Last Updated on : 2022-08-01 06:58:34download
ZPU is a Zigbee module developed by Tuya. It consists of a highly integrated RF processor chip (PHY6225) and a few peripheral circuits. ZPU has an embedded low-power 32-bit MCU, a 1 MB flash, a 64 KB static random-access memory (SRAM), and 18 I/O pins that support multiplexing.
ZPU enables you to build reliable Zigbee products based on your development requirements.
ZPU has 21 pins arranged in three rows with a spacing of 1.4±0.1 mm between pins on the two sides and a spacing of 1.8±0.1 mm between pins at the bottom.
The ZPU dimensions are 20.3±0.35 mm (L) × 15.8±0.35 mm (W) × 3.0±0.15 mm (H). The thickness of the PCB is 1.0±0.1 mm. The following figures show the dimensions and packaging design of the ZPU module.
The following table describes the interface pins.
|1||P16||I/O||Common I/O pin, which can be used as the SCK of the SPI and corresponds to P16 of the IC.|
|2||P7||I/O||Common I/O pin, which can be used as the MOSI of the SPI and corresponds to P7 of the IC.|
|3||P2||I/O||Common I/O pin, which corresponds to P2 of the IC.|
|4||P3||I/O||Common I/O pin, which corresponds to P3 of the IC.|
|5||P11||I/O||The pin for 12-bit ADCs, which can be reused as a common I/O pin and corresponds to P11 of the IC.|
|6||RXD2||I/O||The pin for
|7||TXD2||I/O||The pin for
|8||P26||I/O||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P26 of the IC.|
|9||P31||I/O||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P31 of the IC.|
|10||P32||I/O||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P32 of the IC.|
|11||P33||I/O||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P33 of the IC.|
|12||P34||I/O||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P34 of the IC.|
|13||GND||P||Common I/O pin, which can be used as the PWM output of the LED drive and corresponds to P26 of the IC.|
|14||VCC||P||Power supply pin (Typical value: 3.3 V).|
|17||P14||I/O||The pin for 12-bit ADCs, which can be reused as a common I/O pin and corresponds to P14 of the IC.|
|18||RST||I/O||Hardware reset pin (active at a low level), which corresponds to
|19||P17||I/O||Common I/O pin, which corresponds to P17 of the IC.|
|20||P20||I/O||Common I/O pin, which can be used as the MISO of the SPI and corresponds to P20 of the IC.|
|21||P18||I/O||Common I/O pin, which can be used as the CS of the SPI and corresponds to P18 of the IC.|
|Test point||TM||Input||Mode selection pin. In flashing mode, it is set to a high level. In other modes, it is set to a low level or disconnected.|
Pindicates a power supply pin. I/O indicates an input/output pin.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||-0.3||3.9||V|
|Static electricity voltage (human body model)||TAMB -25°C||-||2||kV|
|Static electricity voltage (machine model)||TAMB -25°C||-||0.5||kV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||I/O low-level input||VSS||-||VCC × 0.3||V|
|VIH||I/O high-level input||VCC × 0.7||-||VCC||V|
|VOL||I/O low-level output||VSS||-||VCC × 0.1||V|
|VOH||I/O high-level output||VCC × 0.9||-||VCC||V|
|Working status||Mode||Rate||Transmit power/Receive||Average value||Peak value (Typical value)||Unit|
|Transmit||-||250 kbit/s||+6 dBm||9.5||14||mA|
|Receive||-||250 kbit/s||Constantly receive||7.5||14||mA|
|Working mode||Working status (Ta = 25°C)||Average value||Peak value (Typical value)||Unit|
|Quick pairing state||The module is in the quick pairing state.||7.5||14||mA|
|Connected||The module is in the connected state.||7||14||mA|
|Weakly connected||The module is weakly connected.||9.5||21||mA|
|Deep sleep||The module is in deep sleep mode, with the 64 KB SRAM remaining active.||To be determined||To be determined||μA|
|Working frequency||2.405 to 2.480 GHz|
|Zigbee standard||IEEE 802.15.4|
|Data transmission rate||250 kbit/s|
|Antenna type||PCB antenna with a gain of 2.19 dBi|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Maximum output power (250 kbit/s)||-||6||-||dBm|
|Minimum output power (250 kbit/s)||-||-20||-||dBm|
|Output power adjustment step||-||2||-||dBm|
|Output spectrum adjacent-channel rejection ratio||-||-39||-||dBm|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Co-channel interference suppression||-||-10||-||dB|
ZPU uses a PCB antenna with a gain of 2.19 dBi.
To ensure the optimal RF performance, we recommend that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be greatly reduced, deteriorating the RF performance. During the finished product design, sufficient space needs to be reserved for the antenna.
ZPU schematic diagram and pin connection:
Recommended PCB footprint:
The default dimensional tolerance is ±0.35 mm and the critical tolerance is ±0.1 mm. If customers have specific requirements on key dimensions, these requirements should be made clear in the datasheet after communication with the customers.
For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard where the relative humidity is not greater than 10% or packaged again in vacuum with the exposure time recorded. The total exposure time cannot exceed 168 hours.
A delivered module must meet the following storage requirements:
The module needs to be baked in the following cases:
The baking parameter settings are described below:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering technique according to the process. For the SMT process, refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperature measurements. All the temperatures shown in this module datasheet are obtained through actual measurements.
Technique 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set the oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217°C to 220°C
D: Ramp-up slope: 1°C/s to 3°C/s
E: Duration of constant temperature: 60s to 120s. The range of constant temperature: 150°C to 200°C
F: Duration above the liquidus: 50s to 70s
G: Peak temperature: 235°C to 245°C
H: Ramp-down slope: 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the solder paste specifications.
Technique 2: Wave soldering process (Oven temperature curve of wave soldering)
Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
|Suggestions on oven temperature curve of wave soldering||Suggestions on manual soldering temperature|
|Preheat temperature||80°C to 130°C||Soldering temperature||360°C±20°C|
|Preheat time||75s to 100s||Soldering time||< 3s/point|
|Peak contact time||3s to 5s||N/A||N/A|
|Temperature of tin cylinder||260°C±5°C||N/A||N/A|
|Ramp-up slope||≤ 2°C/s||N/A||N/A|
|Ramp-down slope||≤ 6°C/s||N/A||N/A|
|Product model||MOQ (pcs)||Shipping packaging method||Number of modules per reel||Number of reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20 cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-ZPU. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZPU”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU Directive for Waste Electrical and Electronic Equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20 cm to the human body.
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