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LZ211-CN Module Datasheet

Last Updated on : 2021-11-12 01:57:09download

LZ211-CN is an LTE Cat.1+GNSS cellular positioning module that Tuya has developed. Built-in with the LTE CaT.1 network communication protocol stack, GNSS protocol, and rich library functions, it consists of a highly integrated LTE Cat.1 chip (UIS8910DM), a GNSS chip (UC6228CI), and a few peripheral circuits.

Product overview

LZ211-CN has a Cortex A5 processor, a Cat.1bis modem, and a GNSS signal receiver inside and is integrated with 64-MB flash memory and 128-MB SRAM. It supports interfaces including USB, UART, SDIO, SPI, I2C, I2S, and ADC. Besides, it also supports peripherals, such as display screen, camera, keyboard matrix, microphone, speaker, charging, MicroSD card, and USIM card.

Features

  • Cortex A5 processor and the clock rate of CPU: 500 MHz
  • Supply voltage:
    • Working voltage: 3.4 to 4.3 V
    • Typical working voltage: 3.8 V
  • SIM card: 1.8V/3V
  • Features of LTE Cat.1:
    ­ Frequency band
    • LTE-FDD: B1/B3/B5/B8
    • LTE-TDD: B34/38/39/40/41 (2535 to 2655 MHz)
    • Data rate
      • LTE-FDD: Max 10 Mbit/s (downlink)/Max 5 Mbit/s (uplink)
      • LTE-TDD: Max 8.2 Mbit/s (downlink)/Max 3.4 Mbit/s (uplink)
    • Transmit power: 23 ± 2 dBm
    • Receiving sensitivity: Less than -98 dBm
    • Antenna impedance 50Ω, an external antenna required
  • Bluetooth LE 4.2
  • Wi-Fi SCAN, support only the indoor positioning
  • Features of location engine:
    • 64-channel synchronous track
    • Hot start: <1.2s
    • Cold boot sensitivity: -145 dBm, and tracking sensitivity: -158 dBm
    • Data update rate: Max 10 Hz
  • Support GPS and BeiDou
    • Use the broad frequency band for RF and the central frequency for input signals is 1575 MHz.
    • Receive and track 1575.42 MHz L1 signals of the GPS
    • Receive and track 1561.098 MHz B1 signals of BeiDou
  • Interfaces:
    • 1 USB 2.0
    • 2 UARTs
    • 2 I2Cs
    • 1 PCM/I2S
    • 1 SDIO
    • 1 SPI
    • 3 ADC
    • 1 SPI FLASH
  • Peripherals:
    • SPI display screen with the resolution of QVGA 320x240 and 30 FPS
    • SPI/MIPI camera with 300,000 pixels
    • 4*5 keyboard matrix
    • 1 microphone
    • 1 speaker
    • MicroSD card
    • Charging
  • Normal working temperature: -30°C to +75℃ 1
  • Extended working temperature: -40°C to +85℃ 2
  • Support to upgrade firmware with the OTA technology

Note:
1 indicates that when the module is in the working temperature range, the performance related to the module meets the 3GPP standard.
2 indicates that when the module is in the working temperature range, the module can still work normally, but some RF indicators might slightly exceed the standard values in the 3GPP.

Applications

  • Smart health: Drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart armor monitoring, baby monitor, etc.
  • Smart city: Smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
  • Consumers: Wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets and vehicle rental), and payment/POS machines
  • Agricultural environment: Precision planting (environment parameters: water, temperature, sunshine, biocide and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
  • Logistics warehousing: Asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking.
  • Smart building: Access control, smart HVAC, smoke detection, fire detection, and elevator failure/repair
  • Manufacturing industry: Production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment, and predictive maintenance (home appliances, machinery, etc.)
  • Public utilities: Meter reading (water, gas, and electricity), intelligent water affairs (pipe network, leakage, and quality inspection), smart fire extinguisher, fire hydrant, etc.

