TYLC5 Module Datasheet

TYLC5 is a low-power embedded Wi-Fi module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless radio frequency chip, ESP8285, and a few peripheral devices. It also has a built-in Wi-Fi network protocol stack and abundant library functions. TYLC5 embeds a low-power 32-bit CPU, 1Mbyte of flash memory, 50KB of SRAM, and a wealth of peripheral resources.

Overview

As an RTOS platform, TYLC5 integrates all the function libraries of the Wi-Fi MAC and the TCP/IP protocol. Based on these function libraries, users can develop different embedded Wi-Fi products to meet their own needs.

Features

• The built-in low-power 32-bit CPU doubles as an application processor.
• The basic frequency of the CPU supports 80MHz and 160MHz.
• Working voltage: 3.0V-3.6V
• Peripheral: 3×GPIOs, 1×UART
• Wi-Fi connectivity:
  • 802.11 b/g/n
  • Channel: 1-14@2.4GHz(CH1-11 for US/CA, CH1-13 for EU/CN)
  • Supporting the security mode of WEP/WPA/WPA2/WPA2 PSK (AES)
  • Under the mode of 802.11b, the maximum output power: +20dBm
  • Supporting the operating mode of STA/AP/STA+AP
  • Supporting both Smart Config and AP network distribution methods (including Android and IOS devices)
  • Soldering external PCB antennas
  • Operating temperature: -40 ℃ to 105 ℃

Main application areas

• Intelligent building
• Smart home/ home appliances
• Smart socket, smart LED
• Industrial wireless control
• Baby monitor
• Webcam
• Smart bus

Module picture

• Front view:

  

• Negative view:

  

Module interface

Scale package

TYLC5 has 2 rows of pins with the pin pitch being 2mm.

The size of TYLC5: 8.5mm (W)×13.5mm (L) ×3mm (H). The dimensions of TYLC5 is shown in Figure2.

Pin definition

The definition of the interface pins is shown in Table 1.

Table 1 Description of TYLC5’s Interface Pin Arrangement

Pin No.	Symbol	IO Type	Function
1	ANT	-	RF antenna port, spot to solder external antennas
2	GND	P	Power reference point
3	GPIO12	I/O	GPIO_12
4	GPIO14	I/O	GPIO_14
5	GPIO4	I/O	GPIO_04
6	VCC	P	Power pin of the module (3.3V)

Note: P represents the power pin, and I/O represents the input and output pin.

Definition of the test points

The definition of the test pins is shown in Table 2.

Table 2 Description of TYLC5’s Test Pin Arrangement

Pin No.	Symbol	IO Type	Function
-	TP1	Rst	Hardware reset pin; Cannot clear the distribution network information of Wi-Fi.
-	TP 2	I/O	GPIO0;Testing the module production.
-	TP3	U0TXD	User serial port; Information output from the serial port can be used for testing the module production.
-	TP4	U0RXD	User serial port; Information output from the serial port can be used for testing the module production.

Electrical parameters

Absolute electrical parameters

Table 3 Absolute Parameters

Parameter	Description	Min	Max	Unit
Ts	Storage temperature	-40	125	℃
VCC	Supply voltage	-0.3	3.6	V
Electrostatic discharge voltage (Human body model)	TAMB-25℃	-	2	KV
Electrostatic discharge voltage (Machine model)	TAMB-25℃	-	0.5	KV

Operating conditions

Table 4 Conditions for Normal Operating

Parameter	Description	Min	Typical	Max	Unit
Ta	Operating temperature	-40	-	105	℃
VCC	Operating voltage	3.0	3.3	3.6	V
VIL	IO low-level input	-0.3	-	VCC*0.25	V
VIH	IO high-level input	VCC*0.75	-	VCC	V
VOL	IO low-level input	-	-	VCC*0.1	V
VoH	IO high-level input	VCC*0.8	-	VCC	V
Imax	IO drive current	-	-	12	mA

Power consumption of Wi-Fi transmission

Table 5 Power Consumption of Continuous TX Transmission

Symbol	Parameter			Typical	Unit
	Mode	Rate	Transmit power
IRF	11b	11Mbps	+17dBm	220	mA
IRF	11g	54Mbps	+15dBm	110	mA
IRF	11n	MCS7	+13dBm	100	mA

