Docs

WB8P Module Datasheet

Last Updated on : 2020-09-09 10:49:51download

Product overview

WB8P is a low-power embedded WiFi+BT module that is developed by Tuya. It consists of a highly integrated wireless RF chip (BK7231T), a few peripherals, an embedded WiFi network protocol stack and varied library functions. WB8P has an embedded low-power 32-bit MCU, 2-MB flash memory, 256-KB static random-access memory (SRAM), and rich peripherals.

WB8P is an RTOS platform that integrates all function libraries of the WiFi MAC and TCP/IP protocols. You can develop embedded WiFi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • The clock rate: 120 MHz
  • Working voltage: 3.3±0.3V
  • Peripherals: 8 GPIOs
  • WiFi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 Ghz
    • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES) security modes
    • Up to +17 dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig and AP network configuration manners for Android and iOS devices
    • Onboard PCB antenna with a gain of 2.0 dBi
    • Working temperature: -40 to 105℃
  • BLE connectivity
    • Support the lower-power bluetooth (V4.2)
      -Maximum output power: +6dBmz
    • Onboard PCB antenna with a gain of 2.0 dBi

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Serial number Date Description Version after Update
1 1/21/2020 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

  • WB8P has a row of pins with a 1.27±0.1 mm pin spacing.

  • The WB8P dimensions are 16±0.35 mm (W)×24.8±0.35 mm (L) ×3.5±0.15 mm (H).

  • Diagram of dimensions of WB8P

    WB8P Module Datasheet

Pin definition

WB8P Module Datasheet

Definitions on interface pins are shown as belows:

Pin Number Symbol I/O Type Function
1 VCC P Power supply pin (3.3V)
2 GND P Ground pin
3 PWM1 I/O Support hardware PWM and correspond to P7 of IC
4 PWM2 I/O Support hardware PWM and correspond to P8 of IC
5 PWM3 I/O Support hardware PWM and correspond to P9 of IC
6 PWM4 I/O Support hardware PWM and correspond to P24 of IC
7 PWM5 I/O Support hardware PWM and correspond to P26 of IC
8 ADC AI ADC pin, which corresponds to P23 of IC
9 TXD1 I/O User-side serial interface UART_TX, which corresponds to P11 of IC
10 RXD1 I/O User-side serial interface UART_RX, which corresponds to P10 of IC

Note: P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input interfaces.

Definitions on test points

Pin number Symbol I/O type Function
TP6 U2_TXD I/O UART2_TX, LOG TX
TP2 F_SCK I/O In download mode, it is the flash download clock interface and corresponds to P 20 of IC
TP3 F_SCK I/O In download mode, it is the flash download command enabling interface and corresponds to P 21 of IC
TP4 F_SI I/O In download mode, it is the flash download data input interface and corresponds to P 22 of IC
TP5 F_SO I/O In download mode, it is the flash download data output interface and corresponds to P 23 of IC
TP7 U2_RXD I/O UART2_RX, LOG RX
TP8 CEN I/O Enabling pin of a chip

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VBAT Power supply voltage 3.0 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 105
VBAT Power supply voltage 3.0 3.3 3.6 V
VIL IO low-level input -0.3 - VCC*0.25 V
VIH IO high-level input VCC*0.75 - VCC V
VOL IO low-level output - - VCC*0.1 V
VOH IO high-level output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

TX and RX power consumption

Working Status Mode Rate Transmit Power/Receive Average value Peak value (Typical value)) Unit
Transmit 11 b 11 Mbps +17 dBm 290 351 mA
Transmit 11 g 54 Mbps +13.5 dBm 264 301 mA
Transmit 11 n MCS 7 +13 dBm 262 293 mA
Receive 11b 11 Mbps Constantly receive 98 103 mA
Receive 11g 54 Mbps Constantly receive 97 101 mA
Receive 11n MCS 7 Constantly receive 96 99 mA