Module interfaces

Pin distribution

LZ211-CN has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The diagram of correspondence between pin ID and pin name

LZ211-CN Module Datasheet

Pin definition

Pin number Pin name Signal type Description
1 WAKEUP_IN I Wakeup pin, used by the external device to wake up the module. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 10
2 AP_READY* I Used to detect the status of the processor. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 11.
3 WAKEUP_OUT* O Wakeup pin, used by the module to wake up the external device. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 5.
4 W_DISABLE_N* I Flight mode. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 8.
5 NET_MODE PI Used to indicate the network registration status. Flashing fast indicates “in the progress of searching for the network”. Flashing slowly indicates “already connected to the Tuya Cloud Platform”.
6 NET_STATUS* O Used to indicate the network running status. In OpenCPU mode, it can be used as GPIO 9.
7 VDD_EXT PO 1.8V. Offer a high level to the external GPIO. Not connected when it is not used.
8 GND - Ground
9 GND - Ground
10 USIM_GND - Ground
11 ISENSE I Used to detect the current for charging.
12 VBAT_SENSE I Used to detect the voltage of the battery. Try to get close to the positive of the battery as much as possible, and directly connect to the VBAT interface of the module when the battery is not used. Otherwise, the module will keep restarting.
13 USIM_DET I Used to detect the hot-swap of the USIM card. Pulled up externally to VDD_EXT when it is used. Not connected to anything when it is not used.
14 USIM_VDD PO Working voltage of the USIM card. The module automatically identifies whether the USIM card is 1.8 or 3.0V.
15 USIM_DATA I/O Data signal of the USIM card
16 USIM_CLK O Clock signal of the USIM card
17 USIM_RST O Reset signal of the USIM card
18 VDRV O Control signal of the charging circuit
19 GND - Ground
20 RESET_N I Reset signal, low active
21 PWRKEY I Power on or off, low active
22 GND - Ground
23 SD_INS_DET I Used to detect the SD card. In OpenCPU mode, it can be used as GPIO 7.
24 PCM_DIN I Used to input PCM voice data. In OpenCPU mode, it can be used as GPIO 2.
25 PCM_DOUT O Used to output PCM voice data. In OpenCPU mode, it can be used as GPIO 3.
26 PCM_SYNC I/O PCM voice synchronization signal. In OpenCPU mode, it can be used as GPIO 1.
27 PCM_CLK I/O PCM voice clock signal. In OpenCPU, it can be used as GPIO 0.
28 SD_DATA3 I Data 3 of the SD card. Reuse the Wi-Fi SDIO.
29 SD_DATA2 I Data 2 of the SD card. Reuse the Wi-Fi SDIO.
30 SD_DATA1 I Data 1 of the SD card. Reuse the Wi-Fi SDIO.
31 SD_DATA0 I Data 0 of the SD card. Reuse the Wi-Fi SDIO.
32 SD_CLK O Clock signal of the SD card. Reuse the Wi-Fi SDIO.
33 SD_CMD I/O Command of the SD card. Reuse the Wi-Fi SDIO.
34 VDD_SDIO PO Power supply of the SD card. Reuse the Wi-Fi SDIO.
35 ANT_BT/WIFI AI/O Bluetooth and Wi-Fi antenna
36 GND - Ground
37 SPI_CS_N I SPI chip selection
38 SPI_MOSI I SPI MOSI
39 SPI_MISO O SPI MISO
40 SPI_CLK O Clock signal of the SPI
41 I2C_SCL OD Clock signal of the I2C. In OpenCPU mode, it can be used as GPIO 14.
42 I2C_SDA OD Data signal of the I2C. In OpenCPU mode, it can be used as GPIO 15.
43 ADC2 AI Interface 2 for analog-to-digital conversion
44 ADC1 AI Interface 1 for analog-to-digital conversion
45 ADC0 AI Interface 0 for analog-to-digital conversion
46 GND - Ground
47 ANT_GNSS AI GNSS interface of an antenna
48 GND - Ground
49 ANT_MAIN AI/O Main antenna interface
50 to 54 GND - Ground
55 RESERVED - Reserved
56 GND - Ground
57 VBAT_RF P Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
58 VBAT_RF P Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
59 VBAT_BB P Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
60 VBAT_BB P Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
61 STATUS* O Internally used, not used by the external
62 UART1_RI* O Output of ring. In OpenCPU mode, it can be used as GPIO 12.
63 RESERVED63 O Reserved
64 UART1_CTS O UART1: Clean to send. In OpenCPU mode, it can be used as GPIO 18.
65 UART1_RTS I UART1: Request to send. In OpenCPU mode, it can be used as GPIO 19.
66 UART1_DTR* I UART1: Data terminal ready. It’s the sleep control pin.
67 UART1_TXD O UART1: Transmit data. Support the MCU connection.
68 UART1_RXD I UART1: Receive data. Support the MCU connection.
69 USB_DP I/O USB differential data plus. It supports the module burning and calibration.
70 USB_DM I/O USB differential data minus. It supports the module burning and calibration.
71 USB_VBUS PI Pin for plug-in detection
72 GND - Ground
73 SPK_P O Speaker (+)
74 SPK_N O Speaker (-)
75 MIC_P I Microphone (+)
76 GND - Ground
77 MIC_N I Microphone (-)
78 KEYIN1 I/O Key input 1
79 KEYIN2 I/O Key input 2
80 KEYIN3 I/O Key input 3
81 KEYIN4 I/O Key input 4
82 KEYIN5 I/O Key input 5
83 KEYOUT0 I/O Key output 0
84 KEYOUT1 I/O Key output 1
85 to 112 GND - Ground
113 KEYOUT2 I/O Key output 2
114 KEYOUT3 I/O Key output 3
115 USBBOOT I/O If you input 0 through the keyboard and pull the voltage to VDD_EXT before the module is powered on, the module will enter the USB download mode.
116 RESERVED116 - Reserved. Not connected to anything.
117 CLK26M_OUT O The output interface of the clock signal with the frequency of 26 MHz
118 RESERVED118 - Reserved. Not connected to anything.
119 LCD_FMARK O SPI LCD frame alignment signal
120 LCD_RSTB O SPI LCD reset signal
121 LCD_SEL O SPI LCD selection
122 LCD_CS O SPI LCD chip selection
123 LCD_CLK O SPI LCD clock signal
124 LCD_SDC O SPI LCD selection of data command
125 LCD_SIO O SPI LCD serial input/output
126 VDDLCD P External LCD power supply
127 PM_ENABLE O Enable the external power supply LDO. In OpenCPU mode, it can be used as GPIO 13.
128 VDDCAMA P Camera VCAMA power supply
129 CAM_PWDN IO Camera CAM_PWDN signal
130 CAM_SI1 I/O Camera CAM_SI1 signal
131 CAM_SI0 I/O Camera CAM_SI0 signal
132 CAM_RSTL I/O Camera CAM_RSTL signal
133 CAM_REFCLK O Camera CAM_REFCLK signal
134 CAM_SCK IO Camera CAM_SCK signal
135 UART2_RXD/WAKE_WLAN O Serial interface 2, used by the internal GPS, and not open to the external
136 UART2_TXD/WLAN_EN O Serial interface 2, used by the internal GPS, and not open to the external
137 UART3_RXD/KEYOUT4 I Serial interface 3: Receive data and reuse KEYOUT4.
138 UART3_TXD/KEYOUT5 O The serial interface 3: Transmit data and reuse KEYOUT5.
139 ZSP_UART_TXD/BT_EN O Used only by the internal GPS, and not open to the external
140 VDDCAMD P Camera VCAMD power supply
141 I2C2_SCL I/O I2C clock signal In OpenCPU mode, it can be used as GPIO 16.
142 I2C2_SDA IO I2C data signal In OpenCPU mode, it can be used as GPIO 17.
143 DBG_RXD I Debugging interface: The pin is used for receiving data.
144 DBG_TXD O Debugging interface: The pin is used for transmitting data.

