English
English
简体中文
Contact Us
Register
Log In

Tuya IoT Development Platform

TYZS12 Module Datasheet

Last Updated on : 2023-01-10 07:12:20download

TYZS12 is a low power-consuming embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of the highly integrated wireless radio processor chip, EFR32MG13P732, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.

Overview

TYZS12 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources.

TYZS12 Module Datasheet

Features

  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor
  • Basic frequency: 40 MHz
  • Wide working voltage range: 2.2 V to 3.8 V
  • Peripherals: five GPIOs, one U RT, and one ADC
  • Zigbee features
    • 802.15.4 MAC/PHY
    • Working channel: channels 11 to 26 on 2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
    • Built-in DC-DC circuit, maximizing the power supply efficiency
    • Maximum output power: +19 dBm;
    • dynamic difference of output power: > 35 dB
    • Power consumption when TYZS12 is working: 63 μA/MHz;
    • current when TYZS12 is in sleep mode: 2.7 μA
    • Cooper antenna/Onboard PCB antenna
    • Working temperature: –40°C to +85°C
    • AES 128/256-based hardware encryption

Applications

  • Smart building
  • Smart home and household applications
  • Smart socket and lighting
  • Industrial wireless control
  • Health care and measurement
  • Asset tracing

Module interfaces

Dimensions and footprint

TYZS12 provides three rows of pins with a pin pitch of 2.0 mm.

Dimensions of TYZS12 are: 23±0.35 mm (W) x 15±0.35 mm (L) x 1.8±0.15 mm (H). Figure 2 shows the overall pin layout of TYZS12.

TYZS12 Module Datasheet

TYZS12 Module Datasheet

Pin definition

The following table describes the interface pins.

Pin No. Symbol I/O type Functions
1, 14, and 15 GND P Module reference ground pin
13, 16, 17, 18 NC N/A Unused pin
2 TXD O UART0_TXD
3 RXD I UART0_RXD
4 PWM3 I/O Light drive interface, which can be used a GPIO
5 PWM1 I/O Light drive interface, which can be used a GPIO
6 3.3 V P Power-supply pin of TYZS12 (typical power supply voltage: 3.3 V)
7 nRST I Hardware reset pin, and the chip is reset when the level is low. TYZS12 has a power-on reset function, and this pin may be unnecessary in the actual situation.
8 3.3 V P Power-supply pin of TYZS12 (typical power supply voltage: 3.3 V)
9 PWM2 I/O Light drive interface, which can be used a GPIO
10 GPIO2 I/O GPIO
11 GPIO0 I/O GPIO
12 ADC AI Interface 1 of the ADC, which is a 12-bit precision SAR analog-to-digital converter
TP1 SWDI O I/O JLINK SWDIO programming pin, which can also be used as a GPIO in common programs
TP2 SWCL K I/O JLINK SWCLK programming pin, which can also be used as a GPIO in common programs

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

  • nRST is the only module hardware reset pin, which cannot be used to clear the Zigbee network configuration.
  • nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected.
  • When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd which is configurable using the software.

Test pin definition

Pin No. Symbol I/O type Function
N/A N/A I Used for the module production test

Note: The test pin is not allowed to be used.

Electrical characteristics

Absolute electrical characteristics

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature –50 +150 °C
VCC Power-supply voltage –0.3 3.8 V
ESD voltage (human body model) Tamb –25°C N/A 2.5 kV
ESD voltage (machine model) Tamb –25°C N/A 0.5 kV

Electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature –40 N/A +85 °C
VCC Working voltage 1.8 3.3 3.8 V
VIL I/O low-level input –0.3 N/A VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 N/A VCC V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 N/A VCC V
Imax I/O drive current N/A N/A 12 mA

Zigbee TX power consumption

The following table describes the TX power consumption during constant emission.

Symbol Rate TX power Typical value Unit
IRF 250 kbit/s +19 dBm 120 mA
IRF 250 kbit/s +13 dBm 50 mA
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX power consumption

The following table describes the RX power consumption during constant receiving.

Symbol Rate Typical value Unit
IRF 250 kbit/s 8 mA

Note: When the UART is in the active state, the received current is 14 mA.

Power consumption in operating mode

The following table describes the TYZS12 working current.

Working mode Working status (Ta = 25°C) Average value Maximum value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is connected to the network. 3 5 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 3.5 6 μA

RF features

Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type Cooper antenna/External antenna used with the I-PEX connector
Line-of-sight transmission distance > 120 m

Zigbee output performance

The following table describes the TX continuous transmission performance.

Parameter Minimum value Typical value Maximum value Unit
Maximum output power N/A +19 N/A dBm
Minimum output power N/A –30 N/A dBm
Output power adjustment step N/A 0.5 1 dB
Frequency error –15 N/A +15 ppm
Output spectrum adjacent-channel rejection ratio –31 dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

Zigbee RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER < 10%, RX sensitivity, 250 kbit/s (OQPSK) N/A –101 N/A dBm

Antenna

Antenna types

By default, the copper column antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.

Antenna interference reduction

When you use a copper column antenna on a Zigbee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.

To prevent a negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.

Packaging information and production instructions

Mechanical dimensions

TYZS12 Module Datasheet

Recommended PCB encapsulation

TYZS12 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYZS12 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS12 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS12 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method Number of modules per reel Number of reels per carton
TYZS12 7200 Tape reel 1800 4