ZN5 Module Datasheet

ZN5 is a low-power embedded Zigbee module that Tuya has developed. It consists of a highly integrated RF chip (JN5189) and several peripheral components.

Product overview

With an embedded network protocol stack and robust library functions. ZN5 is embedded with a low-power 32-bit CPU, 152 KB random-access memory (RAM), 640 KB flash memory, and extensive peripherals. You can develop embedded Zigbee products as required.

Features

• Embedded low-power 32-bit Arm Cortex-M4 processor, which provides digital signal processor (DSP) instructions and floating-point units (FPUs) and can also function as an application processor
• Clock rate: 48 MHz
• Operating voltage: 2.3 V to 3.6 V
• Peripherals: seven GPIOs and one universal asynchronous receiver/transmitter (UART)
• Zigbee features
  • 802.15.4 MAC/PHY
  • Working channels 11 to 26 at 2.400 GHz to 2.483 GHz; 250 kbit/s air interface rate
  • Embedded DC-DC circuit, maximizing the power efficiency
  • Maximum output power: +11 dBm
  • Runtime power consumption: 10 dBm/20.3 mA; current in sleep mode: 0.35 µA
  • Onboard PCB antenna with a gain of 1 dBi
  • Operating temperature: –40°C to +85°C
  • AES-128 or AES-256 hardware encryption

Application scenarios

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

ZN5 has two lines of pins, 14 in total, with a pin spacing of 2 mm.

The ZN5 dimensions 20.4±0.35 mm (L) × 14.8±0.35 mm (W) × 2.3±0.15 mm (H).

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	P3	I/O	Hardware PWM pin, which is connected to PIO3 (pin 6) on the internal IC
2	P4	I/O	Hardware PWM pin, which is connected to PIO4 (pin 7) on the internal IC
3	P16	I/O	SDA pin, which is connected to PIO16 (pin 19) on the internal IC
4	P15	I/O	SCL pin, which is connected to PIO15 (pin 18) on the internal IC
5	3V3	P	Power supply pin (3.3 V)
6	P7	I/O	Hardware PWM pin, which is connected to PIO7 (pin 10) on the internal IC
7	GND	P	Power supply reference ground pin
8	RX	I/O	UART0_RXD pin, which is connected to PIO9 (pin 12) on the internal IC
9	RST	I/O	Hardware reset pin, which is active at a low level and has been connected to a pull-up resistor
10	3V3	P	Power supply pin (3.3 V)
11	TX	I/O	UART0_TXD pin, which is connected to PIO8 (pin 11) on the internal IC
12	GND	P	Power supply reference ground pin
13	P6	I/O	Hardware PWM pin, which is connected to PIO6 (pin 9) on the internal IC
14	P5	I/O	ISP pin, which is connected to PIO5 (pin 8) on the internal IC

Note: P indicates a power supply pin, and I/O indicates an input/output pin.

Test pin definition

Pin No.	Symbol	I/O type	Function
N/A	TEST	I/O	Used for the module product test.

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–40	125	°C
VBAT	Power supply voltage	1.9	3.6	V
ESD voltage (human body model)	Tamb = 25°C	N/A	2	kV
ESD voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	–20	N/A	85	°C
VBAT	Power supply voltage	2.3	3.3	3.6	V
VIL	I/O low-level input	–0.3	N/A	VCC x 0.25	V
VIH	I/O high-level input	VCC x 0.75	N/A	VCC	V
VOL	I/O low-level output	N/A	N/A	VCC x 0.1	V
VOH	I/O high-level output	VCC x 0.8	N/A	VCC	V
Imax	I/O drive current	N/A	N/A	12	mA

Current consumption

Working status	Mode	Rate	TX Power/RX	Average value	Maximum value (Typical value)	Unit
TX	OQPSK	250 kbit/s	+10 dBm	6	38	mA
TX	OQPSK	250 kbit/s	0 dBm	18	34	mA
RX	OQPSK	250 kbit/s	–99 dBm	4	38	mA

Working current

Working mode	Working status (Ta = 25°C)	Average value	Maximum value (Typical value)	Unit
EZ	The module is in EZ mode.	3	34	mA
Connected	The module is connected to the network.	1	6	mA

RF features

Basic RF features

Parameter	Description
Working frequency	2.400 GHz to 2.483 GHz
Physical layer standard	IEEE 802.15.4
Data transmission rate	250 kbit/s
Antenna type	Onboard PCB antenna with a gain of 1 dBi
Line-of-sight transmission distance	> 120 m

TX performance

Continuous TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Maximum output power	N/A	+10	N/A	dBm
Minimum output power	N/A	–36	N/A	dBm
Output power adjustment step	N/A	0.5	1	dBm
Frequency error	–15	N/A	+15	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 10%, 250 kbit/s, OQPSK	N/A	–99	N/A	dBm

Antenna

Antenna type

By default, ZN5 uses an onboard PCB antenna.

Antenna interference reduction

To ensure optimal WiFi performance when the WiFi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area.

The main points of the layout:

1. Make sure that there is no substrate medium directly below or above the printed antenna.

2. Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.

   

   

   

   

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions (H x L x W) are 0.8±0.1 mm x 20.4±0.35 mm x 14.8±0.35 mm.

Side view

Schematic diagram of footprint

PCB footprint

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packing information

Product model	MOQ	Packing method	Number of modules in each reel pack	Number of reel packs in each box
ZN5	5200	Tape reel	1300	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZN5. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZN5”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.