Working current

Working mode Working status, Ta = 25℃ Average value Maximum value (Typical value) Unit
Quick connection network state (network configuration through bluetooth ) The module is in the fast network connection state and the WiFi indicator always flashes 83 297 mA
Hotspot network configuration state (network configuration through AP ) The module is in the hotspot network configuration state and the WiFi indicator flashes slowly 48.5 384 mA
Quick connection network state (network configuration through EZ) The module is in the fast network connection state and the WiFi indicator always flashes 81 298 mA
Network connection idle state The module is disconnected and the WiFi indicator is always on 43 306 mA
Network connection operation state The module is disconnected and the WiFi indicator is always on 48 342 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
WiFi standard IEEE 802.11 b/g/n (channels 1 to 14)
BLE standard low-power Bluetooth 4.2
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type PCB antenna with a gain of 2 dBi

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 16 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 12 - dBm
Frequency error -10 - 10 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -89 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -75 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -68 - dBm
PER<10%,RX sensitivity, BLE 1M - -95 - dBm

Antenna

Antenna type

WB8P uses only an onboard PCB antenna.

Antenna interference reduction

To ensure optimal WiFi performance when the WiFi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area.

For the antenna area of the PCB of the module, refer to Diagram of Mechanical Dimensions of WB8P.

WB8P Module Datasheet

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 16±0.35 mm (W)×24.8±0.35 mm (L) ×3.5±0.15 mm (H).

WB8P Module Datasheet

The schematic diagram of packaging

WB8P Module Datasheet

The diagram of PCB packaging

WB8P can be in the form of side insertion or pin header plug-in.

WB8P Module Datasheet

Production instructions

  1. Tuya’s stamp hole package module must be mounted by SMT machine within 24 hours after unpacking and programming of the firmware. Otherwise, it must be packaged again under vacuum. The module must be baked before mounting.

    • SMT equipment
      • Reflow soldering machine
      • Automated optical inspection (AOI) equipment
      • Nozzle with a 6 mm to 8 mm diameter
      • Baking equipment
    • Cabinet oven
      • Anti-static heat-resistant trays
      • Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
    • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).

    WB8P Module Datasheet

  3. Bake a module based on HIC status as follows when you unpack the module package:

    • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    • If the 30% circle is pink, bake the module for 4 consecutive hours.
    • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings.

    • Baking temperature: 125℃
    • Alarm temperature: 130℃
    • SMT ready temperature after natural cooling: < 36℃
    • The number of drying times: 1
    • Rebaking condition: The module is not soldered within 12 hours after baking
  5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized after more than 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences.

  6. Before SMT, take electrostatic discharge (ESD) protective measures.

  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before the first mounting to determine proper methods for controlling the oven temperature and attaching and placing components. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI.

Recommended oven temperature curve

Perform side insertion or SMT based on the following reflow oven temperature curve. The highest temperature is 245℃. The reflow temperature curve is shown as belows:

WB8P Module Datasheet

WB8P Module Datasheet

Storage conditions

WB8P Module Datasheet

MOQ and packaging information

Product number MOQ(pcs) Shipping packaging method Number of modules per reel (pcs) Number of reels per carton (reel)
WB8P 4000 Tape reel 1000 4

Appendix: Statement

Appendix: Statement

Federal Communications Commission (FCC) Declaration of Conformity

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Important Note

This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The warning in red font is only applicable to integrity modules. Restricted modules without antennas, with standard antenna interfaces and without shielding cover shall not be used.

This device have got a FCC ID: 2ANDL-WB8P. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB8P”.

This device is intended only for OEM integrators under the following conditions:

  • The antenna must be installed such that 20 cm is maintained between the antenna and users.
  • The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

The warning in blue font is applicable to restricted modules without antennas, with standard antenna interfaces and without shielding cover.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module get a FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

WB8P Module Datasheet

WB8P Module Datasheet

WB8P Module Datasheet

WB8P Module Datasheet

WB8P Module Datasheet

The device could be used with a separation distance of 20 cm to the human body.

The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. (For 5G Wi-Fi only)

WB8P Module Datasheet

Click for services and help