YLB1 Module Datasheet

Last Updated on : 2024-06-14 03:12:22download

YLB1 is a low-power-consumption embedded Bluetooth module developed by Tuya. It does not suppot the mesh technology and can only be connected to one device at a time. Embedded with the Bluetooth network communication protocol stack and rich library functions


YLB1 consists of a highly integrated Bluetooth chip (BK3432) and a few peripheral circuits. YLB1 further consists of a low-power 32-bit MCU, a Bluetooth 2.4G-radio, a 160-KB flash memory, and a 20-KB static random-access memory (SRAM).


  • Embedded low-power 32-bit MCU, which can also function as an application processor.
  • Built-in high-precision 10-bit ADC
  • Operating voltage: 1.61 to 3.6V
  • Support interfaces such as UART, GPIO, I2C, PWM, ADC, SPI and JTAG
  • Bluetooth RF features
    • Compatible with the Bluetooth 4.2
    • The RF data rate can be up to 1 Mbps.
    • TX power:+3 dBm
    • RX sensitivity: -92 dBm@Bluetooth 1 Mbps
    • Onboard PCB antenna with a gain of 0.2 dBi
    • Operating temperature: -20℃ to +85℃


  • Smart LED
  • Smart home
  • Health products

Module interfaces

Dimensions and package

YLB1 has 3 rows of pins with a spacing of 1.25 mm.
The YLB1 dimensions are 12±0.35 mm (W)×18±0.35 mm (L) ×2.8±0.15 mm (H). The thickness of the PCB is 0.8 mm±0.1 mm.

YLB1 Module Datasheet

YLB1 Module Datasheet

Pin definition

The definition of interface pins is shown in the following table:

Pin number Symbol Type Function
1, 3, 4, 9, 18, and 26 G P Power supply reference ground
2 ANT I/O Connected to the external antenna if needed
5 31 I/O Common I/O interface, which can work as ADC input and correspond to P<31> of the IC
6 32 I/O Common I/O interface, which can work as ADC input and correspond to P<32> of the IC
7 14 I/O Common I/O interface, which can output PWM as the drive of LED and correspond to P<14> of the IC
8 V P Power supply pin
10 RST I Reset pin, active low
11 TX1 I/O Common I/O interface, the interface for communication between UART_TXD1 and MCU
12 RX1 I/O Common I/O interface, the interface for communication between UART_RXD1 and MCU
13 17 I/O Common I/O interface, UART_RXD2. Correspond to P<17> of the IC
14 16 I/O Common I/O interface, UART_TXD2. Correspond to P<16> of the IC
15 13 I/O Common I/O interface, which can output PWM as the drive of LED and correspond to P<13> of the IC
16 33 I/O Common I/O interface, which can work as ADC input and correspond to P<33> of the IC
17 12 I/O Common I/O interface, which can output PWM as the drive of LED and correspond to P<12> of the IC
19 10 I/O Common I/O interface, which can output PWM as the drive of LED and correspond to P<10> of the IC
20 07 I/O Common I/O interface, PWM/SPI_NSS/JTAG_TMS. Correspond to P<07> of the IC
21 06 I/O Common I/O interface, SPI_MISO/PWM/JTAG_TCK. Correspond to P<06> of the IC
22 05 I/O Common I/O interface, SPI_MOSI/JTAG_TDO. Correspond to P<05> of the IC
23 04 I/O Common I/O interface, SPI_SCK/JTAG_TDI. Correspond to P<04> of the IC
24 03 I/O Common I/O interface, I2C_SDA/JTAG_NTRST. Correspond to P<03> of the IC
25 02 I/O Common I/O interface, I2C_SCL. Correspond to P<02> of the IC

Note: P indicates a power supply pin and I/O indicates an input/output pin. If you have your own requirements on the light color controlled by the PWM output, please contact your account manager in Tuya.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -65 150
VCC Supply voltage -0.9 3.6 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.2 KV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 - 85
VCC Operating voltage 1.61 3.3 3.6 V
VIL I/O low level input VSS - VSS+0.3 V
VIH I/O high level input VCC-0.3 - VCC+0.3 V
VOL I/O low level output VSS - VSS+0.3 V
VOH I/O high level output VCC-0. 3 - VCC V

Power consumption in working mode

Symbol Conditions Maximum value (typical value) Unit
Itx Constantly transmit, the output power of 3 dBm 22 mA
Irx Constantly receive 9 mA
IDC Average value under networking 2.6 mA
IDC Peak value under networking 3.4 mA
Ideepsleep Deep sleep mode 7 μA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.4 GHz ISM band
Wireless standard Bluetooth 4.2
Data transmission rate 1 Mbps
Antenna type Onboard PCB antenna

RF output power

Parameter Minimum value Typical value Maximum value Unit
Average RF output power -20 0 4 dBm
20 dB modulation signal bandwidth (1M) - 1000 - KHz

RF receiving sensitivity

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity 1 Mbps - -92 - dBm
Frequency offset 1 Mbps 115 - +300 KHz
Co-channel interference suppression - - 7 dB


Antenna type

YLB1 uses the onboard PCB antenna with a gain of 0.2 dBi.

Antenna interference reduction

To ensure RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap the surrounding of the antenna, the wireless signal will be greatly attenuated and the RF performance will deteriorate. When designing the finished product, please leave enough space for the antenna area.

YLB1 Module Datasheet

Packaging information and production instructions

Mechanical dimensions and dimensions of the back of the pad

YLB1 Module Datasheet

YLB1 Module Datasheet

YLB1 Module Datasheet

Recommended PCB footprint
YLB1 Module Datasheet

Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm.

Production instructions

  • The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT equipment:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Oven temperature tester
      • Automated optical inspection (AOI) equipment
    • Baking equipment:
      • Cabinet oven
      • Anti-static heat-resistant pallets
      • Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      YLB1 Module Datasheet
  • The module needs to be baked in the following cases:

    • Vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.

      Important: If a batch of modules is not baked within 168 hours, do not use wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

YLB1 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

YLB1 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method Number of modules per reel (pcs) Number of reels per carton (reel)
YLB1 4800 Tape reel 1200 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including this product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

YLB1 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

YLB1 Module Datasheet

This product must not be disposed of as normal household waste, following the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.