VWXR2-ES Module Datasheet

Product overview

Tuya IoT voice modulVWXR2-ES is an IoT application Wi-Fi module based on XR872AT and equipped with a voice wake-up-noise reduction algorithm. It supports WLAN 802.11 b/g/n + ARM Cortex-M4F, with built-in 416KB SRAM and 4MB PSRAM, matching Tuya cloud voice skills + Developer Platform, and can help customers realize voice portal empowerment of IoT products and deployment of distributed voice portals in the home environment.

Features

• Built-in low power 32-bit CPU, can also be used as a processor, with the main frequency of up to 380MHz.
• Operating voltage: 2.7-5.5 V
• Peripherals: 9*GPIO, 2*Uart, 2*ADC
• Antenna support: onboard + optional ipex
• Sampling rate: 16K/16bit
• Voice input: built-in 2 audio ADC, can directly simulate mic
• Audio output: 1
• On-board Audio Power Amplifier: Maximum Support for 2.6 W
• Recommended wake-up distance: < = 3m
• Recommended working floor noise: < = 60dbC
• Default voice skills: weather, encyclopedia, calendar, calculator, idioms, translation, default does not support music content on demand.

Main application fields

• Smart Home, Large and Small Household Appliances

• Voice Panel Switch

Module interface

Dimensional package

• VWXR2-ES has three rows of pins with a pin spacing of 1.5 mm.

• VWXR2-ES Size: 20±0.35mm (W) * 30±0.35mm (L) * 3.6±0.15 mm (H). The size diagram is shown in Figure:

  

Pin definitions

As shown in the following figure, M1 needs an external MIC and speaker to complete voice interaction, which is required by default for voice modules.

We recommend the following processing methods for some peripherals:

• Microphone (required): MIC pins are fixed and must be externally connected with two MICs. MIC spacing is recommended to be 40-80mm. TUYA technicians can be consulted for specific MIC specifications.

• Horn (optional): For customers who need sound interaction, M1 has a built-in power amplifier and decoder, and a 1-2.6 W horn can be externally connected according to requirements. If no horn is needed, the following light interaction mode can also be selected.

• Voice status indicator (optional): For customers who are cost-sensitive, cannot install speakers due to limited product space, or do not need voice feedback interaction, M1 also supports two-color indicator interaction, and users can not connect speakers or roots.

According to the feedback of the indicator light, the user is prompted for the result of voice control IoT.

The specific interface pins for M1 are shown in Table :

Pin sequence number	Functions	Description
1	GPIO	GPIOA0
2	GPIOA1
3	GPIOA2
4	GPIOA3
5	GPIOB16
6	GPIOB17（Default is Distribution Network & Wheat Prohibition Key）
11	RST	System Reset, Low Reset
12	PWM0	PWM dimming interface (default is voice status indicator, red is recommended)
13	PWM1	PWM dimming interface (default is voice status indicator, blue is recommended)
14	PWM3	PWM dimming interface
15	PWM5	PWM dimming interface
16	PWM6	PWM dimming interface
18	SPK+	SPK+
19	SPK-	SPK-
21	MIC1-	MIC1-
22	MIC1+	MIC1+
23	MIC2+	MIC2+
24	MIC2-	MIC2-
27	LOUT
28	SPK-EN
30	TWI0-SCL	I2C
31	TWI0-SDA
32	IR_RX	Infrared Receive Pin
33	IR_TX	Infrared emitting pin
34	UART0-TX	Log serial port
35	UART0-RX
36	ADC_CH5
37	ADC_CH0
38	UART1_RX
39	UART1_TX
7, 10, 17, 20, 25, 26, 29	GND	GND
8, 9	5V	5V power supply

Electrical parameters

Absolute electrical parameter

Parameters	Description	Minimum value	Maximum	Unit
Ts	Storage Temperature	-40	70	℃
VCC	Supply Voltage	3.3V	5.5	V
Electrostatic discharge voltage (mannequin)	TAMB-25℃	-	±2000	KV
Electrostatic discharge voltage (machine model)	TAMB-25℃	-	-	KV