Note: P indicates a power supply pin and I/O indicates an input/output pin. “*” indicates that the function is not supported currently.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 90
VBAT Supply voltage -0.3 4.6 V

ESD features

Location Air charge Contact charge
GND ±10 KV ±5 KV
Antenna interface ±8KV ±4KV
Other interfaces ±1 KV ±0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -30 - 75
Ta Extended working temperature -40 - 85
VBAT Working voltage 3.4 3.8 4.3 V

Direct-current parameters

1.8 V Digital I/O

Parameter Description Minimum value Typical value Maximum value Unit
VIL I/O low-level input - - 0.3*VCC V
VIH I/O high-level input 0.7*VCC - VCC V
VOL I/O low-level output - - 0.2*VCC V
VOH I/O high-level output 0.8*VCC - VCC V

Standby and transmission power consumption:

Working Mode Condition Average value Peak value (Typical value) Unit
Standby current LTE-TDD 5.2 - mA
Standby current LTE-FDD 3.4 - mA
Constantly transmit (23 dBm) LTE-TDD 300 600* mA
Constantly transmit (23 dBm) LTE-FDD 550 600* mA

Note: The 600-mA current is generated when the VBAT is in parallel connected to the 1000-uA capacitor. If there is no large capacitor, the peak current will be above 1A. So please pay attention to the power input.

