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Last Updated on : 2022-04-25 03:02:34download
WB3S is a low-power embedded Wi-Fi+Bluetooth LE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.
WB3S contains a low-power 32-bit MCU, 1T1R WLAN module, 256-KB SRAM, 2 MB flash memory, and extensive peripherals.
WB3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
|Date||Change Description||Version After Change|
|2019-11-22||This is the first release.||1.0.0|
WB3S has two rows of pins with the spacing of 2 mm.
The WB3S dimensions (H x W x L) are 2.8 mm x 16 mm x 24 mm.
The default dimensional tolerance is ±0.35 mm. If the module is plugged vertically, the position tolerance is ±0.1 mm. The tolerance of the thickness of the board can be ±0.1 mm, and the tolerance of the shield case is ±0.15 mm.
|Pin No.||Symbol||I/O type||Function|
|1||CEN||I||Low-level reset, high-level active (internally pulled high) Docking IC-CEN|
|2||ADC3||AI||ADC pin, which is connected to the P23 pin on the internal IC|
|3||EN||Input||Enabling pin, which is internally pulled up and compatible with other module design|
|4||P14||I/O||Common GPIO, which is connected to the P14 pin on the internal IC|
|5||PWM5||I/O||GPIOP_26, which is connected to the P26 pin on the internal IC|
|6||PWM4||I/O||GPIOP_24, common GPIO, which is connected to the P24 pin on the internal IC|
|7||PWM0||I/O||GPIOP_6, which is connected to the P6 pin on the internal IC|
|8||VCC||P||Power supply pin (3.3 V)|
|9||GND||P||Power supply reference ground pin|
|10||PWM1||I/O||GPIOP_7, which is connected to the P7 pin on the internal IC|
|11||TXD2||I/O||UART2_TXD, which is used to display the internal information of the module and connected to the P0 on the internal IC. Unavailable to customers.|
|12||RXD2||I/O||UART2_RXD, which is used to display the internal information of the module and connected to the P1 on the internal IC. Unavailable to customers.|
|13||PWM3||I/O||GPIOP_9, common GPIO, which is connected to the P9 pin on the internal IC|
|14||PWM2||I/O||GPIOP_8, which is connected to the P8 pin on the internal IC|
|15||RXD1||I/O||UART1_RXD, which is used as a user-side serial interface pin and is connected to the P10 pin on the internal IC|
|16||TXD1||I/O||UART1_TXD, which is used as a user-side serial interface pin and is connected to the P11 pin on the internal IC|
|Pin No.||Symbol||I/O Type||Function|
|1||SO||I/O||Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC|
|2||SI||I/O||Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC|
|3||CS||I/O||Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC|
|4||SCK||I/O||Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC|
Note: Test pins are not recommended.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||–0.3||3.6||V|
|ESD voltage (human body model)||Tamb = 25°C||N/A||2||kV|
|ESD voltage (machine model)||Tamb = 25°C||N/A||0.5||kV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VCC||Power supply voltage||3.0||3.3||3.6||V|
|VIL||I/O low-level input||–0.3||N/A||VCC x 0.25||V|
|VIH||I/Ohigh-level input||VCC x 0.75||N/A||3.6||V|
|VOL||I/O low-level output||N/A||N/A||VCC x 0.1||V|
|VoH||I/O high-level output||VCC x 0.8||N/A||VCC||V|
|Imax||I/O drive current||N/A||6||15||mA|
|Working status||Mode||Rate||TX Power / Receiving||Typical value||Unit|
|TX||802.11b||11 Mbit/s||+16 dBm||222||mA|
|802.11g||54 Mbit/s||+14 dBm||195||mA|
|802.11n HT20||MCS7||+12 dBm||185||mA|
|RX||802.11b||11 Mbit/s||Constant receiving||98||mA|
|802.11g||54 Mbit/s||Constant receiving||98||mA|
|802.11n HT20||MCS7||Constant receiving||98||mA|
|Working ode||Working status (Ta = 25°C)||Average value||Peak value*(Typical value)||Unit|
|Quick connection network status (Bluetooth network)||The module is in the fast network configuration state, and the Wi-Fi indicator flashes quickly||100||260||mA|
|Fast connection network status (AP network configuration)||The module is in the fast connection network configuration state, the Wi-Fi indicator flashes slowly||70||305||mA|
|Quick Connect Network Status (EZ Network)||The module is in the fast network configuration state, and the Wi-Fi indicator flashes quickly||60||300||mA|
|No operation during connection||The module is connected to the network and the Wi-Fi indicator is always on||40||270||mA|
|Operation being performed during connection||The module is connected to the network and the Wi-Fi indicator is always on||50||280||mA|
|Disconnected||Module is offline||100||260||mA|
|Frequency band||2.412 GHz to 2.484 GHz|
|Wi-Fi standard||IEEE 802.11b/g/n (channels 1 to 14)|
|Bluetooth LE standard||Bluetooth LE 4.2|
|Data transmission rate||802.11b: 1, 2, 5.5, or 11 (Mbit/s)|
|802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)|
|802.11n: HT20 MCS0 to MCS7|
|Antenna type||Onboard PCB antenna with a gain of 1.5 dBi|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Average RF output power, 802.11b CCK mode 11 Mbit/s||N/A||16||N/A||dBm|
|Average RF output power, 802.11g OFDM mode 54 Mbit/s||N/A||14||N/A||dBm|
|Average RF output power, 802.11n OFDM mode MCS7||N/A||13||N/A||dBm|
|EVM under 802.11b CCK, 11 Mbit/s 16 dBm||–18||dB|
|EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm||–26||–27||–29||dB|
|EVM under 802.11n OFDM, MCS7, 13 dBm||–26||–27||–29||dB|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER < 8%, 802.11b CCK mode 1 Mbit/s||N/A||–92||N/A||dBm|
|PER < 10%, 802.11g OFDM mode 54 Mbit/s||N/A||–75||N/A||dBm|
|PER < 10%, 802.11n OFDM mode MCS7||N/A||–68||N/A||dBm|
|PER < 10%,Bluetooth LE 1M||NA||–95||NA||dBm|
WB3S uses an onboard PCB antenna, antenna gain 1.5dBi.
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions as shown in the following figure
WB3S does not use an antenna connector.
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
|Product model||MOQ (pcs)||Packing method||Modules per reel||Reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-WB3S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB3S”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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