Recommended Supply Voltage 5V

Working conditions

Parameters	Description	Minimum value	Typical Value	Maximum	Unit
Ta	Operating Temperature	-5	25	45	℃
VCC	Operating Voltage	3.3	5	5.5	V
Vil	IO Low Input	-0.3	-	1.32	V
Vih	IO High Input	2.06	-	3.6	V
Vol	IO Low Output	-0.3	-	0.4	V
Voh	IO High Output	2.9	-	3.6	V
Imax	IO Drive Current	-35	-	35	mA

Wi-Fi transmit power consumption

Wi-Fi TX	Parameters	Typical value	Unit
Mode	Rate	Transmit Power
	11b	11Mbps	17dBm	267.2	mA
	11g	54Mbps	15dBm	272.0	mA
	11n	MCS7	15dBm	246.0	mA

Note: V_BAT=3.6V，VDD_ANA=1.8V, internal TOP LDO supply。

Wi-Fi power consumption of the receiving

Wi-Fi RX	Parameter model rate	Typical value	Unit
ACTIVE	1M DSSS	72	mA
54M OFDM	84	mA
DEEP SLEEP	11b	55	mA
11g	-	mA

Note：V_BAT=3.6V

Power consumption in operating mode

Working mode	Working state, Ta=25℃, VCC=5V PA output power is 0.5W and SPK is 4 ohms	Mean	Maximum value	Unit
Fast connection network state	The module is in the state of fast connection distribution network	157	418.9	mA
Idle network connection status	The module is networked	88.2	288.6	mA
Voice-controlled state	The module is connected to the Internet while the voice wakes up	120	370	mA

RF characteristics

Basic RF characteristics

Parameters	Detailed instructions
Working frequency	2.400~2.484GHz
Wi-Fi standard	IEEE802.11b/g/n(channel 1-14)
Data transmission rate	11b:1,2,5.5,11(Mbps) 11g:6,9,12,18,24,36,48,54(Mbps) 11n:HT20MCS0~7
Type of antenna	PCB antenna

Wi-Fi output power (Continuous transmission power, V_BAT=5V)

Parameters	Minimum value	Typical value	Maximum value	Unit
RF Average output，802.11bCCKMode—11M	16	17	-	dBm
RF Average output，802.11gOFDMMode—54M	13	14.5	-	dBm
RF Average output，802.11nOFDMMode——MCS7	12	13.5	-	dBm
The frequency error	-20	-	20	ppm

Wi-Fi receiver sensitivity (VBAT=3.6V)

Parameters	Minimum value	Typical value	Maximum value	Unit
RF Average output，802.11bCCKMode—11M	-87.8	-89.8	-	dBm
RF Average output，802.11gOFDMMode—54M	-74.4	-76.4	-	dBm
RF Average output，802.11nOFDMMode—MCS7	-72.3	-74.3	-	dBm

Antenna

Type of antenna

The default PCB antenna for VWXR2-ES is the MIFA onboard antenna in the 2.4G Wi-Fi band with a gain of -0.25dBi.

Reduced antenna interference

In order to ensure the optimization of RF performance, it is recommended that the distance between the module antenna and other metal parts should be at least 15mm. Since M1 is used by the SMT process, it is pasted to the main control board and applied together with other components. Then the placement position and way of PCB antenna will directly affect RF performance. Here are the places we recommend and the places we don’t. It is recommended to use the placement position of scheme 1 and scheme 2.

The antenna is hollowed out outside the plate frame or near the antenna. The performance and individual module RF test performance is basically the same. If the design is limited, the PCB antenna must be placed on the bottom plate, you can refer to the placement method of plan 3. The antenna is in the plate frame, but there is no copper coating and wiring near the antenna. However, there is some loss of rf performance, which is about 1-2dbm attenuation. It is not recommended to use the placement position of plan 4, the antenna is in the plate frame, and the antenna is coated with copper or wire. The rf signal will be significantly attenuated.

• Scheme 1: the antenna is outside the frame.
• Scheme 2: the antenna is placed along the edge of the plate, and the bottom is hollowed out.

Scheme 3: the antenna is placed along the edge of the plate, and the bottom is not clad with copper Scheme 4: the antenna plate is placed in the frame, and the bottom is hollowed out.

PCB r### Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

temperature curve for wave soldering.

Storage conditions