Power consumption of Wi-Fi reception

Table 6 Power Consumption of Continuous RX Reception

Symbol	Mode	Rate	Typical	Unit
IRF	11b	11Mbps	76	mA
IRF	11g	54Mbps	76	mA
IRF	11n	MCS7	76	mA

Power consumption in the working mode

Table 7 Working Current of TYLC5

Working Mode	Working State,Ta=25℃	Average	Max	Unit
Easy mode	Wi-Fi indicator flashes quickly.	80	415	mA
Hotspot mode	Wi-Fi indicator flashes slowly.	90	451	mA
Network connection	Wi-Fi indicator is always on.	58.5	411	mA
Network disconnection	Wi-Fi indicator is always off.	80	430	mA

Characteristics of radio frequency

Basic characteristics of radio frequency

Table 8 Basic Characteristics of Radio Frequency

Parameter	Description
Working frequency	2.412~2.484GHz
Wi-Fi standard	IEEE 802.11b/g/n(Channel 1-14)
Rate of data transmission	11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54(Mbps) 11n: HT20 MCS0-7
Type of antenna	External antenna soldered

Output power of Wi-Fi

Table 9 Power of Continuous TX Transmission

Parameter		Min	Typical	Max	Unit
Average output power of RF, 802.11b CCK Mode	1M	-	20	-	dBm
Average output power of RF, 802.11g OFDM Mode	54M	-	17	-	dBm
Average output power of RF, 802.11n OFDM Mode	MCS7	-	14	-	dBm
Frequency error	-	-10	-	10	ppm

Sensitivity of receiving Wi-Fi

Table 10 RX Sensitivity

Parameter		Min	Typical	Max	Unit
PER<8%, RX Sensitivity, 802.11b CCK Mode	1M	-	-91	-	dBm
PER<10%, RX Sensitivity, 802.11g OFDM Mode	54M	-	-75	-	dBm
PER<10%, RX Sensitivity, 802.11n OFDM Mode	MCS7	-	-72	-	dBm

Antennas

Type of antennas

They are external antennas soldered to the ANT pad of the module.

Reducing antenna interference

When an external antenna is soldered to the Wi-Fi module, to optimize the Wi-Fi performance, it is recommended that the distance between the antenna part and the other metal parts be at least 10 mm.

Packaging information and production guide

Mechanical dimensions

Recommended Package for PCB

Production instructions

• For the in-line module developed by Tuya, wave soldering equipment is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).

• Soldering equipment and materials:

  • Wave soldering equipment
  • Wave soldering fixture
  • Constant-temperature soldering iron
  • Tin bar, tin wire, and flux
  • Oven temperature tester

• Baking equipment:

  • Cabinet oven
  • Anti-static heat-resistant pallets
  • Anti-static heat-resistant gloves

• The module needs to be baked in the following cases:

  • The vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 40°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use a heat-resistant pallet rather than a plastic pallet)

  • Time: 168 hours for reelizing and 12 hours for palletizing

  • Alarm temperature: 50°C for reelizing and 135°C for palletizing

  • Production ready temperature after natural cooling: < 36°C

  • The number of drying times: 1

  • Re-baking requirement: If a module remains unused for 168 hours after being unpacked, it must be baked again.

    Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because the modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the quality of products, you must pay attention to the following items:

  • The amount of soldering flux.
  • The height of the wave peak.
  • Whether the tin slag and copper content in the wave soldering tank exceed standards.
  • Whether the window and thickness of the wave soldering fixture are appropriate.
  • Whether the wave soldering oven temperature curve is reasonable.

Recommended oven temperature curve and temperature

For oven temperature settings, refer to oven temperatures for wave soldering. The peak temperature is 260°C±5°C. The wave soldering temperature curve is shown below:

Recommended soldering temperature:

Recommended wave soldering oven temperature		Recommended manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module are as follows:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• The package contains a humidity indicator card (HIC).

  

  

MOQ and packing information

Product Model	MOQ (pcs)	Packing Method	Number of Modules in Each Reel Pack	Number of Reel Packs in Each Box
TYLC5	7200	Carrier tape and reel packing	1800	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYLC5. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYLC5”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.