WB8P Module Datasheet

WB8P is a low-power embedded Wi-Fi+Bluetooth module that is developed by Tuya. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated RF chip (BK7231T) and a few peripherals.

Overview

WB8P has an embedded low-power 32-bit MCU, 2-MB flash memory, 256-KB SRAM, and rich peripherals.
WB8P is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Clock rate: 120 MHz
• Working voltage: 3.3±0.3V
• Peripherals: 8 GPIOs
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1 to 14 at 2.4 Ghz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES),WPA3 security modes
  • Up to +16 dBm output power in 802.11b mode
  • Support STA/AP/STA+AP working mode
  • Support SmartConfig and AP network configuration manners for Android and iOS devices
  • Onboard PCB antenna with a gain of 2.0 dBi
  • Working temperature: -40 to 105℃
• Bluetooth connectivity
  • Support the Bluetooth LE 4.2
  • Maximum output power: +6 dBm
  • Onboard PCB antenna with a gain of 2.0 dBi

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WB8P has a line of pins with a spacing of 1.27±0.1 mm.

The WB8P dimensions are 16±0.35 mm (W)×24.8±0.35 mm (L) ×3.5±0.1 mm (H).

Diagram of dimensions of WB8P

Pin definition

Definitions of interface pins are shown below:

Pin number	Symbol	I/O type	Function
1	VCC	P	Power supply pin (3.3V)
2	GND	P	Ground pin
3	PWM1	I/O	Support hardware PWM and correspond to P7 of the IC
4	PWM2	I/O	Support hardware PWM and correspond to P8 of the IC
5	PWM3	I/O	Support hardware PWM and correspond to P9 of the IC
6	PWM4	I/O	Support hardware PWM and correspond to P24 of the IC
7	PWM5	I/O	Support hardware PWM and correspond to P26 of the IC
8	ADC	AI	ADC pin, which corresponds to P23 of the IC
9	TXD1	I/O	User-side serial interface UART_TX, which corresponds to P11 of the IC
10	RXD1	I/O	User-side serial interface UART_RX, which corresponds to P10 of the IC

Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input interface.

Definitions of test points

Pin number	Symbol	I/O type	Function
TP6	U2_TXD	I/O	UART2_TX, LOG TX
TP2	F_SCK	I/O	In download mode, it is the flash download clock interface and corresponds to P 20 of IC
TP3	F_SCK	I/O	In download mode, it is the flash download command enabling interface and corresponds to P 21 of IC
TP4	F_SI	I/O	In download mode, it is the flash download data input interface and corresponds to P 22 of IC
TP5	F_SO	I/O	In download mode, it is the flash download data output interface and corresponds to P 23 of IC
TP7	U2_RXD	I/O	UART2_RX, LOG RX
TP8	CEN	I/O	Enabling pin

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VBAT	Power supply voltage	3.0	3.6	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	-	105	℃
VBAT	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	VCC	V
VOL	I/O low-level output	-	-	VCC*0.1	V
VOH	I/O high-level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

TX and RX power consumption

Working status	Mode	Rate	Transmit Power/Receive	Average value	Peak value (Typical value)	Unit
Transmit	11 b	11 Mbps	+17 dBm	290	351	mA
Transmit	11 g	54 Mbps	+13.5 dBm	264	301	mA
Transmit	11 n	MCS 7	+13 dBm	262	293	mA
Receive	11b	11 Mbps	Constantly receive	98	103	mA
Receive	11g	54 Mbps	Constantly receive	97	101	mA
Receive	11n	MCS 7	Constantly receive	96	99	mA

Working current

Working mode	Working status, Ta = 25℃	Average value	Maximum value (Typical value)	Unit
Quick network connection state (Bluetooth )	The module is in the fast network connection state and the Wi-Fi indicator always flashes	83	297	mA
Hotspot network configuration state (AP )	The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly	48.5	384	mA
Quick network connection state (EZ)	The module is in the fast network connection state and the Wi-Fi indicator always flashes	81	298	mA
Idle state	The module is disconnected and the Wi-Fi indicator is always on	43	306	mA
Disconnected	The module is disconnected and the Wi-Fi indicator is always on	48	342	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.412 to 2.484 GHz
Wi-Fi standard	IEEE 802.11 b/g/n (channels 1 to 14)
Bluetooth standard	Bluetooth LE 4.2
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20 MCS 0 to 7
Antenna type	PCB antenna with a gain of 2 dBi

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	16	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	14	-	dBm
Average RF output power, 802.11n OFDM Mode MCS7	-	13	-	dBm
Frequency error	-10	-	10	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M	-	-89	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-68	-	dBm
PER<10%,RX sensitivity, Bluetooth LE 1M	-	-95	-	dBm

Antenna

Antenna type

WB8P uses only the onboard PCB antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area.

For the antenna area of the PCB of the module, refer to the diagram of the mechanical dimensions of WB8P.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 16±0.35 mm (W)×24.8±0.35 mm (L) ×1.2±0.12 mm (H).

Schematic diagram of footprint

Diagram of PCB footprint

WB8P can be packaged in the form of side-insertion or pin header.

Production instructions

1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • (SMT process) SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • (Wave soldering process) Wave soldering devices
     • Wave soldering equipment
     • Wave soldering fixture
     • Constant-temperature soldering iron
     • Tin bar, tin wire, and flux
     • Thermal profiler
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	Number of modules per reel	Number of reels per carton
WB8P	4400	Tape reel	1100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WB8P. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB8P”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.