BF6H-M Module Datasheet

BF6H-M is a low-power embedded Bluetooth audio module that Tuya has developed. It mainly consists of a highly integrated Bluetooth chip (FR8016HA) and a few peripheral circuits with the Bluetooth communication protocol stack and rich library functions inside.
Based on the support of the Bluetooth intelligent firmware and protocol stack of the Freqchip, BF6H-M is completely compatible with the Bluetooth protocol V5.0. Meanwhile, users can develop various application programs on the basis of the ARM Cortex M3 in the 32-bit high-performance single-chip microcomputer. In the BF6H-M, PMU (charger for lithium battery LDO), SPI flash ROM with the XIP mode, IIC, UART, GPIO, ADC, and PWM are integrated into one chip, to use less power and offer stable connection.

Product overview

BF6H-M includes an ARM Cortex M3 32-bit processor, a Bluetooth 5.0/2.4G radio, a 150-KB ROM, a 48-KB SRAM, and 15 reusable I/O ports.

Features

• ARM Cortex M3 32-bit processor
• Operating voltage: 1.8 to 4.3V
• Peripherals: 4 PWMs, 1 ADC, 3 GPIOs, 2 UARTs, 1 SPI, 1 MIC, and 1 speaker
• Support Li-Ion/Li-Polymer battery, programmable charging current, current up to 200mA for fast charging
• Bluetooth RF features:
  • Bluetooth LE 5.0
  • The RF data rate can be up to 2 Mbps.
  • TX power: +3 dBm
  • RX sensitivity: -93 dBm@ 1 Mbps
  • Support hardware encryption (AES/CCM)
  • PCB antenna with a gain of 3.37 dBi
  • Operating temperature: -20°C to +85°C

Applications

• Smart LED
• Smart home

Change history

Update date	Updated content	Version after update
02/14/2022	This is the first release.	V1.0.0
08/08/2024	Update descriptions for audio related	V1.0.1

Module interfaces

Dimensions and footprint

The dimensions of BF6H-M are 19±0.35 mm (L)×15.5±0.35 mm (W) ×2.5±0.15 mm (H). The thickness of the PCB is 0.8 ± 0.1 mm.

Pin definition

The definitions of pins are shown in the following table:

Pin number	Symbol	Pin type	Function
1	GND	P	Power supply reference ground
2	SDO	I/O	Common I/O interface, which can be used as SPOUT of the SPI port and corresponds to Pin 25 of the IC
3	SDI	I/O	Common I/O interface, which can be used as SPDIN of the SPI interface and corresponds to Pin 24 of the IC
4	SCK	I/O	Common I/O interface, which can be used as SPCLK of the SPI interface and corresponds to Pin 23 of the IC
5	CS	I/O	Common I/O interface, which can be used as SPCSN of the SPI interface and corresponds to Pin 26 of the IC
6	NC	/	Not connected
7	PA1	I/O	Common I/O interface, which corresponds to Pin 29 of the IC
8	PA0	I/O	Common I/O interface, which corresponds to Pin 30 of the IC
9	TX1	I/O	UART1_TX for transmitting data, which can also be reused a common I/O pin and corresponds to Pin 27 of the IC chip
10	RX1	I/O	UART1_RX for receiving data, which can also be reused a common I/O pin and corresponds to Pin 28 of the IC chip
11	PMW4	I/O	Common I/O interface, which can be used as PWM output of the LED drive and corresponds to Pin 1 of the IC
12	PMW5	I/O	Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P 2 of the IC
13	P26	I/O	Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P 32 of the IC
14	PMW1	I/O	Common I/O interface, which can be used as PWM output of the LED drive and corresponds to Pin 31 of the IC
15	NC	/	Not connected
16	VCHG	P	Charger, pin for charging, which corresponds to Pin 15 of the IC. It can be used to charge the external batteries
17	GND	P	Power supply reference ground
18	3V3	P	Power supply pin VCC (Typical value: 3.3V)
19	RXO	I/O	Serial port UART0_RX, which can be reused as a common I/O interface and corresponds to Pin 21 of the IC
20	TXO	I/O	Serial port UART0_TX, which can be reused as a common I/O interface and corresponds to Pin 20 of the IC. It can be used to output logs.
21	RST	I/O	Hardware reset pin (high active), correspond to Pin 14 of the IC
22	ADC	I/O	ADC port, 10 bit/s, which can be reused as a common I/O interface and corresponds to Pin 22 of the IC
23	MICB	AO	MIC_BIAS, microphone output, correspond to Pin 9 of the IC. The external microphone needs to be connected to a 2.2k resistor in series.
24	MIC	AI	MIC_IN, microphone input, correspond to Pin 10 of the IC. You should reserve an earth filter capacitor for the external microphone.
25	AN	AO	AOUT_N, audio differential output (negative), correspond to Pin 13 of the IC
26	NC	/	Not connected
27	AP	AO	AOUT_N, audio differential output (positive), correspond to Pin 12 of the IC
28	GND	P	Power supply reference ground

