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WB1S Module Datasheet

Last Updated on : 2020-09-29 02:16:27download

Product overview

WB1S is a low-power embedded Wi-Fi+BLE dual-protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB1S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals.

WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • Clock rate: 120 MHz
  • Working voltage: 3.0 V to 3.6 V
  • Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)
  • Wi-Fi connectivity
    • 802.11b/g/n
    • Channels 1 to 14 at 2.4 GHz
    • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES) security modes
    • Up to +16 dBm output power in 802.11b mode
    • EZ net pairing mode for Android and iOS devices
    • On-board PCB antenna
    • Working temperature: –20°C to +85°C
  • BLE:
    • Support BLE (V4.2)
    • Maximum output power + 6dBm
    • On-board PCB antenna and external antenna IPEX connector

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Date Description Version after change
2019-11-22 This is the first release. 1.0.0

Module interfaces

Dimensions and footprint

WB1S has two rows of pins with a 2 mm pin spacing.

The WB1S dimensions (H x W x L) are 2.8 mm x 16 mm x 23.5 mm.

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

WB1S Module Datasheet

Interface pin definition

Pin No. Symbol I/O type Function
1 VCC P Power supply pin (3.3 V)
2 TXD1 I/O UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC
3 RXD1 I/O UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC
4 3V3 P Power supply pin (3.3 V)
5 GND P Power supply reference ground pin
6 P26 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P26 pin on the internal IC
7 P24 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P24 pin on the internal IC
8 TXD2 I/O UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC
9 P8 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P8 pin on the internal IC
10 P7 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P7 pin on the internal IC
11 RXD2 I/O UART0_RXD, which is used for displaying the module internal information and is connected to the P1 pin on the internal IC
12 P9 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P9 pin on the internal IC
13 P6 I/O Common I/O pin, which can be used as a hardware PWM pin and is connected to the P6 pin on the internal IC
14 GND P Power supply reference ground pin
15 GND P Power supply reference ground pin
16 CEN I Low-level reset, high-level active (internally pulled high) Docking IC-CEN
17 ADC3 AI ADC pin, which is connected to the P23 pin on the internal IC
18 GND P Power supply reference ground pin

Note:

  • P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
  • CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration.

Test pin definition

Pin No. Symbol I/O type Function
1 SO I/O Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC
2 SI I/O Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC
3 CS I/O Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC
4 SCK I/O Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature –40 150 °C
VCC Power supply voltage –0.3 3.6 V
Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV
Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV

Electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature –20 N/A 85 °C
VCC Power supply voltage 3.0 3.3 3.6 V
VIL I/O low-level input –0.3 N/A VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 N/A 3.6 V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VoH I/O high-level output VCC x 0.8 N/A VCC V
Imax I/O drive current N/A 6 15 mA

RF current consumption

Working status Mode Rate TX Power / Receiving Typical value Unit
TX 802.11b 11 Mbit/s +16 dBm 222 mA
802.11g 54 Mbit/s +14 dBm 195 mA
802.11n MCS7 +12 dBm 185 mA
RX 802.11b 11 Mbit/s Constant receiving 98 mA
802.11g 54 Mbit/s Constant receiving 98 mA
802.11n MCS7 Constant receiving 98 mA

Working current

Working mode Working status (Ta = 25°C) Average value Peak value*(Typical Value) Unit
Quick connection network status (Bluetooth network) The module is in the fast network configuration state, and the Wi-Fi indicator flashes quickly 100 260 mA
Fast connection network status (AP network configuration) The module is in the fast connection network configuration state, the Wi-Fi indicator flashes slowly 80 360 mA
Quick Connect Network Status (EZ Network) The module is in the fast network configuration state, and the Wi-Fi indicator flashes quickly 80 320 mA
Network connection idle state The module is connected to the network and the Wi-Fi indicator is always on 50 250 mA
Network connection operation status The module is connected to the network and the Wi-Fi indicator is always on 60 260 mA
Disconnected status Module is offline 105 250 mA

RF features

Basic RF features

Parameter Description
Frequency band 2.412 GHz to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
BLE standard BLE 4.2
Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7
Antenna type Onboard PCB antenna with a gain of 0.5 dBi

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 16 N/A dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14 N/A dBm
Average RF output power, 802.11n OFDM mode MCS7 N/A 13 N/A dBm
Frequency error –2 N/A +2 ppm
EVM under 802.11b CCK, 11 Mbit/s 16 dBm –18 dB
EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm –30 –29 –25 dB
EVM under 802.11n OFDM, MCS7, 13 dBm –31 –28 –27 dB

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s N/A –92 N/A dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A –75 N/A dBm
PER < 10%, 802.11n OFDM mode MCS7 N/A –68 N/A dBm
PER < 10%,BLE 1M NA –95 NA dBm

Antenna

Antenna type

The default method is a PCB onboard antenna

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions, as shown in the following figure

WB1S Module Datasheet

Antenna connector specifications

WB1S Module Datasheet

Packaging information and production instructions

Mechanical dimensions

WB1S Module Datasheet

WB1S Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Recommended PCB layout

WB1S Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Production instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.

    • SMT placement equipment
      • Reflow soldering machine
      • Automated optical inspection (AOI) equipment
      • Nozzle with a 6 mm to 8 mm diameter
    • Baking equipment
      • Cabinet oven
      • Anti-static heat-resistant trays
      • Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:

    • The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).

    WB1S Module Datasheet

  3. Bake a module based on HIC status as follows when you unpack the module package:

    • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    • If the 30% circle is pink, bake the module for 4 consecutive hours.
    • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings:

    • Baking temperature: 125±5°C
    • Alarm temperature: 130°C
    • SMT placement ready temperature after natural cooling: < 36°C
    • Number of drying times: 1
    • Rebaking condition: The module is not soldered within 12 hours after baking.
  5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245 ℃
.

WB1S Module Datasheet

Storage conditions

WB1S Module Datasheet

MOQ and packaging information

Product number MOQ(pcs) Shipping packaging method Modules per reel (pcs) Packaging reels per box (reels)
WB1S 4000 Tape reel 1000 4

Appendix: Statement

Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.
15.105 Information to the user.
(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination.

The firmware setting is not accessible by the end-user.

The end product must be labeled in a visible area with the following:

“Contains Transmitter Module2AFNL-BR3L”

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system, additional testing and equipment authorization may be required to operate simultaneously with other radio.

This LMA does not have RF shielding and is tested and approved as a standalone configuration, additional evaluation may be required for any system integrated this radio module.

Declaration of Conformity European notice

WB1S Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product complies with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.

EN 300 328 V2.1.1

EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1

EN 62311:2008

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

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