  • Peripherals: 4 pulse-width modulators (PWMs), 1 I2C port, and 1 universal asynchronous receiver/transmitter (UART) port.

  • Bluetooth LE radio frequency (RF) features:

    • Bluetooth LE 5.0
    • RF data rate: 1 Mbit/s and 2 Mbit/s
    • Transmitter power: +10 dBm
    • Receiver sensitivity: -94.5 dBm@Bluetooth LE 1 Mbit/s
  • Embedded hardware Advanced Encryption Standard (AES) encryption

  • Printed circuit board (PCB) antenna

  • Operating temperature range: -40°C to +85°C.

Scope of applications

  • Smart home
  • Smart low power sensor

Module interfaces

Dimensions and footprint

BT5S has two rows of pins with a spacing of 2 mm. This module has a total of 14 pins.

Dimensions of the BT5S module are 14.8±0.35 mm (W) × 20.4±0.35 mm (L) × 2.0±0.15 mm (H). The following figure shows the module footprint.

BT5S Module Datasheet BT5S Module Datasheet

Pin definition

The following table lists the pin definitions.

No. Symbol I/O type Description
1 C3 I/O Corresponds to chip PC<3>. It is a GPIO port and can be used as PWM output for the LED driver.
2 D2 I/O Corresponds to chip PD<2>. It is a GPIO port and can be used as PWM output for the LED driver.
3 C0 I/O Corresponds to chip PC<0>. It is a data line pin of I2C and can be used as a GPIO port.
4 C1 I/O Corresponds to chip PC<1>. It is a clock line pin of I2C and can be used as a GPIO port.
5 3V3 P Module power input pin.
6 B4 I/O Corresponds to chip PB<4>. It is a GPIO port and can be used as PWM output for the LED driver.
7 GND P Ground pin.
0 SWS I/O Corresponds to chip SWS. Used for firmware flashing to Bluetooth chip.
00 C2 I/O Corresponds to chip PC<2>. It is a GPIO port and can be used as PWM output for the LED driver.
8 B7 I/O Corresponds to chip PB<7>. It is a serial receiver pin and can be used as a GPIO port.
9 RST I Corresponds to chip RESETB. It is the reset pin of the module, with a built-in pull-up resistor.
10 3V3 P Module power input pin.
11 B1 I/O Corresponds to chip PB<1>. It is a serial transmitter pin and can be used as a GPIO port.
12 GND P Ground pin.

P indicates the power pin, and I/O indicates the input and output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Min value Max value Unit
Ts Storage temperature -65 150 °C
VCC Supply voltage -0.3 3.9 V
Electrostatic discharge voltage (human body model) TAMB -25°C - 2 kV
Electrostatic discharge voltage (machine model) TAMB -25°C - 0.5 kV

Operating conditions

Parameter Description Min value Typical value Max value Unit
Ta Operating temperature -40 - 85 °C
VCC Operating voltage 3.0 3.3 3.6 V
VIL I/O low-level input VSS - VCC × 0.3 V
VIH I/O high-level input VCC × 0.7 - VCC V
VOL I/O low-level output VSS - VCC × 0.1 V
VOH I/O high-level output VCC × 0.9 - VCC V

Power consumption in working mode

Symbol Condition Typical value Peak value (Typical) Unit
Itx Continuous transmission, with an output power of 10 dBm 16.8 18.4 mA
Itx Continuous transmission, with an output power of 0 dBm 6.3 8.8 mA
Irx Continuous reception 6.3 8.9 mA
IDC Pairing mode 6.8 32 mA
IDC Connected mode 6.8 32 mA
Isleep Sleep mode 1.5 30 μA

RF parameters

Basic RF features

Parameter Description
Operating frequency 2.4 GHz ISM band
Wireless standard Bluetooth LE 5.0
Data transmission rate 1 Mbit/s and 2 Mbit/s
Antenna type Onboard PCB antenna

RF output power

Parameter Min value Typical value Max value Unit
RF average output power -22 10 10.5 dBm
Bandwidth of 20 dB modulation signal (1 Mbit/s) - 2500 - kHz
Bandwidth of 20 dB modulation signal (2 Mbit/s) - 2600 - kHz

RF receiving sensitivity

Parameter Min value Typical value Max value Unit
RX sensitivity at 1 Mbit/s - -94.5 - dBm
RX sensitivity at 2 Mbit/s - -90 - dBm
Frequency offset error at 1 Mbit/s -300 - +300 kHz
Frequency offset error at 2 Mbit/s -200 - +200 kHz
Co-channel interference suppression - -7 - dB

Antenna information

Antenna type

The BT5S module uses an onboard PCB antenna.

Antenna interference reduction

The distance between the antenna and other mental components should be at least 15 mm to provide the best radio performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded. Layout principles: No substrate medium exists directly below or above the PCB antenna. The PCB antenna is away from the copper sheet. This can maximize the radiation effect of the antenna.

BT5S Module DatasheetBT5S Module Datasheet BT5S Module DatasheetBT5S Module Datasheet

Packing and production instructions

Mechanical dimensions and backside pad dimensions

Mechanical dimensions

BT5S Module Datasheet

The default tolerance of the external dimensions of the module is ±0.35 mm, and the tolerance of key dimensions is ±0.1 mm. If you have special requirements for key dimensions, specify them in the datasheet after consultations.

Recommended footprint

BT5S Module Datasheet

The recommended pad size of pin 11 is smaller than that of other pin pads to prevent tin connection.

Production instructions

  1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

    • Instruments or devices required for the SMT process:
      • Surface mount system
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • AOI
    • Instruments or devices required for the baking process:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. A delivered module must meet the following storage requirements:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • A humidity indicator card (HIC) is put in the sealed package.

      BT5S Module Datasheet

  3. The module needs to be baked in the following cases:

    • The vacuum packaging bag is damaged before unpacking.
    • After unpacking, no HIC is found in the packaging bag.
    • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the first sealing of the bag.
  4. The baking parameter settings are described below:

    • Baking temperature: 60°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
    • Baking time: 48 hours for reel packaging and 12 hours for tray packaging.
    • Temperature for triggering an alert: 65°C for reel packaging and 135°C for tray packaging.
    • Production can begin after a module has cooled down to below 36°C under natural conditions.
    • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

BT5S Module Datasheet

  • A: temperature axis

  • B: time axis

  • C: alloy liquidus temperature from 217°C to 220°C

  • D: ramp-up slope from 1°C/s to 3°C/s

  • E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

  • F: temperature above liquidus temperature for 50s to 70s

  • G: peak temperature from 235°C to 245°C

  • H: ramp-down slope from 1°C/s to 4°C/s

    The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

BT5S Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging Modules per reel Reels per carton
BT5S 6,000 Tape and reel 1,500 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-BT5S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BT5S”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

BT5S Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at

BT5S Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.