RF parameters

Basic RF features

Parameter Description
LTE-FDD frequency band LTE-FDD: B1/B3/B5/B8
LTE-TDD frequency band LTE-TDD: B34/B38/B39/B40/B41
Wireless standard 3GPP R13
LTE-FDD rate LTE-FDD: Max 10 Mbps (downlink)/max 5 Mbps (uplink)
LTE-TDD rate LTE-TDD: Max 8.2 Mbps (downlink)/max 3.4 Mbps (uplink)
Antenna Characteristic impedance of 50 Ω

TX performance

TX performance

Frequency band Minimum value Maximum value Unit
LTE-FDD B1 <-39 23±2 dBm
LTE-FDD B3 <-39 23±2 dBm
LTE-FDD B5 <-39 23±2 dBm
LTE-FDD B8 <-39 23±2 dBm
LTE-TDD B34 <-39 23±2 dBm
LTE-TDD B38 <-39 23±2 dBm
LTE-TDD B39 <-39 23±2 dBm
LTE-TDD B40 <-39 23±2 dBm
LTE-FDD B41 <-39 23±2 dBm

RX performance

Receiving sensitivity:

Frequency band Typical value Unit
LTE-FDD B1 -98.5 dBm
LTE-FDD B3 -98 dBm
LTE-FDD B5 -98 dBm
LTE-FDD B8 -98.5 dBm
LTE-FDD B34 -100 dBm
LTE-FDD B38 -98.5 dBm
LTE-FDD B39 -100 dBm
LTE-FDD B40 -98.5 dBm
LTE-FDD B41 -98.5 dBm

GNSS performance parameters

Parameter Project conditions Indicator Unit
CN0 test value The signal strength of the stimulator: -130 dBm (AVG) 40±2 dBc
TTFF (static in the open environment) Cold boot/hot start/recapture 30/1.2/2 s
Sensitivity test Capture sensitivity/tracking sensitivity -145/-158 dBm
Positioning precision CEP50 in the static and open environment 2.5 m
Antenna type Antenna provided by the third party with the characteristic impedance of 50Ω

Antenna information

Antenna type

The module does not have its own onboard PCB antenna, and the third party needs to provide an antenna.

The antenna can be an external rod antenna, a spring antenna, an IPEX- FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

  • Rod antenna

    LZ211-CN Module Datasheet

  • FPC antenna

    LZ211-CN Module Datasheet

  • GPS antenna

    The active antenna can be used through the external power supply.

    LZ211-CN Module Datasheet

  • Ceramics GPS antenna

    LZ211-CN Module Datasheet

Antenna design requirements

  • Ensure that the characteristic impedance of the transmission line is 50Ω.
  • Since the antenna line loss needs to be less than 0.3 dB, keep the PCB trace as short as possible.
  • When designing the layout, you should choose the most direct and shortest route, to prevent from routing through layers or holes, and rectangles and sharp angles.
  • There is a good ground reference for the antenna, which stays away from other signal wires.
  • It is recommended that you use the complete ground plane as the ground reference.
  • Strengthen the connection between the ground around the antenna and the main ground.
  • It is recommended that the antenna be at least 10 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

LZ211-CN has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The dimensions of LZ211-CN are 29±0.35 mm (W)×32±0.35 mm (L)×2.4±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

Mechanical dimensions and dimensions of the back of the pad

LZ211-CN Module Datasheet LZ211-CN Module Datasheet

Note: The tolerance for the length and width of the module is ±0.35 mm, the height is ±0.15 mm, and the thickness is ±0.1 mm.

PCB footprint-SMT

LZ211-CN Module Datasheet

Suggestions on stencil aperture

  1. Thickness of stencil: Step stencils are preferred. The thickness of stencils for the module is 0.18-0.2 mm. The thickness of other positions is determined by the product design.
  2. Module LCC pin: The length of the stencil opening is 0.1mm inward and 1mm outward; in the width direction is 0.16mm (0.08mm on one side), and the length is 1.4mm (module pin length to prevent tin beads) and 0.2mm outward. (0.1mm on one side), extended length of 2mm (exposed to the area outside the bottom of the module pin, increase the amount of tin).
  3. Module LGA pin: The area of aperture is 60% of the area of the soldering pad. If a single aperture is too large, it can be separated by 0.3mm in the middle.

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      LZ211-CN Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months has passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

LZ211-CN Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

LZ211-CN Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Packing method Modules per reel Reels per carton
LZ211-CN 2800 Tape reel 700 4