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	120	°C
I/O voltage	ALDO_OUT	1.6	3.3	V
VCC	Power supply voltage	1.8	4.3	V
ESD voltage (human body model)	TAMB-25°C	-	2	kV
ESD voltage (machine model)	TAMB-25°C	-	2	kV

Operating conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-20	-	85	°C
VCC	Operating voltage	1.8	3.3	4.3	V
VCHG	Voltage for charger	4.75	5	5.25	V
VIL	Voltage low input	-0.3	-	0.3* VDDIO	V
VIH	Voltage high input	0.7*VDDIO	-	VDDIO+0.3	V
VOL	Voltage low output	-	-	0.33	V
VOH	Voltage high output	1.8	-	-	V

Power consumption in operating mode

Symbol	Conditions	Maximum value (Typical value)	Unit
Itx	Constantly transmit with the output power of 3 dBm	16.4	mA
Irx	Constantly receive	18.2	mA
IDC	Average value in mesh networking state	6.4	mA
IDC	Peak value in mesh networking state	23.3	mA
Ideepsleep	Average value in deep sleep state	6.1	μA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.4 GHz ISM band
Wireless standard	Bluetooth LE 5.0
Data transmission rate	1 Mbps, 2 Mbps
Antenna type	PCB antenna

RF output power

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power	-20	3	-	dBm
Bandwidth of 20-dB modulation signal (1M)	-	2500	-	KHz

RF receiving sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
Receiving sensitivity 1 Mbps	-	-93	-	dBm
Frequency offset error 1 Mbps	-250	-	+300	KHz

Audio CODEC parameters

Digital to analog converter (single channel)

Parameter	Condition	Minimum value	Typical value	Maximum value	Unit
Conversion precision	-	-	-	16	Bits
Sampling rate (Fs)*	Synchronous clock signal	8	-	48	V
SNR	-		92		dB
Digital gain	1/48dB	-48	-	32	dB
Analog gain	3dB	0	-	30	dB
Full-scale output voltage	VDDA=2.9V	-	1500	-	mV
Stopband attenuation		65	-	-	V

Analog to digital converter (single channel)

Parameter	Condition	Minimum value	Typical value	Maximum value	Unit
Conversion precision	-	-	-	16	Bits
Sampling rate (Fs)*	Synchronous clock signal	8	-	48	V
SNR	Weighted/non-weighted	-	79	-	dB
Digital gain	1/48dB	-48	-	32	dB
Analog gain	3dB	0	-	30	dB

Antenna information

Antenna type

BF6H-M uses the PCB antenna with a gain of 3.37 dBi.

Interference reduction

To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When you design a finished product, please leave enough space for the antenna, which is shown below:

Packaging information and production instructions

Mechanical dimensions

The following is the schematic diagram of BF6H-M which shows how pins correspond to each other:

Recommended PCB footprint:

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
BF6H-M	4400	Tape reel	1100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-BF6H-M. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BF6H-M”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, under the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.